1. CoSb3/Ni/Ag/Sn-Ag/Cu電極 與CoSb3/Sn/Ni/Ag/Sn-Ag/Cu電極 固液擴散接合，
經過預鍍錫後強度皆能提升到10MPa以上，接合界面也都形成預期的Ag3Sn、
Cu3Sn、Ni5(Sn,Sb)2及Ni5Sb2。
2. CoSb3經過高溫長時間固液擴散接合後，Ni擴散阻礙層已無法發揮應有的作 用，後續將重點尋找CoSb3的擴散阻礙層。
3. 無預鍍Sn之 Zn4Sb3 /Ni/Ag/Sn-Ag/Cu固液擴散接合強度可達25.0MPa以上，較 預鍍Sn之Zn4Sb3 /Sn/Ni/Ag/Sn-Ag/Cu強度(15-20 MPa)高；但Ni障礙層與Zn形成 介金屬γNi₅Zn₂₁，消耗極快。 當Ni阻障層消耗完，Zn4Sb3與電極激烈反應，
造成熱電材料崩解。
4. Zn4Sb3經過SLID接合後進行400℃、500小時及1000小時時效後，當Ni完全反 應完後，Zn與O又形成ZnO、富Zn相、富Sb相及碳化，最後因內部空洞過多造 成熱電材料崩解。
5. Ni-Pd、Zr53Ni30Cu9Al8、Zr61Cu17.5Ni10Al7.5Si4及Ti42Zr40Ta3Si15四種金屬玻璃與 Zn4Sb3熱電做Diffusion couple之研究，Ni-Pd與Zn4Sb3熱電隨壓接時間的拉長，
IMC layer也增厚，因此不適合作為擴散阻障層；而Zr53Ni30Cu9Al8不論時間多
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