本論文主要探討空氣旁通效應對散熱鰭片的影響，依鰭片幾何設 計可分為平板型、階梯型、梯型等鰭片，在鰭片間距為 2mm，所有 實驗條件皆為限制流，綜合上述對幾何修改型鰭片的分析與量測結果 如下：
1. 階梯型鰭片散熱面積皆比梯型鰭片散熱面積小，但其散熱性能不 一定比較差。
2. 削去前排鰭片可有效減少壓降，而階梯型鰭片中 Step1/3 壓降較 Step1/2 小，梯型鰭片中 Trap1/3 較 Trap1/2 小，綜合上述可得知 若前排鰭片與後排鰭片高度差異較大，則減少的壓降也較大。
3. 在相同的泵功率下，Trap1/3 擁有最低的熱阻值，較平板鰭片低約 4.7%。
4. 在相同的泵功率的情況下，Step1/3 與 Trap1/3 擁有較高的熱傳係 數。
綜合以上結果得知，旁通效應雖然不能真正增加鰭片的熱傳量，
但可在維持原本熱傳量 90%以上的情況下，減少 10%~30%的散熱面 積及 5%~20%的壓降，對於成本的考量上可以說是有效果的，其中 Trap1/3 可在減少最多散熱面積的情況下，保持最高的熱傳性能，是 目前最佳的設計。
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參考文獻
[1] Seri Lee, “Optimum Design and Selection of Heat Sink”, ELEVENTH IEEE SEMI-THERMTM SYMPOSIUM, pp. 48-54, 1995.
[2] E. M. Sparrow, B. R. Baliga, and S. V. Patankar, “Forced Convection Heat Transfer from A Shrouded Fin Array with and without Tip Clearance”, J. HEAT TRANSFER, Vol.100, no.4, pp. 572-579, 1978.
[3] D. Copeland, “Optimum of Parallel Heatsinks for Forced Convection”, SIXTEENTH IEEE SEMI-THERMTM SYMPOSIUM, pp.
116-123, 1984. COMPONENTS AND PACKAGING TECHNOLOGIES , Vol. 27 , No.
2 , pp. 417–425, 2004.
[6] C. J. Shih and G. C. Liu , “Optimal Design Methodology of Plate-Fin Heat Sinks for Electronic Cooling Using Entropy Generation Strategy”, IEEE TRANSACTIONS ON COMPONENT AND PACKAGING TECHNOLOGIES , Vol. 27 , No. 3 , pp. 551–559, 2004.
[7] S. Narasimhan , A. Bar-Cohen , Fellow , IEEE , and R. Nair ,
“Thermal Compact Modeling of Parallel Plate Heat Sinks”, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES , Vol. 26 , No.1 , pp. 137–146, 2003.
46
[8] R. A. Wirtz , Weiming Chen , Ronghua Zhou , “Effect of Flow Bypass on the Performance of Longitudinal Fin Heat Sinks”, Journal Of Electronic Packaging, Vol. 116 , pp. 206–211, 1994.
[9] M. A. butterbaugh , S. S. Kang , “Effect of Airflow Bypass on the Performance of Heat Sinks in Electronic Cooling”, Advances in Electronic packaging , EEP–Vol. 10–2 , pp. 843–848, 1995.
[10] H. Jonsson and B. Palm , “Thermal and Hydraulic Behavior of Plate Fin and Strip Fin Heat Sinks Under Varying Bypass Conditions”, Inter Society Conference on Thermal Phenomena , pp. 96–103, 1998.
[11] H. Jonsson and B. Moshfegh , “Modeling of the Thermal and Hydraulic Performance of Plate Fin, Strip Fin, and Pin Fin Heat Sinks–Influence of Flow Bypass”, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES , Vol. 24 , No.
2 , pp. 142–149, 2001.
[12] T. D. Yuan , “Computational Modeling of Flow Bypass Effects on Straight Fin Heat Sink in Rectangular Duct”, Twelfth IEEE SEMI-THERMTM Symposium , pp. 164–168, 1996.
[13] C. B. Coetzer , J. A. Visser , “Compact Modeling of Forced Flow in Longitudinal Fin Heat Sinks With Tip Bypass”, Journal of Electronic Packaging , Vol. 125 , pp. 319–324, 2003.
[14] H. Jonsson and B. Palm,“Thermal and Hydraulic of Plate Fin and Strip Fin Heat Sink under Varying bypass Conditions”, Inter Socity Conference on Thermal Phenomena , pp. 98–103, 2001.
[15] W. A. Khan , J. R. Culham , M. M. Yovanovich , “Modeling of Cylindrical Pin-Fin Heat Sinks for Electronic Packaging”, 21st IEEE
47
SEMI-THERM Symposium , pp. 125–134, 2005.
[16] O. N. Sara, “Performance analysis of rectangular ducts with staggered square pin fins”, Energy Conversion and Management 44 , pp. 1787–1803, 2003.
[17] Qingling Li , Zhong Chen, Ulrich Flechtner , Hans-Joachim Warnecke , “Heat Transfer and Pressure Drop Characteristic in rectangular channels with elliptic pin fins”, International Journal of Heat and Fluid Flow 19 , pp. 245–250, 1998.
[18] Christopher L. Chapman , Seri Lee , Bill L. Schmidt , “THERMAL PERFORMANCE OF AN ELLIPTICAL PIN FIN HEAT SINK”, Tenth IEEE SEMI-THERMTM , pp. 24–31, 1994.
[19] Y.H. Hung , H.T. Chen , P.L. Chen , J.T. Horng ,“Design Optimization for Pin-Fin Heat Sinks”, Journal of Electronic Packaging , Vol. 127 , pp. 397–406, 2005.
[20] Boesmans B. , Christiaens F. , Berghmans J. and Beyne E. , “Design of an Optimal Heat-Sink Geometry for Forced Convection Air Cooling of Multi-Chip Modules”, Thermal Management of Electronic Systems , Hoogendoorn , C. J. , ed., Kluwer Academic , pp.
267–276, 1994.
48
源研究所，1995。
[25] 劉泱凭，緻密性凹凸鰭片熱傳量測與數值分析，國立雲林科技大 學機械工程系碩士論文，2010。
[26] R. E. Simons, “Estimating Parallel Plate-Fin Heat Sink Pressure Drop,” Electronics Cooling, Vol. 9, No. 2, pp. 8-10, 2003.