• 沒有找到結果。

第六章 結論與未來研究方向

6.3 未來研究方向

參考文獻

A. D. Feinerman, R. E. Lajos, V. White and D. D. Denton, “X-ray lathe: an X-ray lithographic exposure tool for nonplanner objects”, Journal of Microelectromechanical systems, Vol. 5, No.4 (1996).

C. Marques, Y. M. Desta, J. Rogers, M. C. Murphy, and Kevin Kelly, “Fabrication of High-aspect-ratio microstructures on planar and nonplanar surfave using a modifies liga process”, Journal of Microelectromechanical systems, Vol. 6, No. 4 (1997).

C. R. Martin and I. A. Aksay, “Microchannel molding: A soft lithography inspired approach to micrometer scale patterning”, J. Mater. Res., Vol. 20, No. 8 (2005).

C. Y. Chang, S. Y. Yang, J. L. Sheh, “A roller embosiing process for rapid fabrication of microlens arrays on glass substrates”, Microsyst. Technol (2006) 12, pp. 754-759.

C. Y. Chang, S. Y. Yang, M H Chu, “Rapid fabrication of ultraviolet-cured polymer microlens arrays by soft roller stamping process”, Microelecronics Engineering, v84, n2, pp.

355-361 (2007).

Chao-Heng Chien, Zhi-Peng Chen, “Fabrication of a novel integrated light guiding plate by microelectromechanical systems technique for backlight system”, Journal of Microlithography, Microfabrication and Microsystems, v5, n4, pp. 043011 (2006).

Chan I. Chung, “Extrusion of polymers : theory and practice”. (2000).

Ed. Lowenheim, “Modern electroplating”, John Wiley & Sons, (1974)

E. Kukharenka, M. M. Farooqui, L. Grigore, M. Kraft and N. Hollinshead, “Electroplating moulds using dry film thick negative photoresist”, J. Micromech. Microeng. 13. pp.67-74

G. O. Mallory and J. B. Hajdu, “Electroless Plating, Fundamentals and Applications”, AESF (1990).

H. Lorenz, L. Paratte, R. Luthier, N. F. de Rooij and P. Renaud, “Low-cost technology for multilayer electroplated parts using laminated dry film resist”, Sensors and Actuators A 53 pp.364-368 (1996).

H. Tan, A. Gilbertson and S. Y. Chou, “Roller nanoimprint lithography”, J. Vac. Sci.

Technol. B 16(6), (1998).

H.Ito, I.Satoh, T.Saito, K.Yakemoto, “A Melt-Transcription process to fabricate thermoplastic products with homogeneous surface micro structures applied to display parts and micro-fluidic devices”, Proc. of PPS-22, SP6.17 (2006).

James R. Sheats, “Roll-to-roll manufacturing of thin film electronics”, Proceedings of SPIE - The International Society for Optical Engineering, v 4688, n 1, pp. 240-248 (2002).

J. Zhu, A. S. Holmes, J. Arnold, R. A. Lawes and P.D. Prewett, “Laminated dry film resist for microengineering applications”, Microelectronics Engineering.30 pp.365-368(1996).

K. Fujimoto, S. Fujita, B. Ding and S. Shiratori, “Fabrication of layer-by-layer self-assembly films using roll-to roll process”, Japanese Journal of Applied Physics, Vol. 44, No.3, (2005), pp. 126-128.

K Stephan, P Pittet, L Renaud, P Kleimann, P Morin, NOuaini and R Ferrigno, “Fast prototyping using a dry film photoresist: microfabrication of soft-lithography masters for microfluidic structures”, J. Micromech. Microeng. 17. N69-N74(2007).

M. B. Chan-Park, W. K. Neo, “Ultraviolet embossing for patterning high aspect ratio

M. Meiler, M. Pfestorf, M. Geiger, M. Merklein, “The use of dry film in aluminum sheet metal forming”, Wear 255 pp.1455–1462 (2003).

M. E. Sandison and H. Morgan, “Rapid fabrication of polymer microfluidic systems for the production of artificial lipid bilayers”, J. Micromech. Microeng. 15(2005) pp.139-144.

M. He, X.-C. Yuan, N. Q. Ngo, J. Bu, and V. Kudryashov, “Simple reflow technique for fabrication of a microlens array in solgel glass”, OPTICS LETTERS ,Vol. 28 ,No. 9 (2003).

M. T Gale, “Replication techniques for diffractive optical elements ”, Microelecronics Engineering 34 pp. 321-339(1997).

M Heckele, W K Schomburg, “Review on micro molding of thermoplastic polymers”, Journal of Micromechanics and Microengineering, v 14, n 3, pp. R1-R14 (2004).

Montgomery, “Design and Analysis of Experiments” 6th Edition”.

Manaresi, M. Tartagni and R. Guerrieri, “Microfluidic channel fabrication in dry film resist for production and prototyping of hybrid chips”, Lab on a Chip, 5, pp.158-162 (2005).

P. Vulto, N. Glade, L. Altomare, J. Bablet, L. Del Tin, G. Medoro, I. Chartier, N.

K Stephan, P Pittet, L Renaud, P Kleimann, P Morin, NOuaini and R Ferrigno,” Fast prototyping using a dry film photoresist: microfabrication of soft-lithography masters for microfluidic structures” , J. Micromech. Microeng. 17 pp.69–74 (2007).

R. Parkinson, ”Properties and applications of electroless nickel”, NiDI (1997).

S. M. Seo, T. I. Kim, and H. H. Lee, “Simple fabrication of nanostructure by continuous rigiflex imprinting”, Microelectronics Engineering (2006).

S. Ahn, M. Choi, H. Bae, J. Lim, H. Myung, H. Kim, and S. Kang, “Design and fabrication of micro optical film by ultraviolet roll imprinting ”, Japanese Journal of Applied Physics, Vol. 46, No.8B, pp. 5478-5484 (2007).

T. Katoh, N. Nishi, M. Fukagawa, H. Ueno and S. Sugiyama, “Direct writing for three-dimensional microfabrication using synchrotron radiation etching”, Sensor and Actuators A 89 (2001) pp.10-15.

T. Kololuoma, M. Tuomikoski, T. Makela, J. Heilmann, T. Haring, J. Kallioinen, J. Hagberg, I. Kettunen, and H. Kopola, “Towards roll-to-roll fabrication of electronics, optics and

optoelectronics for smart and intelligent packaging”, Proceddings of SPIE Vol. 5363.

T. Makela, S. Jussila, H. Kosonenm, T. G. Backlund, H. G. O. Sandberg, and H. Stubb,

“Utilizing roll-to-roll techniques for manufacturing source-drain electrodes for all-polymer transistors”, Synthetic Metals 153 (2005) pp. 285-288.

V. L. Spiering, J. W. Berenschot and M. Elwenspoek,”Planarization and fabrication of bridges across deep grooves or holes in silicon using a dry film photoresist followed by an etch back” , J. Micromech. Microeng. 5 pp.189–192 (1995).

W. Riedel, “Electroless Nickel Plating”, Finishing Publication Ltd. (1991)

W. M. Choi and O. O. Park, “The fabrication of submicron patterns on curved substrates using a polydimethylsiloxane film mould”, Nanotechnology 15 pp.1767-1770 (2004).

W. P. Shih, Y. Cheng, C.Y. Lin and G. J. Hwang, “Low-cost X-ray conformal mask using dry film resist”, Microeleftronic Engineering 40 pp.43-50 (1998).

Y. C. Tsai, H. P. Jen, K. W. Lin and Y. Z. Hsieh, “Fabrication of microfluidic devices using dry film photoresist for microchip capillary electrophoresis”, Journal of Chromatography A, 1111(2006) 267-271.

Y. Xia and G. M. Whitesides, “Soft Lithography ”, Angew. Chem. Int. Ed. 37, pp.550-575 (1998).

Z. T. Ke, C. S. Lee, K. H. Shen and E.Y. Chang, “A study of the fabrication of Flip-Chip bumps using dry-film photttoresist process on 300mm wafer”, IEEE (2004).

張哲豪

”流體微熱壓製程開發研究” ,臺灣大學博士論文,民國93 年 6 月

黎正中,陳源樹編譯, “實驗設計與分析” ,高立出版,民國 92 年。

潘昆志, “微結構滾輪製造方法及結構” ,中華民國專利證書號數:I251266,民國 94 年。

謝正倫, “滾輪微結構壓印製程開發研究” ,臺灣大學碩士論文,民國94 年 6 月。

附錄 A CALIBRE™ 301-15 性質表

附錄 B UV1321 性質表

附錄 C 作者簡歷

作者:李志隆 性別:男

生日:民國72 年 11 月 01 日 E-mail:[email protected] 求學經歷:

國立台灣大學 機械工程學研究所 畢業(97.7) 國立高雄第一科技大學 機械與自動化工程系 畢業(95.6) 國立彰師附工 綜合高中部(機械組) 畢業(91.6)

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