本研究針對POP封裝銅柱 (Pillar) 結構對整體基板級 (Substrate Level) 結構進行 模擬分析，POP結構分為上下兩層封裝體，兩個晶片封裝體藉由四週雙排銅柱結構將 兩層晶片堆疊封裝為一體。負載條件採用 JESD22-A104-B 規範，溫度週期範圍為 -55°C~125°C，每一個週期包含升溫、高溫停留、降溫、低溫停留各450秒，每一個週 期30分，連續三個週期，共5400秒。由於結構的對稱性，將建立1/4-3D實體模型。一 般封裝結構，由於錫球結構複雜、小元件例如銅墊片，這些結構相對整體而言尺寸比 例差異太大，所以將採用全域模型與次模型的技巧，先行忽略複雜結構，將主模型分 析後的結果當邊界條件，進而求取所欲探討關鍵位置的狀態。然而在全域模型中，將 以電腦可執行範圍內，盡可能考慮該有的元件，以至有較正確的全域模型反應。根據 全域模型反應，將嚴重的區域建立次模型技巧的分析，可了解凸塊、銅柱等的熱-機 行為。此處吾人檢視的項目包含: 全域模型Die 2應力；次模型Die 2凸塊應力及應變 範圍；全域模型Die 2基板應力；全域模型Die 1應力；次模型Die 1凸塊應力及應變範 圍；全域模型Die 1基板應力；銅柱次模型高低溫應力及應變；銅柱次模型焊錫接點 應力、應變、塑變及單位體積塑性功；Die 2單一凸塊次模型凸塊應力、應變、塑變 及單位體積塑性功；Die 2 單一凸塊次模型凸塊銅墊片高溫及低溫應力、應變分布；
Die 1單一凸塊次模型凸塊應力、應變、塑變及單位體積塑性功；Die 1單一凸塊次模 型凸塊銅墊片高溫及低溫應力、應變分布。
最後在有限元素模型因子探討中利用田口實驗方法來配置實驗參數，以銅柱高 度、銅柱節距及銅柱直徑三項做為結構之變異因子進行有限元素因子的探討在不同尺 寸下其各元件之熱機行為以找出最佳化參數。
1. 藉由全域模型的分析結果，焊錫接點及凸塊破壞的位置大多為離模型中心點最遠 的角落處。
2. 在晶片上可以發現主要效應集中的位置在模型左上角，造成此現象的原因為晶片 擺放位置並未如業界中常用的在模型正中央，而是偏於模型左上角。
3. 加上塑模材料時對於各項元件及銅柱、焊錫接點而言會形成很好的保護作用，主 要是因為塑模材料可以用來補償匹配熱膨脹係數，使變形量減小進而受到保護
4. 田口法中，吾人進行三項因子包含銅柱高度、銅柱節距及銅柱寬度變異探討，並 針對各項元件選擇最佳化參數。
5. 模型的幾何參數變異探討，由於模型元件眾多，因此吾人以單一元件為單位進行 討論。
6. 在幾何參數變異探討中，吾人雖選擇銅柱、焊錫接點作為整體結構最佳化參數的 依據，但模型中元件眾多，可依設計者需求改以其他元件作為依據找出最佳化參 數。
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