結論

1. 市售Sn-3Ag-0.5Cu無鉛焊錫添加了8 wt% In、1wt% Zn合金元素後，製作成 Sn-3Ag-0.5Cu-8In-1Zn無鉛銲錫。由DSC熔點測試結果顯示，結果發現

Sn-3Ag-0.5Cu-8In-1Zn合金的固相線(188℃)比原本的Sn-3Ag-0.5Cu合金的固相線 (208℃)低，但是固相與液相的區間則增大。

2. Sn-3Ag-0.5Cu-8In-1Zn合金的顯微結構發現點狀的Ag3Sn介金屬化合物分布在Sn 基地中另有Sn-In以及少量的Cu-Sn介金屬化合的出現。

3. Sn-3Ag-0.5Cu-8In-1Zn無鉛銲錫的介面反應是針對焊錫在OSP基板的的化合物分 析，發現焊錫在與OSP基板的裸銅表面熔融之後，Cu原子容易擴散進入到銲錫內 部，與銲料Sn合金產生反應在接點處會產生島狀(Cu-Sn)的析出物，焊錫會往Cu 銲墊下進行腐蝕，在焊錫的內部也會發現有Cu的析出物，提高了銲錫本身的延 展性，也增加了銲錫的機械強度。當恆溫時效100℃經過100小時，Cu-Sn析出物 之介金屬層會轉變成一層較薄的Cu-Sn析出物之 介金屬層。當恆溫時效經過500 小時之後，比恆溫時效100小時生成比較厚的Cu-Sn析出物之介金屬層。

4. Sn-3Ag-0.5Cu-8In-1Zn無鉛銲錫，在 OSP基板迴銲一次後，其平均的剪應力強度 約為32.4±2 MPa。隨著迴銲次數的增加和高溫時效處理後構裝件的平均剪應力均 會降低。Sn-3Ag-0.5Cu-8In-1Zn焊錫不論在何種的溫度下，在OSP基板中的剪應 力強度比化金基板的剪應力強度來的大，可發現此焊錫在OSP基板機械強度優於 焊錫在化金基板，並且有更好的抗潛變性質。

5. Sn-3Ag-0.5Cu-8In-1Zn無鉛銲錫在化金基板與OSP基板，由拉伸試驗後出來表面 破斷面型態可以發現到，破斷面均發生於銲料內部，當溫度在η=0.6 (25℃)，基 板皆呈現出延性破壞模式的型態，且存在著大量的窩穴，溫度為η=0.65(50℃) 時，剪切的窩穴開始變得比較淺，溫度為η=0.7(75℃)時，皆已漸漸的開始轉變成 晶界與晶界的交界處孔洞裂縫破壞型態壞的方式，當溫度為η=0.75(100℃)時，破 斷面大多呈現出晶界與晶界的交界處孔洞連結形成裂縫破壞的形貌。表示出隨著

溫度的提高，化合物與基地界面的孔洞也增大，其破斷面均會轉變由晶界與晶界 的交界處孔洞連結形成裂縫破壞。

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