本研究主要探討微流道邊界滑移對微流道熱沈的熱傳現象。在微 流道熱傳方面，主要探討圓形、矩形與梯形三種微流道紐賽數隨雷諾 數隨雷諾數的變化。當中我們發現，矩形流道在相同的水力直徑下，，
若矩形流道的高寬比越大，其熱傳效果會越好，但對於梯形流道與圓 形流道而言，不同的邊長的比例相同的水力直徑下，截面積影響力最 大。
在邊界滑移部份，具邊界滑移的流道形成完全發展流較快。在熱 傳效益上，結果顯示出具滑移邊界的流道熱傳效益較佳，且當滑移長 度越大時，流道有更好的熱傳效果。
因此，經過本文之探討，能讓我們對於渠道壁面流體滑移現象對 微流道熱沈熱傳有更深一層的視野，並期望能在壁面滑移的研究上能 帶給人們更廣的視野及提供日後研究流道壁面滑移者有效之參考資 料。
參考文獻
[1] L. T. Yeh, “Review of Heat Transfer Technologies in Electronic Equipment,＂ J. of Electronic Packaging, Vol. 117, pp. 333-339, 1995.
[2] C. Chapman, “The Basics of Package/Device Cooling,＂
Electronic Packaging and Production, pp. 57-60, May 1998.
[3] Tummala, “Fundamentals of Microsystems Packaging,＂ Mc Graw-Hill, 2002.
[4] T. R. Hsu,MEMS and Microsystems：design and manufacture McGraw-Hill,2002
[5] D. B. Tuckerman, R. F. W. Pease, ＂High-Performance Heat Sinking for VLSI＂, IEEE Electronic Device Letter , Vol.
EDL-2(5), No. 4, pp. 126-129, 1981.
[6] J. Pfahler, J. Harley, H. H. Bau, and J. Zemel, “Liquid Transport in Micron and Submicron Channels＂, sensors and Actuators, A21-23, pp. 181-314, 1990.
[7] S. B. choi, R. F. Barron, R. O/ Warrington, “Liquid Flow and Heat Transfer in Microtubes＂, ASME Micromechanical Sensors, Actuators and Systems, DSC-Vol. 32, pp. 123-128,
1991.
[8] Weilin Qu, Mohiuddin Mala, Dongqing Li, “Presure-Driven Water Flows in Trapezoidal Silicon Microchannels＂, Int.
J. Heat and Mass Transfer, Vol. 43, pp. 553-364, 1999.
[9] X. F. Pen, B. X. Wang, “Forced Convection and Flow Boiling Heat Transfer for Liquid Flowing through Microchannels＂, Int. J. Heat Mass Transfer, Vol. 36, No.14, pp. 3421-3427, 1993.
[10] B. X. Wang, X. F. Peng, “Experimental Investigation on Liquid Forced Convection Heat Transfer through
Microchannels＂, Int. J. Heat and Mass Transfer, Vol. 37 Suppl. 1, pp. 73-82, 1994.
[11] X. F. Peng, G. P. Peterson, B. X. Wang, “Frictional Flow Characteristics of Water Flowing through Rectangular Microchannels＂, Experimental Heat Transfer, Vol. 7, pp.
249-264, 1994
[12] X. F. Peng, G. P. Peterson, B. X. Wang, “Heat Transfer Characteristics of Water Flowing through Microchannels＂, Experimental Heat Transfer, Vol. 7, pp. 2659-283, 1994.
[13] X. F. Peng, G. P. Peterson, B. X. Wang and H. B. Ma,
“Experimental Investigation of Heat Transfer in Flat Plates With Rectangular Microchannels＂, Int. J. Heat and Mass Transfer, Vol. 38, No. 1, pp. 127-137, 1995.
[14] D. Brutin, F. Topin, L. Tadrist, “Experimental Study of Unsteady Convective Boiling in Heated minichannels＂, Int J. of Heat and Mass Transfer, Vol. 46, pp. 2957-2965, 2003.
[15] Linan Jiang, Man Wong, “Phase Chang in Microchannel Heat Sinks with Integrated Temperatuere Sensors＂, J. of
Microelectromechanical Systems, Vol. 8, No. 4, pp. 358-365, 1999.
[16] Lian Zhang, Jae-Mo Koo, Linan Jiang, “Measurements and Modeling of Tow-Phase Flow in Microchannels with Nearly Constant Heat Flux Boundary Conditions＂. J. of Microelectromechanical Systems, Vol. 11, No. 1, pp. 12-19, 2002..
[17] H. Y. Wu, Ping Chang, “An Experimental Study of Convection Heat Transfer in Silicon Microchannels with Different Surface Condition＂, Int. J. of Heat and Mass Transfer , Vol.
46, pp. 2547-2556, 2003
[18] K. C. Toh, X. Y. Chen, J. C. Chai, “Numerical Coputation of Fluid Flow and Heat Transfer in Microchannels＂, Int. J.
of Heat and Mass Transfer, Vol. 45, pp. 5133-5141, 2002 [19]Andrie G. Fedorov, Raymond Viskanta, “Three-Dimensional
Conjugate Heat Transfer in the Microchannel Heat Sink for Electronic Packaging＂, Int. J. of Heat and Mass Transfer, Vol. 43, pp. 399-415, 2000
[20]Ruckenstein,E. and Rajora, P.“On the No-slip Boundary Condition of Hydrodynamics＂.J. of Colloid and Interface Science,96,pp. 488-491,1983
[21]Barrat,J.and Bocqet,L.“Large Slip Effect at a Nonwetting Fluid-Solid Interface＂.Physical Review Letters,82,pp.
4671-4674,1999
[22]Pit, R., Hervet, H.,and Leger, L.“Direct Experimental Evidence of Slip in Hexadecane: Solid Interface＂.Physical Review Letters,85,980-983,2000
[23]Derek C. Tretheway and Carl D. Meinhart “Apparent fluid slip at hydrophobic microchannels walls,＂ Physics of Fluids,
Vol. 14, N0.3, 2002.
[24]James W. G. Tyrrell and Phil Attard “Images of Nanobubbles on Hydrophobic Surfaces and Their Interaction,＂Physical Review Letters, Vol. 87, NO. 17, 2002.
[25]Derek C. Tretheway, Xiaojun Liu, and Carl D. Meinhart
“Analysis of Slip Flow in Microchannel＂Department of Mechanical Engineering University of California, Santa Barbara. CA 93106, 2003.
[26]Ship Yu, Timothy A.Ameel,“Slip-flow heat transfer in rectangular microchannels＂ Int. J. of Heat and Mass Transfer,Vol.44,pp.4225-4234,2001
[27] 鐘文仁，“IC 封裝製程與 CAE 應用＂全華出板社，2003。
[28] Weilin Qu, Issam Mudawar, “Analysis of Three-dimensional Heat Transfer in Micro-channel Heat Sinks＂, Int. J. of Heat and Mass Transfer, Vol. 45, pp. 3973-3985, 2002.
[29] Derek C. Tretheway, Xiaojun Liu, and Carl D. Meinhart,
“Examination of the Slip Boundary Condition By μ-PIV and Lattice Boltzmann Simulations＂,ASME,2002
[30] Steve Granick,Yingxi Zhu,and Hyunjung Lee“Slippery
questions about complex fluids flowing past solids＂
nature materials, VOL 2, 2003
表 4-1 圓形的幾何圖形與尺寸
表 4-2 矩形的幾何圖形與尺寸
表 4-3 梯形的幾何圖形與尺寸
表 4-4 熱沈與水物理性質 Tin
(K)
Heat Flux (W/m2)
Kwater (W/m-K)
Ksilicon (W/m-K)
Cpwater (J/kg-K)
υ (m2/s)
293 360000 0.61 148 4179 1*E-6
表 4-5 網格測試的格點數與總網格數
(y,z)格點數 總網格數
網格測試 A 75x36 662904 網格測試 B 79X39 763344 網格測試 C 82x42 859599 網格測試 D 87x44 960876
圖 1-1 IC 元件在封裝型態上的發展與演進
圖 1-2 IC 元件在引腳的發展與演進
Temperature Humidity 55%
19%
Dust 6%
Vibration 20%
圖 1-3 引起電子元件損壞的主要因素[1]
圖 1-4 矽晶片表面上行成一氣體薄層[30]
圖 1-5 流體經過表面有粒子的壁面情形[30]
圖 2-1 物理模型
圖 2-2 矩形流道模擬剖面圖(流道長為 5mm)
圖 2-3 梯形流道模擬剖面圖(流道長為 5mm)
圖 2-4 圓形流道模擬剖面圖(流道長為 5mm)
圖 2-5 邊界條件示意圖
圖 2-6 氣體分子與管壁碰撞示意圖
圖 2-7 分子碰撞前後示意圖
圖 2-8 CFD-RC 求解過程
圖 2-9 二維三角格點
圖 3-1 文獻與 CFD-RC 所作出 y 方向(300μm)和 z 方向(30μm)的速 度
圖 3-2 流道滑移模擬網格測試
圖 3-3 圓形流道入口流動情形
圖 3-4 矩形流道入口流動情形
圖 3-5 梯形流道入口流動情形
圖 3-6 不同雷諾數與水力直徑下圓形流道 Nu 的變化
圖 3-7 水力直徑為 50
μm
矩形流道在不同雷諾數下 Nu 的變化圖 3-8 水力直徑為 100
μm
矩形流道在不同雷諾數下 Nu 的變化圖 3-9 水力直徑為 200
μm
矩形流道在不同雷諾數下 Nu 的變化圖 3-10 水力直徑為 100
μm
矩形流道在較低雷諾數下 Nu 的變化圖 3-11 水力直徑為 50
μm
梯形流道在不同雷諾數下 Nu 的變化圖 3-12 水力直徑為 100
μm
梯形流道在不同雷諾數下 Nu 的變化圖 3-13 水力直徑為 200
μm
梯形流道在不同雷諾數下 Nu 的變化圖 3-14 水力直徑為 100
μm
矩形流道相同截面積在不同雷諾數下 Nu 的變化圖 3-15 水力直徑為 100
μm
矩梯形流道在不同滑移長度下(a)Zhu and Granick (b)Tretheway and Meihart (c)Tyrell and Attard不同雷諾數下 Nu 的變化