對於構裝體之可靠度評估，銲錫接點的疲勞破壞是相當關鍵之問 題。本文所採用之等效全域模型搭配次模型分析可達到簡單建模及快 速分析之要求。在全域模型中可得疲勞破壞之關鍵位置，並可同時以 次模型分析覆晶封裝層之銲錫凸塊以及球柵陣列層之錫球在溫度循 環下之熱-機行為。
1. 藉由全域模型分析之結果，覆晶封裝層之焊錫凸塊破壞位置於對 角線上銲錫凸塊密度分佈交界處外圍之焊錫凸塊上，而球柵陣列 層之錫球破壞位置於晶片邊緣及晶片角落位置。
2. 藉由次模型分析之結果，由等效應變對時間關係曲線圖可發現，
潛變應變較塑性應變大，可推測在 TCT 溫度循環中，銲錫接點之 潛變行為為疲勞破壞之主要因素。
3. 由於分析研究發現，底膠的材料其性質轉換溫度在測試溫度範圍 之內，其剛性及熱膨脹係數變化相當大，於高溫中其真實狀態並 非為彈性體，並無法完整模擬其真實狀態。
4. 覆晶封裝層之銲錫凸塊，其構造較球柵陣列層之錫球複雜，由等 效應變對時間關係曲線圖觀察其塑性應變較大，且較早發生，造 成其疲勞壽命較短。
5. 當built-up材料楊氏係數越高時，銲錫凸塊之等效非彈性應變則越 小，並且等效非彈性應變範圍亦越小，壽命則會上升，錫球之等 效非彈性應變則越大，並且等效非彈性應變範圍亦越大，壽命則 會下降。
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