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09-半導體產業及製程

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(1)

半導體產業及製程

TSMC

FAB14

張永政

(2)

哪裡有IC的存在

Wireless Network

ADSL

Powerful

Computing

Power

New IT

(3)

哪裡有IC的存在

(4)

IC 製造的演進

真空管

(1895-1947)

電晶體

(William Shockley, John

Bardeen, Walter Brattain –

1947-1958 - Ge)

(5)

What is IC

I.C. is the short form for INTEGRATED

CIRCUIT.

In Wafer Fabrication, we are forming

hundreds or even thousands of I.C. on a

wafer (thin circular disc) of silicone.

D (Drain)

Gate Ox

Poly

S (Source)

(6)

Moore Law (1965)

The observation made in 1965 by Gordon Moore,

co-founder of Intel, that the number of transistors per

square inch on integrated circuits had doubled every year

since the integrated circuit was invented. Moore

predicted that this trend would continue for the

foreseeable future. In subsequent years, the pace slowed

down a bit, but data density has doubled approximately

every 18 months (1975), and this is the current definition

of Moore's Law, which Moore himself has blessed.

(7)

What is IC size

(8)

IC gate size

1 um = 10

-6

m

1 nm = 10

-3

um

頭髮直徑

= 50-100 um

Current minimum gate width = 14 nm

Minimum gate size = 2.35 * 10

–10

m

(9)

Foundry Growth Forecast

0% 5% 10% 15% 20% 25% 30% 35% 40% 1993 1995 1997 1999 2001 2003 2005 2007 2009 0 5 10 15 20 25 30 35 40 45 Source: Dataquest, TSMC C o n tr ib u ti o n R a te F o u n d ry S a le s $ B il lio n s

Foundry Sales $B Foundry Contribution Rate in ICMarket

2002-2010 CAGR WW IC = 10% Foundry = 20%

(10)

Sales Trend

Year 2002 : $4.65 Billion 25% YoY growth US $ M

0

1,000

2,000

3,000

4,000

5,000

6,000

'92

'93

'94

'95

'96

'97

'98

'99

'00

'01

'02

'02

03

1H 03 $2.57 B 11.2% YoY

(11)

TSMC Market Share Growth

Worldwide Dedicated Foundry Industry by Revenue

Source: Companies, TSMC

1Q03

$2.1 Billion

1Q03

$2.1 Billion

TSMC 53%

Chartered 6%

UMC 27%

Other 14%

2Q03

$2.6 Billion

2Q03

$2.6 Billion

TSMC 56%

Chartered 5%

UMC 27%

Other 12%

(12)

Sales Breakdown by Technology

0%

25%

50%

75%

100%

1Q02

2Q02

3Q02

4Q02

1Q03

Sales (NT$Bn)

35.8

44.2

39.8

41.2

39.3

49.9

0.13u-0.15u 0.18u 0.25u 0.35u 0.50u+

9

13

25

22

30

1

11

14

23

22

29

1

12

13

27

23

20

5

11

12

24

21

21

11

11

11

25

21

24

8

2Q03

9

9

20

24

21

17

(13)

TSMC Provides Broad Leading-edge

Technologies

Logic Processes to 90-nm

Mixed Signal Processes to 90-nm

SiGe BiCMOS Processes to 0.18-micron

Embedded High Density Memory to 90-nm

Embedded Non-Volatile Memory to

0.18-micron

Image Sensor Technology to 0.18-micron

High Voltage Processes to 0.25-micron

(14)

The R&D Investment Leader

R&D expense between 1992 and 1997 have not been restated under the current definition

R&D R&D US $ M CAGR ~ 32% 350 300 250 200 150 100 50 0 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 2002

(15)

Roadmap Leads ITRS

T

e

c

h

n

o

lo

g

y

G

e

n

e

ra

ti

o

n

(n

m

)

Year

99 100 130 180 250 97 01 03 05 07 09 65

99 ITRS (International Technology Roadmap for Semiconductors)

TSMC

00 ITRS

01 ITRS 90

(16)

How much semiconductor revenue

Worldwide semiconductor sales are expected to hit $237.1 bln in 2005, up

4.7% from $226.6 bln in 2004, according to iSuppli. The research company

previously had predicted 9.6% growth in semiconductor revenue in 2005

(17)
(18)

Fabless

Design House

Foundry

service

Assembly

Service

IDM

Design

Design

Manufacturing Manufacturing

Assembly

Assembly

Test

Test

Design

Design

TSMC

TSMC

Assembly

Assembly

Test

Test

Sales

Sales

Sales

Sales

(19)

台積公司客戶

無晶圓廠之

專業設計公司

自有晶圓廠之

(20)
(21)

Global FABless Industry

(22)
(23)

IC industry

IDM

Design House

Foundry

Assembly

Test

System Integration

(24)

IC fabrication

Mask

Litho

Etch

Diff

CMP

TFE

(25)

C013 Cu process

introduction

Poly Pwell NAPT Nwell PAPT VTP Poly P SD P SD P SD NSD NSD NSD W ILD W W W Trench oxide IMD-1 W W W W Metal-1 Metal-2 Poly Pwell NAPT Nwell PAPT VTP Poly P SD P SD P SD NSD NSD NSD W ILD W W W Trench oxide IMD-1 W W W W Metal-1 Metal-2

(26)

晶圓的尺寸 所代表的意義

6 inch

8 inch

12 inch

(27)

微米

0.13um

0.25um

1

um

= 0.000001 m = 1000

nm

柰米

0.13 um = 130 nm

100 um = 頭髮的寬度

S

距離

vs 電阻

時間

vs 速度

(1)

相同圖形

相同尺寸(面積)

, Die數

單位面積電容

(2)

儲存容量

TECH 所代表的意義

(28)

IC process 基本製程

黃光

薄膜

蝕刻

植入

光阻去除

流程

說明

圖釋

薄膜(Thin_film) 1.化學氣相沉積(CVD) 2.金屬濺鍍(PVD) 3.擴散(Diffusion) 黃光(PHOTO) 1.光罩(MASK) 2.光阻(Coater) 3.曝光(Exposure) 4.顯影(Development) 蝕刻(ETCH) 1.濕蝕刻(Wet-ETCH) 2.乾蝕刻(DRY-ETCH) 光阻去除(PR remove) 將光阻去除後就是我們所需的 圖形(PATTERN) FILM Wafer Wafer FILM Wafer 光阻 FILM Wafer 光阻 FILM Wafer 光罩

(29)
(30)

Pwell NAPT Poly NSD NSD NSD W W W Trench oxide W W W

打地基

打地基

蓋高樓

蓋高樓

IC 的製程就如同人類建造高樓一樣 , 一層一層慢慢的搭建起來,首先在晶

片上鍍上一層薄膜

, 然後在黃光區曝出須要的圖形 , 接著再到蝕刻區將圖案刻薄

膜上

, 如此即結束一層的製程 , 而後再不斷的重覆以上的動作 , 直到全部的圖形都

堆壘在晶片上為止

, 通常一般的

IC 製程須要經過 15-20 層才能完成.

(31)

MEOX4_DP

PE-FSG

MEOX1_DP

PE-SN

MEOX2_DP

PE-FSG

MEOX3_DP

PE-SN

VACU1_PH

MEOX5_DP

PE-SION

VACU1_ET

MEOX5_PH

PR Coating

MEOX5_ET PEB

MEOX5_PH1

TRCH

MEOX5_ET1 TRCH

MEOX5_ET2 LRM

MECU1SPU SEED

MECU1_DP ECP

MECU1CMP

Dual Damascene Process

Dual Damascene Process

C013 Copper process

(32)

C013 Cu-FSG

HDP PSG SiN 300A W-Plug FSG 1.7KA (2.9KA) SiN 500A SiN 300A M1 (Cu) M1(2.6K) M2 (Cu) M2(3.5K) FSG 4.9KA FSG 2.3KA (4.2KA) Via1 SiN 500A SiN 300A M3 (Cu) M3(3.5K) FSG 4.9KA FSG 2.3KA (4.2KA) Via2 SiN 500A SiN 300A M8 (Cu) M8(9K) USG 7.2KA

USG 7.5KA (9.9KA)

Via7 SiN 300A FSG 2.3KA (4.2KA) SiN 500A SiN 750A M7(3.5K) 5.5KA 600A 900A 1200A 900A AlCu 12KA PESiN 6KA

PEOX 4KA 4KA

SiN 400A

(IMD7=6.5KA) for V7=0.36*0.36

(33)

C013 FSG

(34)

IT system in IC fabrication

MES

EEC

EC

SC

Engineering Chain (EC) Supply Chain (SC) e-Manufacturing Manufacturing Execution System (MES) Equipment Engineering System (EES) Internet Inter-Company Intra-Company

(35)

產業活動

策略規劃

工程與研發

生產規劃

廠區控制

(生產)工廠自動化

維修與服務

(36)

產業電子化活動

供應商之 供應商 供應商 顧客之 顧客 顧客 主企業 採購 生產 配銷 採購 生產 配銷 採購 生產 配銷 工程研發 工程研發 工程研發 行政支援 行政支援 行政支援 營業 營業 營業

(37)

電子化應用系統

(I)

供應商之 供應商 供應商 顧客之 顧客 顧客 主企業 MES

PES/CSM SCM PES/CSM MES SCM PES/CSM MES SCM CE/PDM CE/PDM CE/PDM ERP ERP ERP EC/QR EC/QR EC/QR

(38)

電子化應用系統

(II)

Supply Chain Management (SCM)

Procurement Execution

System (PES)

Enterprise Information Management (PIM)

Component & Supplier Management (CSM) Product Data Management (PDM) Enterprise Document Management (EDM) Engineering

CAD CAE CAPP

Manufacturing CAM MES MCS Quick Response (QR) e-Commerce (EC) Customer Relation Management (CRM)

Enterprise Resource Planning (ERP) Quick Response (QR) e-Commerce (EC) Customer Relation Management (CRM) Knowledge Management

(39)

供應鏈管理

供應鏈管理

SCM

SCM

顧客關係管理

顧客關係管理

CRM

CRM

企業智財BIC /

企業資源規劃

企業資源規劃

ERP

ERP

EC Platform / WEB Application Server/ Application Server

EC Platform / WEB Application Server/ Application Server

電子商務平台

電子商務平台

/網站應用程式伺服軟體

/

網站應用程式伺服軟體

/應用程式伺服軟體

/

應用程式伺服軟體

基礎發展環境

基礎發展環境

供應面

需求面

知識管理KM

工程資料管理

PDM

工程資料管理

工程資料管理

PDM

PDM

製造執行系統

MES

製造執行系統

製造執行系統

MES

MES

電子化應用系統

(III)

參考文獻

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