應用物件導向技術及智慧型計算建構半導體製程之最佳化品質控制系統-以化學機械研 磨為例
黃寶賢、葉進儀
E-mail: 9127945@mail.dyu.edu.tw
摘 要
本研究提出一個可用於半導體製程的run-to-run(R2R)多輸入多輸出控制器，此控制器名為智慧型計算品質控制
器(Computational Intelligence Quality Controller，CIQC)，其中遞迴估計技術用來估計Hammerstein類型模式的線上參數，
而實數型基因演算法(Real-Valued Genetic Algorithm，RVGA)則用來獲得下一次執行的最佳解，基因演算法乃藉著達爾文的 進化論所發展而來，其操作過程包括選擇(selection)、複製(reproduction)、交配(crossover)和突變(mutation)。R2R控制器的系 統分析與設計使用統一模式語言(Unified Modeling Language，UML)，而CIQC的軟體實作則使用MATLAB，因為它具有許 多有用的工具及可建構簡單及友善的使用者操作介面。 在測試方面，以SEMATECH所提供的實際製程設備模式為基礎的 化學機械研磨製程來作為模擬的對象，經由實驗結果顯示在不同大小干擾與偏移的存在下，即使輸入-輸出轉換函數為非 線性的狀態時，CIQC系統能保持適應性的反應控制，而且可以提供優於OAQC系統的效能。
關鍵詞 : R2R 控制器，統一模式語言，實數型基因演算法，化學機械研磨 目錄
第一章緒論--P1 1.1 研究背景--P1 1.2 研究動機--P2 1.3 研究目的--P4 1.4 論文架構-P4 第二章文獻回顧--P6 2.1 SPC/EPC 的 整合探討--P6 2.2 製程最佳化與控制--P7 2.3 R2R 控制--P8 2.4 R2R 控制器應用於半導體製程--P10 2.5 智慧型計算--P12 第三 章研究方法--P16 3.1 自調適控制於R2R製程--P16 3.1.1 製程模式--P16 3.1.2 控制行為--P18 3.1.3 遞迴最小平方演算法--P20 3.2 智慧型計算品質控制器--P21 3.3 系統識別對象的建立--P22 3.4 多變量遞迴最小平方演算法--P24 3.5 非線性最佳化--P25 3.5.1 參數設定--P27 3.5.2 創造初始母體--P29 3.5.3 計算適應函數與適應值--P29 3.5.4 複製--P30 3.5.5 交配--P32 3.5.6 突 變--P33 3.5.7 取代--P33 3.5.8 終止條件--P34 3.6 實驗設計--P34 3.7 物件導向分析與設計--P35 3.7.1 統一模式語言--P35 3.7.2 需求階段--P36 3.7.3 分析與設計階段--P42 3.7.4 實作階段--P52 3.7.5 測試階段--P52 3.8 系統與方法的整合--P52 第四章模擬 結果與分析--P54 4.1 化學機械研磨製程--P54 4.2 效能衡量--P55 4.3 參數選定--P56 4.4 比較分析--P57 4.4.1 製程控制分析－
文獻方面--P57 4.4.2 製程控制分析－實務方面--P61 第五章結論與建議--P68 5.1 結論--P68 5.2 建議與未來研究方向--P69 參 考文獻--P71 附錄A--P76
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