第五章 研究成果總結與衍生貢獻
5.3 國內外論文發表與專利
(f) Tmold=180℃
圖5-18 不同模具溫度之充填流動短射圖
(Material=PS,Thickness=100µm,Speed=80mm/sec,Tmelt=240℃)
5.3 國內外論文發表與專利
期刊論文：
1. S. Y. Yang, S. C. Nian and I. C. Sun, “Flow Visualization of Filling Process during Micro-Injection Molding”, International Polymer Processing, Vol. XVII, No. 4, pp.354-360 (2002).
2. C.-W. Wu, L.-S. Huang, J.-H. Chang, S.-Y. Yang, C.-K. Lee, “A novel micro-scale recombining technique using lateral joining for a beyond-wafer-size molding with micro features,” accepted in Sensors and Actuators, Physics, 2003
3. J. H. Chang and S. Y. Yang, “Gas Pressurized Hot Embossing for Transcription of Micro-features”, Microsystem Technologies, 10, pp76-80 (2003).
4. J. H. Chang and S. Y. Yang, “Hot Embossing for Transcription of Micro-Features onto Large Thermoplastic Films”, Journal of Manufacturing Processes, revised, (2003).
5. J. H. Chang and S. Y. Yang, “Development of Fluid-Based Heating and Pressing Systems for Micro Hot Embossing”, Microsystem Technologies,in press, (2004).
國際研討會論文：
1. C.-W. Wu, L.-S. Huang, J.-H. Chang, S.-Y. Yang, C.-K. Lee, “A novel micro-scale recombining technique using lateral joining for a beyond-wafer-size molding with micro features,” IEEE MEMS 2003, pp.279-282, Kyoto, Japan.
2. S. Y. Yang, S. C. Nian and I. C. Sun, “The Flow Visualization of Micro-Injection
Molding”, Proceeding of PPS-2002, Polymer processing Society, Taipei, Taiwan, November 4-8, 2002.
3. S. Y. Yang, S. C. Nian and I. C. Sun, “Experimental Study on The Filling Characteristics During Micro-Injection Molding”, Proceeding of PPS-18, 18th International Meeting of Polymer proceeding Society, June 2002.
4. Sen-Yeu Yang and Jer-Haur Chang, “Gas Pressurized Hot Embossing – A Novel Method is Developed”, Proceeding of PPS-19, 19th International Meeting of Polymer proceeding Society, June 2003.
5. Sen-Yeu Yang and Jer-Haur Chang, “Hot Embossing for Transcription of Micro-Features onto Large Thermoplastic Films”, Proceeding of PPS-19, 19th International Meeting of Polymer proceeding Society, June 2003.
6. S. C. Nian, S. Y. Yang, and C. H. Lin, “Study on the Performance of Rapid Mold Heating/Cooling System for Micro Injection Molding”, Proceeding of PPS-19, 19th International Meeting of Polymer proceeding Society, June 2003.
7. Jer-Haur Chang and Sen-Yeu Yang, “Development of Rapid Heating and Uniformly Pressing System for Micro Hot Embossing, Technical Papers of ANTEC, pp.
942-945, Chicago, IL, (2004).
國內研討會論文：
2. 張哲豪，楊申語，”氣體微熱壓印成型方法”， 中華民國發明專利，民國 93 年。(發明第 193140 號)
3. 李世光，黃榮山，陳文中，湯競恆，李清華，”高光感效率之影像感應裝置及 其製造方法”，中華民國發明專利，專利公告號：475334，民國 91 年。(發明 第151363 號)
4. 李世光，黃榮山，陳文中，湯競恆，李清華，” 影像感應器之結構整合’，中 華民國發明專利，專利公告號：473942，民國 91 年。(發明第 151007 號) 5. ”High light-sensing efficiency image sensor apparatus and method”, Pub. No.: US
2002.0135825 A1, Pub. Date: Sep. 26, 2002, United States Patent Application Publication.(尚在審查中,申請字號:09/904, 733)
參考文獻
1.K. S. Sengupta, R. Sundahl, S. kawashima, R. Arellano, C. Sklenicka, D. Thompson,
‘‘Packaging Requirements and Solutions for CMOS Imaging Sensor,’’ 1998 IEEE/CPMT Int’l Electronics Manufacturing Technology Symposium, 1999, pp.
194~198.
2.T. Morris, E. Fletcher, C. Afghahi, S. Issa, K. Connolly, J. C. Korta, ‘‘A Column-speed Digital Image Process,’’ Intel Corporation. Retrieved June 23, 2001, from IEEE database.
3.P. Wong. (June, 1997). CMOS Image Sensor－Recent Advances and Device Scaling Considerations, Thomas J. Watson Research Center, I.B.M. Retrieved June 23, 2001, from IEEE database.
4.A. D. Blanksby, M. J. Loinaz, ‘‘ Performance Analysis of a Color CMOS Photogate Image Sensor, ’’ IEEE Transactions on Electron Devices, vol. 47, no.1, pp. 55~64, JAN. 2000.
5.E. R. Fossum, ‘‘CMOS Image Sensor: Electronic Camera-On-A-Chip,’’ IEEE Transactions on Electron Devices, VOL. 44, NO. 10, pp. 1689~1698, Oct. 1997.
6.E. R. Fossum. (May-June, 1998). Digital Camera System on a chip, Photobit Corporation. Retrieved Oct. 11, 2000, from IEEE database.
7. E. R. Fossum, ‘‘Digital camera system on a chip, ” IEEE Micro, May-Jun 1998.
8. 邱志榮，”CCD 與 CMOS 影像感測器產業發展趨勢”，工研院經資中心，民 國89 年 9 月。
9. W. Daschner, P. Long, R. Stein, C. Wu, and S. H. Lee, ‘‘Cost-effective mass fabrication of multilevel diffractive optical elements by use of a single optical exposure with a gray-scale mask on high-energy beam-sensitive glass,” Applied Optics, vol.36, No.20, pp.4675~4680, July 1997.
10. 曲昌盛，‘‘灰階光罩微影技術製作繞射光學元件，” 光訊，第 80 期，pp.23-27，
1999 年 10 月。
11. H. Becker and C. Gartner, “Polymer microfabrication methods for microfluidic analytical applications”, Electrophoresis, Vol. 21, pp. 12-26, 2000.
12. 劉士榮，”高分子流變學~塑膠之加工特性”，高立圖書總經銷，民國 84 年 6 月。
13. 劉士榮，”塑膠加工學”，高立圖書總經銷，民國 88 年 9 月。
14. C. Kukla, H. Loibl, H. Detter, “Micro-Injection moulding - the aims of a project partnership”, Kunststoffe Plast Europe, pp.1331-1336, (Sep 1998).
15. J. Greener, "General Consequences of the Packing Phase in Injection Molding, "
Polymer Engineering Science, Vol.26, No.12, p.886 (1986).
16. Friedrichs, "Injection Compression Moulding of Thin-Walled Thermoplastic Parts,
" Kunststoffe German Plastics, Vol.80, No.5, p.13 (1990).
17. 孫一強，"微量射出成型之充填特性觀察與玻璃材料應用於微型模具可行性探 討"台灣大學機械工程研究所，碩士論文，民國 90 年 6 月。
18. 陳宗平，"微射出模溫控制系統及微結構轉寫能力探討"台灣大學機械工程研究 所，碩士論文，民國 90 年 6 月。
19. 林志鴻，"微射出快速變模溫控制系統及微結構轉寫性探討"台灣大學機械工程 研究所，碩士論文，民國91 年 6 月。
20. 羅志謙，"微射出快速模溫控制系統與雙面微結構成型性探討"台灣大學機械工 程研究所，碩士論文，民國92 年 6 月。
21. 黃勝田，"雙面微結構超薄件微射出成型之實驗探討"台灣大學機械工程研究 所，碩士論文，民國 93 年 6 月。
22. 王培良，”塑膠微熱壓成型特性之研究”， 國立交通大學機械工程研究所碩士 論文，民國 87 年 6 月。
23. 賴文童，“微結構熱壓成形缺陷之探討”，國立交通大學機械工程研究所碩 士論文，民國 89 年 6 月。
24. 張哲豪，"流體微熱壓製程開發研究"台灣大學機械工程研究所，博士論文，
民國93 年 6 月。
25. R. W. Jaszewski, H. Schift, J. Gobrecht and P. Smith, "Hot embossing in polymers as a direct way to pattern resist", Microelectronic Engineering, Vol. 41/42, pp.
575-578,1998.
26. L. Lin, Y. T. Cheng and C. J. Chiu, "Comparative study of hot embossed micro structures fabricated by laboratory and commercial environments ", Microsystem Technologies, Vol. 4, pp. 113-116, 1998.
27. M. Heckele, W. Bacher and K. D. Muller, "Hot embossing - The molding technique for plastic microstructures". Microsystem Technologies, Vol. 4, pp.122-124, 1998.
28. K. D. Muller, W. Bacher, and M. Heckele, “Flexible integrated of nonsilicon microstructures on microelectronic circuits”, Proceedings of the IEEE Micro Electro Mechanical Systems, pp. 263-267, 1998.
29. Becker, H., Heim, U., “Silicon as tool material for polymer hot embossing”, Twelfth IEEE International Conference on Micro Electro Mechanical Systems, MEMS '99, pp. 228-231 (1999).
30. Becker, H., Heim, U., “Hot embossing as a method for the fabrication of polymer high aspect ratio structures”, Sensors and Actuators A: Physical, Vol. 83, pp.
130-135 (2000).
31. Juang, Y.J., Lee, L.J., Koelling, K.W., “Hot Embossing in Microfabrication. Part I:
Experimental”, Polymer Engineering and Science, Vol. 42, No. 3, pp. 539-550 (2002).
32. Shen, X.J., Pan, L.W., Lin, L., “Microplastic embossing process: experimental and theoretical characterizations”, Sensors and Actuators A: Physical, 97-98, pp.
428-433 (2002).
33. Lin, C.R., Chen, R.H., Hung, C., “Preventing non-uniform shrinkage in open-die hot embossing of PMMA microstructures”, Journal of Materials Processing Technology, Vol. 140, pp. 173-178 (2003).
附件一：國科會產學合作新聞
產學研究案，正是為了突破此產業困境，獎勵國內廠商創新研 發利基型產品。
參與研究的台大機械工程研究所楊申語教授表示，彩色影像感 測器一般都以濾光片局部過濾偵測各個圓點的紅、綠、藍光，
轉成電能傳輸後再顯示。不過，濾光片光效率低而且製程繁 複，因此這個研究計畫以光柵分光，與微透鏡結合於一微元 件，並以塑膠複製技術降低成本，結果成功製成的創新型增光 分色片，比傳統濾光片光效率還高，最少可達41%。
此外，這種新型增光分色片比傳統濾光片的製程更為容易，成 本更低，同時，還建立了從上游至下游全套微光學元件設計製 造技術，並且成功開發應用於數位相機與液晶平面顯示器的高 效率、低成本的關鍵微光學元件。
楊申語指出，除了創新型微光學增光分色片之外，未來在灰階 光罩微影技術、精密電鑄翻模技術、整合微光機電製程與精密 塑膠微成型技術等方面，都能提供相當程度的技術支援。
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