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晶片黏貼技術應用於三/五族化合物半導體元件效率提升之研究

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Figure  2.6:  Schematic  diagram  of  MBRCLEDs  fabrication:  (1)  The  conventional  RCLEDs  structure
Figure 2.7: The OM figures of three different light emission window sizes of 84, 60 and 40  µm
Figure 2.8: The typical light intensity-current-voltage (L-I-V) characteristics of 84, 60, and 40  µm aperture size RCLEDs
Figure 2.9: The wall-plug efficiency and output power characteristics of 84 µm devices with  epoxy encapsulated
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