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焦耳熱效應對覆晶銲錫電遷移可靠度之影響

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Figure 1. A schematic diagram of a flip chip package on a FR4 board. [2]
Figure 2. Cross-sectional schematic diagram of a solder joint in IBM’s C-4 structure. [2]
Figure 3.  Solder self-alignment process
Figure 4. A sketch of electromigration effect in an Al line 。[3]
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