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Failure Probability Estimation of Anisotropic Conductive Film Packages With Asymmetric Upper-to-Lower Pad Size and Misalignment Offset

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Academic year: 2021

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Fig. 1. Schematic illustration showing the use of ACF in COG and COF packaging.
Fig. 4. Schematic illustrations of (a) symmetric and (b) asymmetric upper/
Fig. 17. Variation of minimum failure probability with D p as function of (E x , E y ).

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