doi:10.6342/NTU201600721
V
成功製造出上閘極二硫化鉬電晶體,其電子遷移率為 0.13 cm 2 V -1 s -1 。在二硫化鉬
薄膜轉印至二氧化矽/矽基板後,二硫化鉬雙閘極電晶體亦被製作用來比較上下閘 極的差異。下閘極電晶體在原子層沉積氧化層後,元件特性大幅提升的現象亦被 觀察到,電子遷移率由 0.0097 cm 2 V -1 s -1 提升至 0.045 cm 2 V -1 s -1 ,接著進行上閘極金 屬蒸鍍製程做成雙閘極電晶體,發現下閘極電晶體的電子遷移率顯著上升,我們 推測乃因鍍金屬時的熱能使得氧化層中的氧原子與二硫化鉬形成導電度較佳的氧 化鉬,因而提升載子遷移律。由載子遷移率可觀察需轉印之上閘極二硫化鉬電晶 體的部分較免轉印的二硫化鉬電晶體低,由此可知免轉印電晶體可免於轉印時造 成的污染而有著更加的電晶體表現。
Our recent works have shown that an improved “high-yellow” phenyl-substituted poly- (paraphenylenevinylene) copolymer (HY-PPV) based polymer light emitting diode can be constructed by u[r]
A Thesis Submitted to Department of Electronics College of Electrical Engineering and Computer Science National Chiao Tung University in partial Fulfillment of the Requirements for the D[r]