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Cu 5μm 與 Cu 5μm╱Ni 3μm 金屬墊層覆晶銲錫凸塊之電遷移研究

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國 立 交 通 大 學

工學院半導體材料與製程設備學程

碩士論文

Cu 5μm 與 Cu 5μm/Ni 3μm 金屬墊層覆晶銲錫凸塊

之電遷移研究

Study of Electromigration for Flip-Chip Solder Bumps

with Cu 5μm and Cu 5μm/Ni 3μm UBM

研 究 生:張志忠

指導教授:陳 智 教授

吳樸偉 教授

(2)

Cu 5μm 與 Cu 5μm/Ni 3μm 金屬墊層覆晶銲錫凸塊之電遷移研究 Study of Electromigration for Flip-Chip Solder Bumps

with Cu 5μm and Cu 5μm/Ni 3μm UBM

研 究 生: 張志忠 Student:Chih Chung Chang 指導教授: 陳 智 Advisor:Dr. Chih Chen 吳樸偉 Dr. Pu-Wei Wu

國立交通大學

工學院半導體材料與製程設備學程

碩士論文

A Thesis

Submitted to Department of Materials Science and Engineering College of Engineering

National Chiao Tung University in partial Fulfillment of the Requirements

for the Degree of Master in

Program of Semiconductor Material and Processing Equipment March 2010

Hsinchu, Taiwan, Republic of China

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