2. 由於結構相當微小，因此在利用 SEM 觀察結構時需放大很多倍，
很容易造成電子束局限於某個結構部位而使該部位熔融變形。建 議以較斜的角度觀察，擴大電子束的照射範圍，或將材料以極低 溫處理過。
3. 進行施加功率熱壓時，建議嘗試改變其他熱壓參數如脫模溫度及 保壓壓力觀察成形的狀況。
4. 由於可完整脫模的成形操作窗範圍太過狹隘，以及 3.6mm × 2.7mm 對於 10mm × 10mm 的模仁而言可成形的區域過小，冀望 能利用改良過後的模仁，改善可成形的區域，並擴大操作範圍。
5. 在熱壓模仁上同時設計微感測器，整合感測功能使次微米模仁成 為在熱壓成形時可同時監測溫度及壓力的智慧型模仁。
參考文獻
[1] W. Menz, J. Mohr, O. Paul, Microsystem Technology.
[2] 伍秀菁，汪若文，林美吟，微機電系統技術與應用，行政院國家 科學委員會精密儀器發展中心，民國九十二年七月。
[3] 廖明吉，0.1 微米世代的微影解決方法，NDL 奈米通訊，第五卷 第四期。
[4] T. Wagenknecht, H. Collin, P. Krajewdky, P.Blo, “Hot Embossing of Microstructures ＂ , 21st Annual Meeting of the Polymer Processing Society, June 19-23, 2005
[5] M. Heckele, W. Bacher, and K. D. Muler, “Hot embossing – The molding technique for plastic microstructures”, Microsystem Technologies, Vol. 4, pp. 122-124, 1998
[6] Becker, E. W.； Ehrfeld, W.； Hagmann, P.； Maner, A. and Munchmeyer, D. 1986 Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process), Microelectron. Engng, 4, 35-56
[7] P. Ruther, B. Gerlach, J. Göttert, M. Ilie, J. Mohr, A. Müller and C.
Oßmann, “Fabrication and characterization of microlenses realized by a modified LIGA process” , Pure Appl. Opt. 6 (1997) 643-653 [8] H. Becker, U. Heim, “Silicon as tool material for polymer hot
embossing”, in: Proc, MEMS ’99, Orlando, 1999, pp. 228-232
[9] H. Becker, U. Heim, “Hot embossing as a method for the fabrication of polymer high aspect ratio structures”, Sensors and Actuators A, Vol. 83, pp. 130-135, 1999.
[10] Yigui Li, Chun Hui, Jun Zhu, Jingquan Liu, Yoshiaki Kanamori,
“Fabrication Sub-Micron Gratings Based on Embossing”, DTIP of MEMS & MOEMS 2003, Cannes-Mandelieu, 5-7 May 2003
[11] S. Y. Chou, P. R. Krauss, and P. J. Renstrom, “Imprint Lithography
with 25-Nanometer Resolution”, 1996, Science 272, 85-87.
[12] S. Y. Chou, P. R. Krauss, and P. J. Renstrom, “Nanoimprint Lithography”, 1996, J. Vac. Sci. Technol. B 14(6), Nov/Dec 1996.
[13] Alkaisi, M. M., Blaikie, R. J. , McNab, S. J. (2001) “Low temperature nanoimprint lithography using silicon nitride molds”, Microelectronic Engineering, 57-58, 367.
[14] yatissa, W. , Alkaisi, M. M. , Blaikie, R. J. ,(2002) “Three Dimensional Imprint Lithography Using SixNy Molds”. Digest of papers for the Micro processes and Nanotechnology conference, 162, Nov 6-8, 2002, Tokyo, Japan.
[15] M. Colburn, S. Johnson, M. Stewart, S. Damle, T. Bailey, B. Choi, M.
Wedlake, T. Michaelson, S. V. Sreenivasan, J. Ekerdt, and C. G.
Willson, “Step and Flash Imprint Lithography: A New Approach to High-Resolution Patterning”, Proc. SPIE, 3676, 379-391
[16] M. Bender, M. Otto, B. Hadam, B. Vratzov, B. Spangenberg, and H.
Kurz, “Fabrication of nanostructures using UV-based imprint technique”, Microelectronic Engineering, Vol. 53, 233-236, 2000.
[17] M. Bender, M. Otto, B. Hadam, B. Spangenberg, and H Kurz,
“Mutiple imprinting in UV-based nanoimprint lithography: related material issues”, Microelectronic Engineering, Vol. 61-62, 407-413, 2002.
[18] Jun-ho Jeong, Young-suk Sim, Hyonkee Sohn, Eung-sug Lee, “UV nanoimprint lithography using an elementwise embossed stamp”, ICMENS’04, 233-236, 2004.
[19] Stephen Y. Chou, Chris Keimel, and Jian Gu, “Ultrafast and direct imprint of nanostructures in silicon”, NATURE, vol. 417, 835-837, 2002.
[20] Y. Lu, D. B. Shao, and S. C. Chen, “Laser-assisted photothermal imprinting of nanocomposite”, Appl. Phys. Lett., Vol. 85, No. 9,
2004.
[21] Eih-Zhe Liang, Zhao-Ren Huang, Ching-Fuh Lin, and Chieh-Hsiung Kuan, “Laser Assisted Imprint of Silicon Nanostructure with Good Crystal Quality”, Proc. Of 2005 IEEE Con. On Nanotech., 2005.
[22] Chun-Hung Chen, Chuan-Pu Liu, Yung-Chun Lee, Fei-Bin Hsiao, Cheng-Yu Chiu, Ming-Hung Chung, and Ming-Hsueh Chiang, “IR laser-assisted micro/nano-imprinting”, J. Micromech. Microeng, 16, 1463-1467, 2006.
[23] 黃重凱，”智慧型模仁的初步開發”，國立交通大學碩士論文，民 國92 年
[24] 蘇濬賢，”微機電系統化的模仁及其配套熱壓成形技術的開發”，
國立交通大學碩士論文，民國94 年
[25] Zehev Tadmor and Costas G. Gogos, “Principles of Polymer Processing”, John Wiley&Sons, 1979.
[26] 蔡沛原，”應用具有局部快速加熱能力的模仁的微米成形技術的開 發”，國立交通大學碩士論文，民國 95 年
[27] 林熙翔，”電子束微影技術簡介”，機械工業雜誌，245 期，97-105 [28] Hong Xiao, “Introduction to semiconductor manufacturing
technology”, Prentice Hall, 2004
[29] 黃俊凱，楊忠諺，“微機電蝕刻製程氣體的選擇”，奈米通訊第九 卷第三期，33-37。
[30] 吳永俊，劉正財，宋金龍，胡淑芬，”使用 Leica Weprint200 電子 束直寫微影系統製作0.1μm MOS 元件的技術”，毫微米通訊，第 八卷第一期，30-40。
[31] 莊達人，”VLSI 製造技術”，高立圖書有限公司，309
[32] Alfred Grill, “Cold plasma in material fabrication”, IEEE Press, 1994 [33] 謝詠芬，何快容，”掃描式電子顯微鏡”，微電子材料與製程，第
十一章。
[34] Zehev Tadmor and Costas G. Gogos, “Principles of Polymer
Processing”, John Wiley&Sons, 1979.