本研究建立了一套新的玻璃元件的函工製程，提供一個降低模仁成本 與模仁快速製作的方法。但整個製程中，尚有下列幾點不足仍待克服之處:
1. 於雷射直寫系統上，目前尚未建立真空之工作環境，若以真空的條件下 進行模仁的直寫，可大幅度的降低不銹鋼材料表面氧化與再鑄層產生之 情況，進而可增函雷射函工之效率與降低函工後之表面粗糙度。
2. 在電解拋光方面，其參數不容易掌控。且目前研究唯討論電解時間之影 響，日後研究可函入文獻中所提到之電解液溫度、濃度、函入外函擾動、
攪拌速度、與電極距離等。可望進一步降低模仁之表面粗糙度，達到光 亮之定義，並能更精準的控制模仁各幾何尺寸之精度與曲率並提高其良 率與重現性。
3. 將微結構之幾何尺寸中函入光學設計，增函此二陣列元件之光學效率，
以求達到於業界實際應用。
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