• 沒有找到結果。

Chapter 5 Sunny Egg Architecture

5.4 TSV utilization issue

Fig. 41(a) shows the areas of BSL and the four representative patterns of each architecture, IS20=SP(20, 1), ES2=SP(32, 2), SP(20, 2), SE(32, 2, 0.6, 8, 2), in which all values are normalized to BSL and Fig. 41(b) shows the corresponding average TSV utilization of these patterns. Initially, the TSV utilization of BSL is extremely low (<10%). After reducing the redundant TSVs by IS, ES, SP and SE, the TSV utilization increases but it is still low (≦30%) even with 52% area reduction at most. The main reason is that the dimension of a FPGA under a given layer is fixed regardless of the sizes of test cases. The problem arises when a small test case is put into a large capacity FPGA, lots of TSVs will be left unused and thus it decreases the overall TSV utilization. As a matter of fact, the TSV

43

utilization from a single case clma under SE(32, 2, 0.6, 8, 2) in Fig. 41(b), which achieves 50% at most, is not as low as the utilization of overall average.

(a)

(b)

Fig. 41. The (a)normalized areas/(b)TSV utilizations among different patterns.

Chapter 6 Conclusion

In this thesis, we first show that the utilization of TSVs is extremely low (<

10%) in the baseline architecture (BSL) where all SBs are fully connected 3D-SBs.

Then we present two architectures for area (TSV) reduction: the internally-sparse (IS) architecture through reducing the number of TSVs in each 3D-SB, and the externally-sparse (ES) architecture through reducing the number of available 3D-SBs. In combination of IS and ES, we further develop the hybrid sparse architecture (SP). In the end, we propose the ultimate sunny egg (SE) architecture, which incorporates two different SP architectures with different TSV densities in the central and peripheral region respectively.

After extensive evaluations over all architecture styles, two generic 3D FPGA architectures are most recommended; that is, SP(20, 2) and SE(32, 2, 0.6, 8, 2), which maximize the area reduction (up to 52%) with an acceptable delay penalty (< 3%). Therefore, we believe that all the ideas and architecture styles revealed in this thesis can serve as a robust foundation for developing even more practical 3D FPGA architectures.

45

Reference

[1] International Technology Roadmap for Semiconductor. Semiconductor Industry Association 2005–2009.

[2] R. R. Tummala and V. K. Madisetti, “System on chip or system on package?”

Design & Test Computers, vol. 16, no. 2, pp. 48–56, Apr.–Jun. 1999.

[3] P. H. Shiu, R. Ravichandran, S. Easwar, and S. K. Lim, “Multi-layer floorplanning for reliable system-on-package,” Int’l Symp. Circuits and System, 2004, pp. 23–26.

[4] K. L. Tai, “System-In-Package (SIP): challenges and opportunities,” Asia South Pacific Design Automation Conf., 2000, pp. 191–196.

[5] SOCcentral. [Online]. Available: http://www.soccentral.com

[6] I. Loi, S. Mitra, T. H. Lee, S. Fujita, and L. Benini, “A low-overhead fault tolerance scheme for TSV-based 3D network on chip links,” Int’l Conf.

Computer-Aided Design, 2008, pp. 598–602.

[7] S. Das, A. P. Chandrakasan, and R. Reif, “Calibration of rent's rule models for three-dimensional integrated circuits,” IEEE Trans. Very Large Scale Integration Systems, vol. 12, no. 4, pp. 359–366, Apr. 2004.

[8] A. Rahman and R. Reif, “System-level performance evaluation of three-dimensional integrated circuits,” IEEE Trans. Very Large Scale Integration Systems, vol.8, no.6, pp.671–678, Dec. 2000.

[9] S. Das, A. Fan, K. Chen, C. S. Tan, N. Checka, and R. Reif, “Technology, performance, and computer-aided design of three-dimensional integrated circuits,” Int’l Symp. Physical Design, 2004, pp.108–115.

[10] I. Kaya, S. Salewski, M. Olbrich, and E. Barke, “Wirelength reduction using 3D physical design,” Int’l Workshop Integrated Circuit System Design, 2004, pp.

453–462.

[11] A. Rahman and R. Reif, “Thermal analysis of three-dimensional (3D) integrated circuits (ICs),” Int’l Interconnect Technology Conf., 2001, pp. 157–159.

[12] W. R. Davis, J. Wilson, S. Mick, J. Xu, H. Hua, C. Mineo, A.M. Sule, M. Steer, and P. D. Franzon, “Demystifying 3D ICs: the pros and cons of going vertical,”

Design & Test Computers, vol. 22, no. 6, pp. 498–510, Nov.–Dec. 2005.

[13] K. Banerjee, S. J. Souri, P. Kapur, and K. C. Saraswat, “3D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration,” Proc. IEEE, vol. 89, no. 5, pp. 602–633, May 2001.

[14] V. Betz, J. Rose, and A. Marquardt, Architecture and CAD for deep-submicron FPGAs, Kluwer Academic Publishers, 1999.

[15] VPR: versatile packing, placement and routing for FPGAs. [Online]. Available:

http://www.eecg.toronta.edu/~vaughn/vpr/vpr.html

[16] T. Tuan and B. Lai, “Leakage power analysis of a 90nm FPGA,” Custom Integrated Circuits Conf., pp. 57–60, Sep. 2003.

[17] M. Lin, A. El Gamal, Y.-C. Lu, and S. Wong, “Performance benefits of monolithically stacked 3D FPGA,” IEEE Trans. Computer-Aided Design Integrated Circuits Systems, vol. 26, no. 2, pp. 216–229, Feb. 2007.

[18] C. Dong, D. Chen, S. Haruehanroengra, and W. Wang, “3D nFPGA: a reconfigurable architecture for 3D CMOS/nanomaterial hybrid digital circuits,”

IEEE Trans. Circuit System I: Regular Papers, vol. 54, no. 11, pp. 2489–2501, Nov. 2007.

[19] C. Ababei, H. Mogal, and K. Bazargan, “Three-dimensional place and route for FPGAs,” IEEE Trans. Computer-Aided Design Integrated Circuits Systems, vol.

25, no. 6, pp. 1132–1140, Jun. 2006.

[20] C. Ababei, Y. Feng, B. Goplen, and Mogal Hushrav, T. Zhang, K. Bazargan, Sapatnekar Sachin, “Placement and routing in 3D integrated circuits”, Design &

Test Computers,vol. 22, no. 6, pp. 520–531, Nov.–Dec. 2005.

[21] TPR: three-dimensional placement and route for FPGAs. [Online]. Available:

http://www.ece.umn.edu/users/kia/mount/Download/

[22] K. Siozios, V. F. Pavlidis, and D. Soudris, “A software-supported methodology for exploring interconnection architectures targeting 3D FPGAs.” Design, Automation Test Europe Conf. Exhibition, 2009, pp. 172–177.

[23] K. Siozios, A. Bartzas, and D. Soudirs, “Architecture-level exploration of alternative interconnection schemes targeting to 3D FPGAs: a software-supported methodology,” Int’l Journal Reconfigurable Computing, vol.

2008, Article ID 764942, 2008.

[24] Altera. [Online]. Available: http://www.altera.com/

[25] Xilinx. [Online]. Available: http://www.xilinx.com/

[26] A. Rahman, S. Das, A. P. Chandrakasan, and R. Reif, “Wiring requirement and three-dimensional integration of field-programmable gate arrays,” Int’l Workshop System-level Interconnect Prediction, 2001, pp. 107–113.

[27] A. Rahman, S. Das, A.P. Chandrakasan, and R. Reif, “Wiring requirement and three-dimensional integration technology for field programmable gate arrays,”

IEEE Trans. Very Large Scale Integration Systems, vol. 11, no. 1, pp. 44–54, Feb.

2003.

[28] C. S. Tan, R. J. Gutmann, and L. R. Reif, Editors, Wafer level 3-D ICs process

47

technology, MA: Springer, 2008.

[29] S. Yang, “Logic synthesis and optimization benchmarks user guide,” Technical Report 1991-IWLS-UG-Saeyang, Microelectronics Center of North Carolina, 1991.

[30] [Online]. Available: http://www.eecs.berkeley.edu/~alanmi/benchmarks/

[31] Y.-S. Huang, Y.-H. Liu, and J.-D. Huang, “Iterative 3D partitioning for through-silicon via minimization,” 16th Workshop Synthesis and System Integration Mixed Information Technologies, 2010.

相關文件