義守大學 98 學年度研究所碩士在職專班考試試題
系所別 材料科學與工程學系 考試日期 98/4/18
考試科目 材料科學與工程 總頁數
※此為試題卷，請將答案填寫在答案卷內，未寫於答案卷內者，不予計分。
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備註：試題隨答案卷繳交 第 1 頁
1. 試翻譯下述內容 (20%)
“ Three different types of primary or chemical bond are found in solids－ionic, covalent, and metallic. For each type, the bonding necessarily involves the valence electrons;
furthermore, the nature of the bond depends on the electron structures of the constituent atoms. In general, each of these three types of bonding arises from the tendency of the atoms to assume stable electron structures, like those of inert gases, by completely filling the outermost electron shell.”
2. 試詳述下列名詞之物理意義: (20%) (a) plastic deformation
(b) fatigue (c) hardness (d) toughness (e) yield strength
3. (a) 何謂 heat capacity (熱容量)？何謂 specific heat (比熱)？兩者有何不同？
(b) 固體材料中熱傳導的機構為何？
(c) 材料產生熱應力(thermal stress)之原因為何？ (15%) 4. (a) 何謂歐姆定律(Ohm’s Law)？
(b) 試說明 intrinsic semiconductor 及 extrinsic semiconductor 之異同
(c) 何謂 Ferroelectricity (鐵電性)？何謂 Piezoelectricity (壓電性)？ (15%)
5. 試說明 BCC, FCC, 及 HCP 三種晶體結構中下列各項參數為何? (15 %) (a) number of atoms associated with each unit cell
(b) coordination number (c) atomic packing factor
6. (a) 試就分子構造、加熱特性等方面說明熱塑性(thermoplastic)及熱固性(thermosetting) 高分子的差異。
(b) 試分別詳述加成聚合反應(Addition Polymerization)與縮合聚合反應(Condensation Polymerization)之意義，兩者間有何差異？ (15 %)
