第五章 結論與未來展望
5.2 未來展望
本研究利用特殊界面活性劑添加於熱電材料鍍液中，以電化學沉積方式電 鑄 n-type Bi-Te 及 p-type Sb-Te 熱電材料，藉由平行線量測法已成功量測出電化 學沉積的熱電材料之熱傳導係數，但在添加界面活性劑 MA 的 Sb-Te 熱電材料，
因其表面粗糙度較差，導致在量測過程中發現，量測數據跳動幅度過大之現象。
微致冷晶片的研製部份，由於去除上電極底部的光阻結構較為困難，日後可利 用其他的製程方法，並發展較為簡易的製程，完成微致冷晶片的製作。最後，
針對實驗過程中所遭遇之問題，歸納出下列幾點建議：
1. 開發其他量測熱傳導係數的方法，對於表面粗糙度較高及鑄層厚度較厚的 電化學沉積薄膜，發展新的量測方式。
2. 以退火的方式提高熱電材料本身的熱電特性，探討熱電材料在不同的退火 環境下，對其熱電性能之影響。
3. 進行奈米顆粒的複合電鑄，藉由添加奈米顆粒粉末提升材料的熱電特性，
探討其熱電特性之影響。
4. 三元化合物之複合電鑄，以添加第三種氧化化合物的方式進行熱電材料的 電鑄，並探討對其熱電性能之影響。
5. 簡化微致冷晶片所需製程，使其達到更好的製造良率及致冷性能。
6. 發展具有高深寬比結構的微致冷晶片，藉由特殊結構的設計提升致冷性能。
參考文獻
1. Microsoft, http://www.microsoft.com.
2. 楊啟榮 等人, "微機電系統技術與應用", 精密儀器發展中心, 第四章, pp.
142, 2003.
3. 朱旭山, "熱電材料與元件之發展與應用", 工業材料雜誌, 第220期, 2005.
4. http://www.marlow.com/
5. http://www.sii.co.jp/
6. S. Wu, J. Mai, Y. C. Tai, and C. M. Hod, "Micro heat exchanger by using MEMS impinging jets", IEEE, pp. 171-176, 1999.
7. J. M. koo, L. Jiang, L. Zhang, P. Zhou, S. S. Banerjee, T. W. Kenny, J. G.
Santiago, and K. E. Goodson, "Modeling of two-phase microchannel heat sinks for VISI chips", IEEE, pp. 422-426, 2001.
8. C. Tsia, R. L. Chen, C. L. Chen, and J. Denatale, "Micromachined stack component for miniature thermoacoustic refrigerator", IEEE, pp 149-151, 2002.
9. C. H. Amon, J. Murthy, S. C. Yao, S. Narnmanchi, C. F. Wu, and C. C. Hsieh,
"MEMS-enable thermal management of high-heat-flux devices EDIFICE:
embedded droplet impingement for integrated cooling of electronics", Experimental Thermal and Fluid Science, Vol. 25, pp. 231-242, 2001.
10. 周政泰 等人, "微冷卻技術發展現況", 機械工業雜誌, 第 245 期, 2005.
11. Y. Avenas, M. Ivanova, N. Popova, C. Schaeffer, and J. L. Schanen, "Thermal analysis of thermal spreaders used in power electics cooling", IEEE, Vol. 1, pp.
216-221, 2002.
12. J. Kim, and E. Golliher, "Steady State Model of a Micro Loop Heat Pipe", IEEE, pp. 137-144, 2002.
13. R. Schweickart, L. Ottenstein, B. Cullimore, C. Egan, and Dave Wolf, "Testing of a controller for a hybrid capillary pumped loop thermal control system", IEEE, pp. 69-74, 1989.
14. D. M. Rowe, "Thermoelectrics handbook micro to nano", 2006.
15. D. J. Yao, "In-plane MEMS thermoelectric microcooler", Ph. D. dissertation of UCLA, USA, 2001.
16. 簡恆傑, "微尺度薄膜熱傳導性能量測方法", 工業材料雜誌, 第 247 期, 2007.
17. K. E. Goodson, and M. I. Flik, "Solid layer thermal conductivity measurement techniques", Appl. Mech. Rev., Vol. 47, pp. 101-112, 1994.
18. D. G. Cahill, "Heat transport in dielectric thin films and at solid-solid interfaces", Nanoscale and Microscale Thermophysical Engineering, Vol. 1, pp. 85-108, 1997.
19. A. J. Ångström, "Neue methode, das wärmeleitungsvermögen der körper zu bestimmen", Annalen der Physik, Vol. 114, pp. 513-530, 1861.
20. T. Yao, "Thermal properties of AlAs/GaAs superlattices", Appl. Phys. Lett., Vol.
51, No. 30, pp. 1798-1800, 1987.
21. G. Chen, C. L. Tien, X. Wu, and J. S. Smith, "Thermal diffusivity measurement of GaAs/AlGaAs thin-film structures", Journal of Heat Transfer, Vol. 116, pp.
325-331, 1994.
22. E. Jansen, and E. Obermeier, "Thermal conductivity measurements on thin films based on micromechanical devices", J. Micromech. Microeng., Vol. 6, pp.
118-121, 1996.
23. O. W. Käding, H. Shurk, and K. E. Goodson, "Thermal conduction in metallized silicon-dioxide layers on silicon", Appl, Phys. Lett., Vol. 65, pp. 1629-1631, 1994.
24. D. G. Cahill, "Thermal conductivity measurements from 30K-750K: The 3 omega method", Rev. Sci. Instrum., Vol. 61, pp. 802-808, 1990.
25. N. O. Birge, and S. R. Nagel, "Wide-Frequency specific heat spectrometer", Rev.
Sci. Instrum., Vol. 58, pp. 1464-1470, 1987.
26. A. Borshchevsky, "Handbook of thermoelectrics", 1995.
27. O. Yamashita, S. Tomiyoshi, and K. Makita, "Bismuth telluride compounds with high thermoelectric figures of merit", Journal of Applied Physics, Vol. 93, Issue 1, January 1, pp. 368-374, 2003.
28. D. B. Hyun, J. S. Hwang, B. C. You, T. S. Oh, and C. W. Hwang,
"Thermoelectric properties of the n-type 85 % Bi2Te3-15 % Bi2Se3 alloys doped with Sbl3 and CuBr", Journal of Materials Science, Vol. 33, pp. 5595-5600, 1998.
29. http://www.alexandrite.cc/
30. L. D. Ivanova, Y. V. Granatkina, N. V. Polikarpova, and E. I. Smirnova,
"Selenium-doped Sb2Te3-Bi2Te3 crystals", Inorganic Materials Vol. 33, pp.
558-561, 1997.
31. L. D. Ivanova, Y. V. Granatkina, and N. V. Polikarpova, "Properties of single-crystal in the Sb2Te3-Bi2Te3 solid solution system", Inorganic Materials, Vol. 31, pp. 678-681, 1995.
32. L. D. Ivanova, S. A. Brovikova, H. Sussmann, and P. Reinshaus, "Effect of growth-conditions on the homogeneity of Bi0.5Sb1.5Te3 single-crystals", Inorganic Materials, Vol. 31, pp. 682-686, 1995.
33. http://www.substech.com/dokuwiki/doku.php?id=advertising_opportunities 34. D. B. Hyun, J. S. Hwang, J. D. Shim, and T. S. Oh,"Thermoelectric properties of
(Bi0.25Sb0.75)2Te3 alloys fabricated by hot-pressing method", Journal of Materials Science Vol. 36, Number 5, pp. 1285-1291, 2001.
35. B. Wölfing, C. Kloc, J. Teubner, and E. Bucher, "High performance thermoelectric Tl9BiTe6 with an extremely low thermal conductivity", Physical Review Letters Vol. 86, Issue 19, pp. 4350-4353, 2001.
36. http://www.substech.com/dokuwiki/doku.php
37. R. Venkatasubramanian, E. Siivola, T. Colpitts, and B. O'Quinn, "Thin-film thermoelectric devices with high room-temperature figures of merit", Nature Vol.
413, pp. 597-602, 2001.
38. J. Seo, K. Park, D. Lee, and C. Lee, "Microstructure and thermoelectric properties of p-type Bi0.5Sb0.5Te0.5 compounds fabricated by hot pressing and hot extrusion", Scripta Materialia, Vol. 38, Issue 3, pp. 477-484, 1998.
39. http://www.kompas.or.kr/mail/200311/equip.html
40. J. Jiang, L. Chen, S. Bai, Q. Yao, and Q. Wang, "Thermoelectric properties of textured p-type (Bi,Sb)2Te3 fabricated by spark plasma sintering", Scripta Materialia, Vol. 52, Issue 5, pp. 347-351, 2005.
41. L. W. da Silva, M. Kaviany, and C. Uher, "Thermoelectric performance of films in the bismuth-tellurium and antimony-tellurium systems", Journal of Applied Physics, Vol. 97, pp. 114903.1-114903.10, 2005.
42. L. M. Goncalves, J. G. Rocha, C. Couto, P. Alpuim, and J. H. Correia, "On-chip array of thermoelectric Peltier microcoolers", 14th International Conference on Solid-State Sensors, Actuators and Microsystems, pp. 2179-2182, 2007.
43. D. H. Kim, E. Byon, G. H. Lee, and S. Cho, "Effect of deposition temperature on the structural and thermoelectric properties of bismuth telluride thin films grown by co-sputtering", Thin Solid Films Vol. 510, pp. 148-153, 2006.
44. http://upload.wikimedia.org/wikipedia/en/9/98/GenericMOCVD.
45. A. Boulouz, S. Chakraborty, A. Giani, F. P. Delannoy, and A. Boyer, "Transport properties of V-VI semiconducting thermoelectric BiSbTe alloy thin films and their application to micromodule Peltier devices", Journal of Applied Physics Vol. 89, No. 9, pp. 5009-5014, 2001.
46. A. Giani, A. Boulouz, F. P. Delannoy, A. Foucaran, E. Charles, and A. Boyer,
"Growth of Bi2Te3 and Sb2Te3 thin films by MOCVD", Materials Science and Engineering B, Vol. 64, pp. 19-24, 1999.
47. A. Giani, A. Boulouz, F. P. Delannoy, A. Foucaran, and A. Boyer, "MOCVD growth of Bi2Te3 layers using diethyltellurium as a precursor", Thin Solid Films Vol. 315, pp. 99-103, 1998.
48. G. J. Snyder, J. R. Lim, C. K. Huang, and J. P. Fleurial, "Thermoelectric microdevice fabricated by MEMS-like electrochemical process", Nature Materials, Vol. 2, pp. 528-532, 2003.
49. J. R. Lim, G. J. Snyder, C. K. Huang, J. A. Herman, M. A. Ryan, and J. P.
Fleurial, "Thermoelectric microdevice fabrication process and evaluation at the jet propulsion laboratory (JPL)", 21th International Conference of Thermoelectrics, pp. 535-539, 2002.
50. J. P. Fleurial, A. Borshchevsky, M. A. Ryan, W. M. Philips, J. G. Snyder, T.
Caillat, E. A. Kolawa, J. A. Herman, P. Mueller, and M. Nicolet, "Development of thick-Film thermoelectric microcoolers using electrochemical deposition", Materials Research Society Symposium Proceedings, Vol. 545, pp. 493-500, 1998.
51. J. P. Fleurial, G. J. Snyder, J. A. Herman, P. H. Giauque, W. M. Phillips, M. A.
Ryan, P. Shakkottai, E. A. Kolawa, and M. A. Nicolet, "Thick-film thermoelectric microdvices", 18th International Conference of Thermoelectrics, pp. 294-300, 1999.
52. I. Y. Huang, J. C. Lin, K. D. She, M. C. Li, J. H. Chen, and J. S. Kuo,
"Development of low-cost micro-thermoelectric coolers utilizing MEMS technology", Sensors and Actuators A, Vol. 148, pp. 176-185, 2008.
53. W. Ehrfeld, V. Hessel, H. Löwe, C Schulz, and L. Weber, "Materials of LIGA technology", Microsystem Technologies, Vol. 5, No. 3, pp. 105-112, 1999.
54. T. Kanagawa, R. Hobara, I. Matsuda, T. Tanikawa, A. Natori, and S. Hasegawa,
"Anisotropy in Conductance of a Quasi-One-Dimensional Metallic Surface State Measured by a Square Micro-Four-Point Probe Method", Physical Review Letters, Vol. 9, No. 3, pp. 036805, 2003.
55. H. C. Chien, D. J. Yao, M. J. Huang, and T. Y. Chang, "Thermal conductivity measurement and interface thermal resistance estimation using SiO2 thin film", Review Of Scientific Instruments, Vol. 79, pp. 054902, 2008.
56. 古耀方, "界面活性劑於電化學沉積熱電材料之特性研究", 台灣師範大學, 碩士論文, 2008.
57. J. H. Cheng, C. K. Liu, Y. L. Chao, and R. M. Tain, "Cooling performance of silicon-based thermoelectric device on high power LED", Proc. 24th Int. Conf.
Thermoelectics, pp. 53-56, 2005.