以 58Ag–32Cu–10Pd、65Ag–20Cu–15Pd、68.8Ag-26.7Cu-4.5Ti 三種金屬 箔分別去接合 steel(Crofer 22)跟 YSZ，溫度設定在高於其金屬箔的液相線溫 度 20°C，依序分別為 870°C、920°C、920°C，持溫時間為 5 分鐘，再對接 合完的試片去做 SEM/EDS、TEM/EDS/SADP 的微觀結構分析。
兩個有包含 Pd 元素以及一個含有 Ti 元素的 Ag 基金屬箔，被用來接合 YSZ 和耐腐蝕性的 steel。用 SEM 和 TEM 並搭配 EDS 做 interlayer、
steel/interlayer、interlayer/YSZ 介面的微觀結構分析。在含有 Pd 元素的 interlayer 中，靠近 YSZ 側的 Cu-rich 相是 FCC Cu；它從 ZrO2溶解了大量 的 Zr 以及從 steel 溶解了一些 Fe、Cr。在靠近 steel 側 interlayer 層的 Cu-rich 相是序化的 Cu3Pd，而且其為 L12晶格結構。在 58Ag–32Cu–10Pd 金屬箔層 中，Ag 顆粒析出在 Cu3Pd 相；相比之下，在 65Ag–20Cu–15Pd 金屬箔層中，
是針狀的α-Fe(Cr) 相析出在 Cu3Pd 相。在 steel/interlayer 介面沒有發現反應 物，但是在 Ag-和 Cu-rich 相中有出現差排的現象。在 interlayer/YSZ 介面，
有 Ti3O5和 SiO2兩種反應物。在 YSZ、steel、interlayer 中有擴散，導致成 分的改變和反應物產生在介面，形成良好的接合面。
在含有 Ti 成分的金屬箔中，靠近 Steel 側的地方形成了 Fe2Ti 相，這是 因為 Fe 從不鏽鋼裡面擴散到金屬箔與 Ti 反應所形成的，以及在靠近介面的
91 Ag-Cu-Ti 的試片，其接合強度不管是剪應力還是拉應力都較 Ag-Cu-Pd 的試 片好，與氣密性實驗所得到的結果一致。推測可能是因為含有 Ti 成分的接 合試片有形成兩層緻密的氧化層 Ti2O3及 Fe2Ti4O，而根據文獻指出，形成 Fe2Ti4O 這層氧化層，可以提升接合的機械強度。
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