半導體產業及製程
TSMC
FAB14
張永政
哪裡有IC的存在
Wireless Network
ADSL
Powerful
Computing
Power
New IT
哪裡有IC的存在
IC 製造的演進
真空管
(1895-1947)
電晶體
(William Shockley, John
Bardeen, Walter Brattain –
1947-1958 - Ge)
What is IC
I.C. is the short form for INTEGRATED
CIRCUIT.
In Wafer Fabrication, we are forming
hundreds or even thousands of I.C. on a
wafer (thin circular disc) of silicone.
D (Drain)
Gate Ox
Poly
S (Source)
Moore Law (1965)
The observation made in 1965 by Gordon Moore,
co-founder of Intel, that the number of transistors per
square inch on integrated circuits had doubled every year
since the integrated circuit was invented. Moore
predicted that this trend would continue for the
foreseeable future. In subsequent years, the pace slowed
down a bit, but data density has doubled approximately
every 18 months (1975), and this is the current definition
of Moore's Law, which Moore himself has blessed.
What is IC size
IC gate size
1 um = 10
-6
m
1 nm = 10
-3
um
頭髮直徑
= 50-100 um
Current minimum gate width = 14 nm
Minimum gate size = 2.35 * 10
–10
m
Foundry Growth Forecast
0% 5% 10% 15% 20% 25% 30% 35% 40% 1993 1995 1997 1999 2001 2003 2005 2007 2009 0 5 10 15 20 25 30 35 40 45 Source: Dataquest, TSMC C o n tr ib u ti o n R a te F o u n d ry S a le s $ B il lio n sFoundry Sales $B Foundry Contribution Rate in ICMarket
2002-2010 CAGR WW IC = 10% Foundry = 20%
Sales Trend
Year 2002 : $4.65 Billion 25% YoY growth US $ M0
1,000
2,000
3,000
4,000
5,000
6,000
'92
'93
'94
'95
'96
'97
'98
'99
'00
'01
'02
'02
‘
03
1H 03 $2.57 B 11.2% YoYTSMC Market Share Growth
Worldwide Dedicated Foundry Industry by Revenue
Source: Companies, TSMC
1Q03
$2.1 Billion
1Q03
$2.1 Billion
TSMC 53%
Chartered 6%
UMC 27%
Other 14%
2Q03
$2.6 Billion
2Q03
$2.6 Billion
TSMC 56%
Chartered 5%
UMC 27%
Other 12%
Sales Breakdown by Technology
0%
25%
50%
75%
100%
1Q02
2Q02
3Q02
4Q02
1Q03
Sales (NT$Bn)35.8
44.2
39.8
41.2
39.3
49.9
0.13u-0.15u 0.18u 0.25u 0.35u 0.50u+9
13
25
22
30
1
11
14
23
22
29
1
12
13
27
23
20
5
11
12
24
21
21
11
11
11
25
21
24
8
2Q03
9
9
20
24
21
17
TSMC Provides Broad Leading-edge
Technologies
Logic Processes to 90-nm
Mixed Signal Processes to 90-nm
SiGe BiCMOS Processes to 0.18-micron
Embedded High Density Memory to 90-nm
Embedded Non-Volatile Memory to
0.18-micron
Image Sensor Technology to 0.18-micron
High Voltage Processes to 0.25-micron
The R&D Investment Leader
R&D expense between 1992 and 1997 have not been restated under the current definition
R&D R&D US $ M CAGR ~ 32% 350 300 250 200 150 100 50 0 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 2002
Roadmap Leads ITRS
T
e
c
h
n
o
lo
g
y
G
e
n
e
ra
ti
o
n
(n
m
)
Year
99 100 130 180 250 97 01 03 05 07 09 65
99 ITRS (International Technology Roadmap for Semiconductors)
TSMC
00 ITRS
01 ITRS 90
How much semiconductor revenue
Worldwide semiconductor sales are expected to hit $237.1 bln in 2005, up
4.7% from $226.6 bln in 2004, according to iSuppli. The research company
previously had predicted 9.6% growth in semiconductor revenue in 2005
Fabless
Design House
Foundry
service
Assembly
Service
IDM
Design
Design
Manufacturing ManufacturingAssembly
Assembly
Test
Test
Design
Design
TSMC
TSMC
Assembly
Assembly
Test
Test
Sales
Sales
Sales
Sales
台積公司客戶
無晶圓廠之
專業設計公司
自有晶圓廠之
Global FABless Industry
IC industry
IDM
Design House
Foundry
Assembly
Test
System Integration
IC fabrication
Mask
Litho
Etch
Diff
CMP
TFE
C013 Cu process
introduction
Poly Pwell NAPT Nwell PAPT VTP Poly P SD P SD P SD NSD NSD NSD W ILD W W W Trench oxide IMD-1 W W W W Metal-1 Metal-2 Poly Pwell NAPT Nwell PAPT VTP Poly P SD P SD P SD NSD NSD NSD W ILD W W W Trench oxide IMD-1 W W W W Metal-1 Metal-2晶圓的尺寸 所代表的意義
6 inch
8 inch
12 inch
微米
0.13um
0.25um
1
um
= 0.000001 m = 1000
nm
柰米
0.13 um = 130 nm
100 um = 頭髮的寬度
S
距離
vs 電阻
時間
vs 速度
(1)
相同圖形
相同尺寸(面積)
, Die數
單位面積電容
(2)
儲存容量
TECH 所代表的意義
IC process 基本製程
黃光
薄膜
蝕刻
植入
光阻去除
流程
說明
圖釋
薄膜(Thin_film) 1.化學氣相沉積(CVD) 2.金屬濺鍍(PVD) 3.擴散(Diffusion) 黃光(PHOTO) 1.光罩(MASK) 2.光阻(Coater) 3.曝光(Exposure) 4.顯影(Development) 蝕刻(ETCH) 1.濕蝕刻(Wet-ETCH) 2.乾蝕刻(DRY-ETCH) 光阻去除(PR remove) 將光阻去除後就是我們所需的 圖形(PATTERN) FILM Wafer Wafer FILM Wafer 光阻 FILM Wafer 光阻 FILM Wafer 光罩Pwell NAPT Poly NSD NSD NSD W W W Trench oxide W W W
打地基
打地基
蓋高樓
蓋高樓
IC 的製程就如同人類建造高樓一樣 , 一層一層慢慢的搭建起來,首先在晶
片上鍍上一層薄膜
, 然後在黃光區曝出須要的圖形 , 接著再到蝕刻區將圖案刻薄
膜上
, 如此即結束一層的製程 , 而後再不斷的重覆以上的動作 , 直到全部的圖形都
堆壘在晶片上為止
, 通常一般的
IC 製程須要經過 15-20 層才能完成.
MEOX4_DP
PE-FSG
MEOX1_DP
PE-SN
MEOX2_DP
PE-FSG
MEOX3_DP
PE-SN
VACU1_PH
MEOX5_DP
PE-SION
VACU1_ET
MEOX5_PH
PR Coating
MEOX5_ET PEB
MEOX5_PH1
TRCH
MEOX5_ET1 TRCH
MEOX5_ET2 LRM
MECU1SPU SEED
MECU1_DP ECP
MECU1CMP
Dual Damascene Process
Dual Damascene Process
C013 Copper process
C013 Cu-FSG
HDP PSG SiN 300A W-Plug FSG 1.7KA (2.9KA) SiN 500A SiN 300A M1 (Cu) M1(2.6K) M2 (Cu) M2(3.5K) FSG 4.9KA FSG 2.3KA (4.2KA) Via1 SiN 500A SiN 300A M3 (Cu) M3(3.5K) FSG 4.9KA FSG 2.3KA (4.2KA) Via2 SiN 500A SiN 300A M8 (Cu) M8(9K) USG 7.2KAUSG 7.5KA (9.9KA)
Via7 SiN 300A FSG 2.3KA (4.2KA) SiN 500A SiN 750A M7(3.5K) 5.5KA 600A 900A 1200A 900A AlCu 12KA PESiN 6KA
PEOX 4KA 4KA
SiN 400A
(IMD7=6.5KA) for V7=0.36*0.36
C013 FSG
IT system in IC fabrication
MES
EEC
EC
SC
Engineering Chain (EC) Supply Chain (SC) e-Manufacturing Manufacturing Execution System (MES) Equipment Engineering System (EES) Internet Inter-Company Intra-Company產業活動
策略規劃
品
質
工
程
行
銷
工程與研發
生產規劃
廠區控制
(生產)工廠自動化
維修與服務
行
政
支
援
與
管
理
配
送
產業電子化活動
供應商之 供應商 供應商 顧客之 顧客 顧客 主企業 採購 生產 配銷 採購 生產 配銷 採購 生產 配銷 工程研發 工程研發 工程研發 行政支援 行政支援 行政支援 營業 營業 營業電子化應用系統
(I)
供應商之 供應商 供應商 顧客之 顧客 顧客 主企業 MESPES/CSM SCM PES/CSM MES SCM PES/CSM MES SCM CE/PDM CE/PDM CE/PDM ERP ERP ERP EC/QR EC/QR EC/QR
電子化應用系統
(II)
Supply Chain Management (SCM)
Procurement Execution
System (PES)
Enterprise Information Management (PIM)
Component & Supplier Management (CSM) Product Data Management (PDM) Enterprise Document Management (EDM) Engineering
CAD CAE CAPP
Manufacturing CAM MES MCS Quick Response (QR) e-Commerce (EC) Customer Relation Management (CRM)
Enterprise Resource Planning (ERP) Quick Response (QR) e-Commerce (EC) Customer Relation Management (CRM) Knowledge Management