The Study of Junction Temperature of High Power GaN Light Emitting Diodes 黃文祥、廖豐標
E-mail: [email protected]
ABSTRACT
LED (Light Emitting Diode) is one of the photo-electronic devices for P-N semiconductor materials of associative. There are many good selling points for LED such as small size, long lifetime, low consume electric, response fast. Therefore, LED products are getting more and more popular. Except for traffic sights and outdoor-boards, high-power LEDs gain territory in the applications of the back-lighting systems and solid-state illumination. High-power LEDs requiring high currents drive generate much heat, relatively the temperature of active region control extremely important, because the heat generated in the active layer region would increase more and more, leading to degradation in illumination efficiency and reliability. Therefore, representing the high power of light emitting diodes and high efficiency at the same time, the temperature of active region must be paid attention to too. To evaluate the heat management system, a precise measurement system for junction temperatures of light emitting diodes is highly desirable. We applied the forward voltage method to measure the junction temperature of light emitting diodes and developed an automatic measurement system for the junction temperature of light emitting diodes. So, this thesis depicts importance for the junction temperature of high-power LEDs, and demonstrated that advantages of characterization of junction temperature by using the forward voltage method.
Keywords : Junction Temperature ; Forward Voltage Method ; Light-Emitting Diode Table of Contents
封面內頁 簽名頁 授權書...iii 中文摘要...iv 英文摘 要...v 誌謝...vi 目
錄...vii 圖目錄...ix 表目 錄...xi 第一章 緒論...1 1.1 前 言...1 1.2 研究目的與方法...2 1.3 論文結
構...4 第二章 實驗原理...6 2.1 發光二極體原理及介 紹...6 2.2 半導體材料效應...10 2.2.1 氮化鎵材料特性及發 展...12 2.2.2 直接能隙與間接能隙材料特性...16 2.2.3 溫度對能隙之影 響...17 2.2.4 溫度對波長之影響...18 2.3 發光效率之提升方 式...21 2.3.1 雙異質結構...22 2.3.2 表面粗化重要性及技 術...24 2.4 固晶種類與應用...25 2.4.1 銀膠固
晶...26 2.4.2 共金固晶...27 2.4.3 覆晶固
晶...28 2.5 氮化鎵發光二極體製程技術...29 第三章 實驗方 法...31 3.1 實驗步驟及架構...32 3.2 順向電壓法...
...36 3.3 校正量測 ...40 3.4 實際量
測...43 第四章 實驗樣品製備...45 4.1直流電流造成發光效率衰減 之效應...47 4.2 脈衝電流造成發光效率衰減之效應...48 4.3接面溫度和載子濃度 對LED發光效率衰減的影響...51 4.4 共金與非共金固晶LED接面溫度量測結果...54 4.5 不同 元件結構之銀膠LED接面溫度量測結果...58 第五章 結論...63 參考文 獻...65
REFERENCES
[1] S. Nakamura and S. F. Chichibu, “Introduction to Nitride Semiconductor Blue Laser Diode and Light Emitting Diodes, London, U.K: Taylor and Francis, 2000.
[2] A. Zukauskas, M. S. Shur, and R. Gaska, “Introduction to Solid- State Lighting,” New York: Wiley, 2002.
[3] 陳健中,蘇炎坤, 光子晶體發光二極體, LED固態照明專題 [4] Varshni Y. P, “Temperature Dependence of the Energy Gap in Semiconductor,” Physics 34(1), 149 (1967).
[5] H. Y. Fan, “Temperature Dependence of the Energy Gap in Semiconductors,” Phys. Rev. 82, 900-905, 1951.
[6] N. Holonyak, Jr., and S. F. Bevacqua, “Coherent (visible) light emission from Ga (As 10x Px) junctions,” Appl. Phys. Lett., vol. 82, 1962.
[7] 陳隆建,發光二極體之原理與製程,全華圖書股份有限公司,2006 [8] M.R. Krames, J. Bhat, D. Collins, N. F. Gardner, W. Gotz, C. H.
Lowery, M. Ludowise, P. S. Martin, G. Mueller, R. Mueller-Mach, S. Rudaz, D. A. Steigerwald, S. A. Stockman, and J. J. Wierer, “High-Power III-Nitride Emitters for Solid-State Lighting,” phys. stat. sol. (a)192, No. 2, 237-245, 2002.
[9] Cai, S. J. Li, R. Chen, Y. L. Wong, L. Wu, W. G. Thomas, S. G. Wang, K.L., “High performance AlGaN/GaN HEMT with improved ohmic contacts,” IEEE Vol. 34, Issue.24, pp. 2354-2356, 1998.
[10] F. A. Ponce, “Group III Nitride Semiconductor Compounds Physics and Applications”, pp.123-133, 1998.
[11] S. Yoshida, S. Misawa, and S. Gonda, “Improvements on the electrical and luminescent properties of reactive molecular beam epitaxially grown GaN films by using AlN-coated sapphire substrates”Appl. Phys. Lett , Vol. 42, pp. 427-429, 1983.
[12] H. Amino, N. Sawaki, I. Akasaki and Y. Toyota, “Metalorganic vapor phase epitaxial growth of a high quality GaN film using an AlN buffer layer,” Appl. Phys. Lett, Vol. 48, pp. 353-355, 1986.
[13] For a review, see S. Nakamura and G. Fasol, “The Blue Laser Diode: GaN Based Light Emitters and Lasers,”Springer-Verlag, Heidelberg, 1997, 1st ed.
[14] S. Nakamura, “In Situ Monitoring of GaN Growth Using Interference Effects,” Jpn. J. Appl. Phys, Vol. 30, pp. 1620- 1627, 1991.
[15] Shuji Nakamura, Masayuki Senoh, Shin-ichi Nagahama, Naruhito Iwasa, Takao Yamada, Toshio Matsushita, Hiroyuki Kiyoku and Yasunobu Sugimoto, “InGaN-Based Multi-Quantum-Well- Structure Laser Diodes”, Jpn. J. Appl. Phys. 35, pp. L74-L76, 1996.
[16] M. B. Panish, H. C. Casey, JR, “Temperature Dependence of the Energy Gap in GaAs and GaP,”Journal of Applied Physics. vol 40. no 1, 1969.
[17] M. S. Shur, R. F. Davis, “GaN-Based Materials and Devices: Growth Fabrication, Characterization and Performance,” World Scientific, pp.6-11, 2004.
[18] Yanagisawa T, “The degradation of GaAlAs red light-emitting diodes under continuous and low-speed pulse operation,”Microelectronics Reliability, 38, pp. 1627-1630, 1988.
[19] Gu Y, Narendran N. “A non-contact method for determining junction temperature of phosphor-converted white LEDs,” Third International Conference on Solid State Lighting, Proc. SPIE. 2004, 5187: 107-114 [20] T. N. Oder, K. H. Kim, J. Y. Lin, and H. X. Jiang, “
Ⅲ-nitride blue and ultraviolet photonic crystal light emitting diodes,” Appl. Phys. Lett., vol 84, pp. 466-468, 1999.
[21] Shuji. Nadamura, Masayuki Senoh, and Takashi Mukai,“High-power InGaN/GaN double-heterostructure violet lightemitting diodes,”
App. Phys. Lett. , Vol. 62, pp. 2391-2392, 1993.
[22] T. Fujii, Y. Gao, R. Sharma, E. L. Hu, S. P. DenBarrs, and S. Nadamura, Increase in the extraction efficiency of GaN-based light-emitting diodes via surface roughening, Appl. Phys. Lett. , vol 84, pp. 855-857, 2004 [23] 蘇晉鋒 影像顯示科技人才培訓網-知識平台, 8/09-/11/09 (2007).
[24] Liao, Michael P. (2007) “Carrier Concentration and Junction Temperature Dependencies of Illumination Efficiency of GaN Power Light-Emitting Diodes”, 2007 Conference on Lasers and Electro-optics, Baltimore, MD.
[25] Gu, Y. and N. Narendra, “A non-contact method for determining junction temperature of phosphor-converted white LEDs,” 3rd Conference on Solid State Lighting, Proceedings of SPIE 5187, 107-114, 2004.
[26] Hong, E. and N. Narendran, “A method for projection useful life of LED lighting system,” 3rd Conference on Solid State Lighting, Proceedings of SPIE 5187, 93-99, (2004) [27] Y. Xi, and E. F. Schuber, “Junction –temperature measurement in GaN ultraviolet light-emitting diodes Using Diode Forward Voltage Method,” Appl. Phys. Lett., vol. 85, no.12, pp 2163- 2165, 2004.
[28] A. J. Fischer, M. H. Crawford, K. H. A. Bogart and A. A. Allerman, “Junction and carrier temperature measurements in deep-ultraviolet light-emitting diodes using three different methods,” Applied Physics Letters 86, 031907, 2005.
[29] 鄭景太, 高功率LED熱管理技術與量測, 工業材料雜誌256期, April 8 (2008) [30] 美商國家儀器公司(National Instrument;NI) DAQ Card PCI-6221操作手 冊,pp. 27-35.
[31] 美商國家儀器公司(National Instrument;NI) SCB-68 68-Pin Shielded Connector Block User Manual.
[32] Y. Xi, T. Gessmann, Jingqun Xi, Jong Kyu Kin, Jay M. Shah, E.F Schuber, A J. Fischer, M H. Carwford, Katherine H. A. Bogart and Andrew A. Allerman, “Junction Temperature in Ultraviolet Light-Emitting Diodes,” JJAP Vol. 44 , No. 10, pp. 7260-7266, 2005.
[33] J.Miliman and C.Halkias, Integrated Electronics(McGraw-Hill, New York,1972) [34] Farkas, G., S. Haque, F. Wall, P. S. Martin, A Poppe, Q. van Voorst Vader, G. Bognar, “Electric and Thermal Transient Effects in High Power Optical Devices,” Proceedings of the 20th IEEE SEMI-THERM Symposium, San Jose, CA, 2004.
[35] Michael P. Liao, “DC Current-Induced Rollover of Illumination Efficiency of GaN-Based Power LEDs,”IEEE Photonics Technology Letters, Vol. 19, no. 24, pp2000-2002. 2007.
[36] http://www.cree.com (Cree科技) [37] http://www.harvatek.com.tw (宏齊科技) [38] http://www.forepi.com.tw(燦圓科技)