ACKNOWLEDGEMENTS

FLUIDSHEAT Session: Fluid Mechanics and Aerodynamics Chair: Bor-Jang Tsai, Irina Eglite

V. ACKNOWLEDGEMENTS

The authors would like to thank ITRI for its support, and the National Science Council of the Republic of China, Taiwan, for financially supporting this research under Contract No. NSC98-2221-E-216-047

References

[1] J. W. Sofia, “Electrical thermal resistance measurements for hybrids and multi-chip packages”, Analysis Tech, Wakefield, MA, USA, 1-9, 2000.

[2] Kim, Lan, et al., “Thermal analysis of multi-chip LED packages”, SPIE, 6355:P. 63550E. 2006.

[3] K. Azar, “Advanced cooling concepts and their challenges”, Therminic conference, Innovation in Thermal Management, 1-38, 2002.

[4] K. Sikka, et al. “Multi-chip package thermal management of IBM z-Server systems”, ITHERM, 2007.

7_Final_Program1.pdf

[5] R. Yavatkar, M. Tirumala, “Platform wide innovations to overcome thermal challenges”, THERMES, 2007.

[6] “Forced thermal spreader characterization for an active_BGA”, Internal memorandum, R&D Department, Advanced Thermal Solutions, Inc., 2006.

[7] E. Colgan, , et al., “A practical implementation of silicon micro channel coolers for high power chips”, SEMITHERM, 2005.

[8] J. W. Sofia, “Component thermal characterization:

Transient to steady state, Analysis Tech”, Wakefield, MA, USA,

[9] Circuit-performance and thermal resistance measurements, (3100 Series) MIL-STD-750C, February, 1993 [10] A. D. Kraus, A. Bar-Cohen, “Thermal analysis and control of electronic equipment”, McGraw Hill, Ch. 1, 1983.

[11] C. Neugebauer, et al. “Thermal response measurements for semiconductor devices”, New York: Gordon & Breach Science Publications, Ch. 4, 5, 6, 1986.

[12] F. F. Oettinger, D. L. Blackburn, “Thermal resistance measurements”, NIST Special Publication 400-86 from Series on Semiconductor Measurement Technology, July, 1990.

[13] M. Rencz, V. Szekely, et al., “Determining partial resistances with transient measurements and using the method to detect die attach discontinuities”, Eigtheenth Annual IEEE SEMI-THERM Symposium, 15-20, 2002.

[14] J. W. Sofia, “Analysis of thermal transient data with synthesized dynamic models for semiconductor devices”, IEEE Transactions on Components, Packaging, and Manufacturing Technology Part A (CPMT), March, 18: 39-47, 1995.

[15] V. Szekely, M. Rencz, “Thermal dynamics and the time constant domain”, IEEE Trans. on Comp. and Packaging Tech., 23(3) 687-694, 2000.

[16] F. N. Masana, “A new approach to the dynamic thermal modelling of semiconductor packages”, Microelectron. Reliab.

41 (6) 901–912, 2001.

[17] S. Muthu, F.J. Schuurmans, M.D. Pashley, “Red green blue LED based white light generation”: Issues and control, in:

IAS’02, Proc. IEEE 1 (2002) 327–333.

[18] G. Farkas, Q.V. Vader, A. Poppe, G. Bognar, “Thermal investigation of high power optical devices by transient testing”, IEEE Trans. Compon. Package. Technol. 28 (1) 45–50, 2005.

[19] B. J. Huang, P. C. Hsu, M. S. Wu, C. W. Tang, “Study of system dynamics model and control of a high-power LED lighting luminaire”, Energy 32 (11) 2187–2198. 2007.

[20] B. J. Huang, C. W. Tang, M. S. Wu, “System dynamics model of high-power LED Luminaire”, Applied Thermal Engineering 29 (4) 609–616, 2009

Figures

Fig. 1 Flat copper plate-Cu base (LED chip as a point heat source without a heat sink) the heat transfer calculation using

Flat copper plate‐Cu base with four edge surfaces at 25^oC,

Recent Researches in Mechanics

Fig. 2 Geometrical dimensions and materials of an LED 4-chip package module

Fig. 3 Schematic diagram of thermal resistance of an LED 4-chip package module

LED junction 64.7^oC

Fig. 4 Geometrical structure direction and temperature field of an LED single-chip package module (top view)

Fig. 5 Temperature field of an LED single-chip package module (front cross-sectional view)

( )r

T ＝

k r q₁′′₁²

(r 1－

1 r ^)＋T²

(r1 r2)

R_th − ＝ 1

2 1

q T T −

＝

A k r

1 2

1 (

1 r ^－ ₂

1 r ⁾

Fig. 6 Temperature field and analog circuit of thermal resistance for an LED single-chip package module (side view)

Fig. 7 Copper plate temperature depression curves by numerical simulation and analytical calculation by Eq. (8) for an LED single-chip package module

LED junction 97.4^oC LED junction 46.9^oC

Single-chip LED 1.6W Single-chip LED 0.4W Fig. 8 Copper plate temperature distributions by numerical simulation (via the superposition principle) and analytical calculation by Eq. (8) for an LED single-chip package module under varying power.

LED junction 54.6^oC LED junction 112^oC

Fig. 9 Junction interface temperature distributions of a single-chip module and an LED 4-chip package module

Dr. Bor-Jang Tsai is currently Professor of Mechanical Engineering at Chung Hua University in HsinChu, Taiwan, Republic of China. Dr. Tsai earned his Ph.D from the School of Aerospace and Mechanical Engineering University of Missouri- Columbia in 1992, and had his M.S and B.S. in Mechanical Engineering from Clemson University, and Tatung University in 1984 and 1981, respectively. Professor Tsai’s research interests cover: (1) Active building envelope system(ABE)：Wind

& solar driven ventilation、electricity、heat pump (2) Thermal analysis of electronic appliances such as CPU and LED (3) Hybrid structural systems of an active building envelope system(ABE) (4) Design and aerodynamic analysis of a flapping wing micro aerial vehicle (5) A Novel swiss-roll recuperator for the micro-turbine engine (6) Performance of a half-height innovative cooling Fan. Most of his researches are in areas of thermal fluid science, renewable energy, aerodynamic, gas turbine and green buildings.

Recent Researches in Mechanics

Dear Dr. Alkis Polyrakis

Thank you very much for your assistance!

Bor-Jang Tsai

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主旨: NAUN / University Press Journals 收件者: stlouis17888@yahoo.com.tw 日期: 2011 年 10 月 26 日,三,下午 6:42 Dear Prof. / Dr.,

We would like to inform you that your paper was published in one of our journals. You may examine the attached file to track down the publication.

You are reminded that this journal will only be published electronically and no hard copies will be available.

Best Regards, --

Alkis Polyrakis

WSEAS Editing Manager

Your paper was accepted. Registration deadline: July 1st

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國科會補助計畫衍生研發成果推廣資料表

日期:2011/10/31

國科會補助計畫

計畫名稱: 綠色建築三合一整合光伏電熱太陽能板(PV/T)空氣收集器,地熱空氣交換器 (EAHE)及鋪設穩態形狀相變材料地板(SSPCM)的能量與最大可用能之分析研究

計畫主持人: 蔡博章

計畫編號: 99-2221-E-216-030- 學門領域: 能源科技

研發成果名稱

(中文) 建築物系統整合技術：氣、電、熱及綠建材之整合規畫技術II (英文)

成果歸屬機構

^中華大學

發明人

(創作人)

蔡博章,張宇志,賴世傑

技術說明

(中文) 建築物越來越注重本身自己就是節能減碳有效率，因此自然通風、太陽能加溫與致冷、地溫空氣熱交換、自然光線及避陽遮蔭…等自然被動式不需要消耗太多能量的設置，將是綠色建築的不二選擇，本研究三機一體將薄膜光伏電熱太陽能板空氣收集器(PV/T air collector), 收集熱氣驅動氣流、搭配地溫空氣熱交換 (EAHE)來的氣流與吸收透過窗戶或太陽能板光線的穩態形狀相變材料(SSPCM)之儲熱儲能，整合出一棟完全被動式混成系統建築。考慮新材料與建築服務結合的綠色設計新觀念，再以一棟位於台灣新竹地區沒有空調的建物為探討對象，來數值分析仲夏夜晚通風情況下，氣、電及熱的需求與影響，分析時程含蓋日、月及年，先針對薄膜光伏電熱太陽能板與各次系統之物理數學模型(Model)驗證，再發展出被動式混成系統建築的完整物理數學模型，搭配MATHLAB、CFD 軟體協助而得到分析解及數值解。

利用熵值公式(enthalpy formulation)及Voller 與Patankar 之控制容積數值技術求解二維暫態能量守恆搭配Stefan 移動邊界問題幅與波數下，自然對流具有最佳的熱傳增益。之福傳程式組Hybrid-HVAC，也將配合本棟被動式混成系統建築的個別次系統做程式修改為Hybrid-HVACP，此程式可以幫忙材料作驗證，以及協助太陽能電池空氣收集器、地溫空氣熱交換及穩態形狀相變材料地板等系統作設計，為綠色建築-節能省能屋的最佳化設計與能量分析，提供有利的工具。

(英文) Applying the thin film photovoltaic technology for building integration, and an integrated photovoltaic /thermal air collector, collect hot air driving air flow, mixing the air flow from earth air heat exchanger (EAHE) and hot air flow to the shape-stabilized phase change material (SSPCM) inside greenhouse, SSPCM also absorbs energy form solar lighting through windows and solar panels. A piston cylinder air compressor will adjust the moderate control of air flow and temperatures of ambient and room for the hybrid system. Theoretical performance assessment of this building is analyzed by using energy analysis methods based on Hsinchu weather. Mathematic model will be resolved by the helps of MATLAB 7.0 program. Energy needs of air-conditioning、electricity and thermal will be predicted. The Hybrid-HVACP and should be able to solve the hybrid system building with the PV/T、EAHE and SSPCM numerically in accuracy, then optimization design and energetic analysis of the building.

產業別

建物裝修及裝潢業；熱能供應業

技術/產品應用範圍

建築營造、房地產、節能省能及能源科技業。

建築物帷幕系統、建築物節能省能系統規畫綠建築混成設計最佳化軟體

技術移轉可行性及預期效益

綠建築節能省能能源材料環保氣電熱整合 Green Housing

Shape-stabilized Phase Change Materials Save Energy and Protect Environment

註：本項研發成果若尚未申請專利，請勿揭露可申請專利之主要內容。

99 年度專題研究計畫研究成果彙整表

計畫主持人：蔡博章計畫編號：99-2221-E-216-030-

計畫名稱：

綠色建築三合一整合光伏電熱太陽能板(PV/T)空氣收集器,地熱空氣交換器(EAHE)及鋪設穩態形狀相變材料地板(SSPCM)的能量與最大可用能之分析研究

量化成果項目

實際已達成數（被接

受或已發表）

預期總達成數(含實際已達成數)

本計畫實際貢獻百分

比

單位

備註（質化說明：如數個計畫共同成果、成果列為該期刊之封面故事 ...等）

期刊論文 0 0 100%

研究報告 / 技術報

告 1 0 100%

喜室(Hess Energy Co.)-有關綠建築之窗戶及門之綠色技術與節能省能的諮詢報告

研討會論文 1 1 100%

篇

1.Bor-Jang Tsai( 蔡博章)，Pang-Wei Wu(張宇志),

’綠色建築三合一整合光伏電熱太陽能板 (PV/T)空氣收集器,地熱空氣交換器(EAHE)及鋪設穩態形狀相變材料地板(SSPCM)的能量與最大可用能之分析研究

’，中國機械工程學會第二十八屆全國學術研討會論文集，中華民國一百年十二月十日、十一日，

中興大學台中市。

論文著作

專書 0 0 100%

申請中件數 1 1 100%

專利名稱:主動式外表帷幕系統(ABE):風力太陽能驅動氣,電,熱之研究.

撰寫申請書校內審查.

專利

已獲得件數 0 0 100%

件

件數 1 1 100% 件喜室(Hess Energy Co.)

或台灣寶熊公司技術移轉

權利金 1 1 100% 千元技轉金 15000 元

碩士生 2 2 100% 1.張宇志 2. 賴世傑

博士生 0 0 100%

博士後研究員 0 0 100%

國內

參與計畫人力

（本國籍）

專任助理 0 0 100%

人次

國際期刊論文有 3 篇:

(Accepted)

1. Bor-Jang Tsai 、 Koo-David Huang and Chien-Ho Lee,’Hybrid Structural Systems of An Active Building Envelope

System(ABE) ’ , Advanced material research, Vol.

168-170. pp.

2359-2370.

NSC-98-2221-E-216-047 ( EI: ISTP)

2.Bor-Jang

Tsai ,Yu-Jhih Jhang and Teh-Chau Liau, ’Theoretical performance of integrated

photovoltaic /thermal air collector, earth-air heat exchanger and greenhouse with a

floor of

shape-stabilized phase-change material:

evaluation by energetic analyses’, Advanced Science Letters , in press.

NSC-99-2212-E-216-030 (SCI: EI: IF: 1.35) 3. Bor-Jang Tsai, Sheam-Chyun Lin and Wei-Kuo Han,’Thermal analysis of a high power LED multi-chip package module’, International Journal of Energy, Issue 4, Vol. 5, pp. 79-87, 2011 NSC-99-2212-E-216-030 (EI)

國際期刊論文有 1 篇:

4. Bor-Jang Tsai 、 Sheam-Chyun Lin and Wei-Cheng Yang, ’ HVAC analysis of a building installed shape stabilized phase change material plates coupling an active building envelope system ’ , WSEAS Transactions Journal, paper no. 53-895.

(SCI: EI: IF:0.9) 研究報告 / 技術報

告 0 0 100%

研討會論文 5 2 100% 國外研討會論文有 5 篇:

1.Bor-Jang Tsai , Koo-David Huang and Chien-Ho Lee, ’ Hybrid Structural Systems of An Active Building Envelope System(ABE) ’ , 2011 International

Conference on Structures and Building

Materials-Advanced Materials Research, 廣州, 中國, Jan. 2011.

2. Bor-Jang Tsai 、

(FLUIDSHEAT'11), Corfu Island, Greece., July 2011.

3. Bor-Jang Tsai, Sheam-Chyun Lin and Wei-Kuo Han,’ Thermal Analysis of a high power LED multi-chip Package Module for Electronic

Appliances’, WSEAS/NAUN International

Conferences: 2nd International

Conference on Fluid Mechanics and Heat and Mass Transfer 2011 (FLUIDSHEAT'11), Corfu Island, Greece., July 2011.

4. Sheam-Chyun Lin, Bor-Jang Tsai and Cheng-Ju

Chang, ’Influence of Elevator Moving Pattern and Velocity on the Airflow Uniformity for an LCD Panel Delivery Facility’,

WSEAS/NAUN International

Conferences: 2nd International

Conference on Fluid Mechanics and Heat and Mass Transfer 2011 (FLUIDSHEAT'11), Corfu Island, Greece., July 2011.

5. Bor-Jang Tsai ,Yu-Jhih Jhang, ’ Theoretical performance of integrated

photovoltaic /thermal air collector,

exchanger and greenhouse with a

floor of

shape-stabilized phase-change

material: evaluation by energetic analyses ’ ICETI 2011, 墾丁屏東台灣 , Nov. 11-15, 2011

專書 0 0 100% 章/本

申請中件數 0 0 100%

專利已獲得件數 0 0 100% 件

件數 0 0 100% 件

技術移轉

權利金 0 0 100% 千元

碩士生 0 0 100%

博士生 0 0 100%

博士後研究員 0 0 100%

參與計畫人力

（外國籍）

專任助理 0 0 100%

人次

其他成果 (無法以量化表達之成果如辦理學術活動、獲得獎項、重要國際合作、研究成果國際影響力及其他協助產業技術發展之具體效益事項等，請以文字敘述填列。)

1.可利用之產業及可開發之產品:建築營造、房地產、節能省能及能源科技業建築物帷幕系統、建築物節能省能系統規畫綠建築混成設計最佳化軟體.

2.技術特點: 綠建築節能省能能源材料環保氣電熱整合.

3. 推廣及運用的價值 : Green Housing Shape-stabilized Phase Change Materials Save Energy and Protect Environment

4. Section Chair--WSEAS/NAUN International Conferences: 2nd International Conference on Fluid Mechanics and Heat and Mass Transfer 2011 (FLUIDSHEAT'11), Corfu Island, Greece., July 2011.

成果項目量化 名稱或內容性質簡述

測驗工具(含質性與量性) 0

課程/模組 0

電腦及網路系統或工具 0

教材 0

舉辦之活動/競賽 0

研討會/工作坊 0

電子報、網站 0

科教處計畫加填項

目計畫成果推廣之參與（閱聽）人數 0

國科會補助專題研究計畫成果報告自評表

請就研究內容與原計畫相符程度、達成預期目標情況、研究成果之學術或應用價值（簡要敘述成果所代表之意義、價值、影響或進一步發展之可能性）、是否適合在學術期刊發表或申請專利、主要發現或其他有關價值等，作一綜合評估。

1. 請就研究內容與原計畫相符程度、達成預期目標情況作一綜合評估

■達成目標

□未達成目標（請說明，以 100 字為限）

□實驗失敗

□因故實驗中斷

□其他原因說明：

2. 研究成果在學術期刊發表或申請專利等情形：

論文：■已發表 □未發表之文稿 □撰寫中 □無專利：□已獲得 □申請中 ■無

技轉：□已技轉 ■洽談中 □無其他：（以 100 字為限）

論文

國際期刊論文有 3 篇:

1. Advanced Material Research (EI) 2. Advanced Science Letters (SCI) 3.

International J. of Energy (SCI EI) 國際期刊有 1 篇: 審查中

WSEAS Trans. J. (SCI)

國外研討會有 5 篇國內有 1 篇、碩士論文有一專利

實體雛型之實驗數據驗證再作專利申請技術移轉

洽談中:喜室(Hess energy Co.) 台灣寶熊

3. 請依學術成就、技術創新、社會影響等方面，評估研究成果之學術或應用價值（簡要敘述成果所代表之意義、價值、影響或進一步發展之可能性）（以 500 字為限）

建築物越來越注重本身自己就是節能減碳有效率，因此自然通風、太陽能加溫與致冷、地溫空氣熱交換、自然光線及避陽遮蔭…等自然被動式不需要消耗太多能量的設置，將是綠色建築的不二選擇，本研究三機一體將薄膜光伏電熱太陽能板空氣收集器(PV/T air collector), 收集熱氣驅動氣流、搭配地溫空氣熱交換(EAHE)來的氣流與吸收透過窗戶或太陽能板光線的穩態形狀相變材料(SSPCM)之儲熱儲能，整合出一棟完全被動式混成系統建築。考慮新材料與建築服務結合的綠色設計新觀念，再以一棟位於台灣新竹地區沒有空調的建物為探討對象，來數值分析仲夏夜晚通風情況下，氣、電及熱的需求與影響，分析

在文檔中行政院國家科學委員會專題研究計畫成果報告 (頁 34-46)