銲錫高度10μm左右的microbump，除了Cu/Sn2.3Ag/Ni/Cu的結構，其它 三種UBM組成在IMC尚未接合之前，在經過熱循環測試後，均會有疲勞裂 縫的生成，且大多沿著IMC與銲錫的界面，由外部往內部成環狀成長，在 Ni/Sn2.3Ag/Cu系統中發現，(Cu,Ni)6Sn5的三元IMC相較於Cu6Sn5更能穩定與 銲錫的界面，降低疲勞裂縫的產生，而提高銲錫高度，將使得破壞的發生
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