結論

本研究主要係探討 Sn-0.7Cu-0.05Ni、Sn-0.7Cu-0.05Ni-0.01Al 及

Sn-0.7Cu-0.05Ni-0.01Co 合金於 Cu 基材接合之界面顯微組織及接合 強度。研究結論如下：

1. Sn-0.7Cu-0.05Ni 合金銲點之接合界面顯微組織為(Cu,Ni)6Sn5

界金屬化合物，其反應層厚度約為 4μm，銲錫組織係由 Sn 基地+Cu6Sn5界金屬化合物所組成。

2. Sn-0.7Cu-0.05Ni-0.01Al 合 金 銲 點 之 接 合 界 面 顯 微 組 織 為 Cu6Sn5界金屬化合物，與 Sn-0.7Cu-0.05Ni 合金接合 Cu 基材 之接合界面組織相同，顯示微量(0.05wt%)的 Al 元素添加並 不影響 Sn-0.7Cu-0.05Ni 合金之接合界面反應層的顯微組織。

3. Sn-0.7Cu-0.05Ni-0.01Co 合金銲點之接合界面反應層主要為 (Cu,Ni,Co)6Sn5介金屬化合物，厚度約為 3μm，此外，銲錫 區域之顯微組織則由 Sn 基地+(Cu,Co)6Sn5介金屬化合物所組 成。

4. 經 150℃高溫儲存處理 25~500 小時後，本研究所探討的 Sn-0.7Cu-0.05Ni 、 Sn-0.7Cu-0.05Ni-0.01Al 以 及 Sn-0.7Cu-0.05Ni-0.01Co 合金銲點中，其界面反應層的顯微組 織均與銲接後無明顯變化，且界面反應層厚度隨著高溫儲存

處理的時間增加而增厚。

5. 由銲點拉伸試驗之結果可知，Sn-0.7Cu-0.05Ni 合金銲點的強 度約為 510.06MPa，Sn-0.7Cu-0.05Ni-0.01Al 合金銲點強度約 為 514.02MPa，Sn-0.7Cu-0.05Ni-0.01Co 合金銲點強度約為

513.89MPa，顯示添加 Al 或 Co 元素對於 Sn-0.7Cu-0.05Ni 合 金在銲接後的銲點強度並無明顯改變。

6. Sn-0.7Cu-Ni 合金銲點經 150℃高溫儲存處理 500 小時後，其 銲點的強度衰退約 14.57%。Sn-0.7Cu-0.05Ni-0.01Al 合金銲 點強度衰退約 15.87%。Sn-0.7Cu-0.05Ni-0.01Co 合金銲點強 度衰退約 7.87%。顯示 Co 元素的添加有助於改善 Sn-0.7Cu-Ni 合金銲點於高溫長時間之可靠度，而 Al 元素添加則無明顯 的影響。

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