本論文分為兩部分，第一部分為系統構裝三維互連線路技術研究，首先我們先 幫傳統的鍍穿孔模型加上共振腔效應，完成一個完整的鍍穿孔模型，並用此作基 礎，加上傳輸線模型來合成單端雙埠的三維互連線路，並微調迴流路徑電流所代
表的電感，讓整個三維互連線路模型可以更符合電磁模擬的結果，接著我們在PWR
跟 GND 層挖凹槽，藉著此凹槽達到類似結耦合電容的效果，減少 PCB 上的共振 腔效應，讓訊號傳遞在高頻上有好的效能，不會受到共振腔影響，之後此三維互 連線路技術研究，要繼續往穿層兩次建模，解析穿層兩次的電性迴路，讓此三維 互連線路模型更完整，還有當鍍穿孔為差動訊號時，要如何改善其結構，讓其差 動訊號更完整。
第二部分為以修正T 型等效電路實現長傳輸線效應，我們利用修正 T 型等效電 路設計等效的微帶線，並利用薄膜製程來實現，用此晶片取代微帶線可以節省百 分之98 的面積，設計的尺寸為 3cm，6cm，3cm+3cm，3cm 的微帶線晶片可以取 代傳輸線，而 6cm，3cm+3cm 的傳輸線晶片，因所需求的面積越大，而產生寄生 電容效應也越多，進而影響結果，加上所設計的電感感值不能準確符合模型，也 會造成誤差，還有此薄膜製程能符合的頻段只能到 5GHz，5GHz 過後因為電感產 生轉態，致使整個效果會不如預期，而為了讓訊號更完整傳遞，差動訊號的應用
越來越重要，未來本實驗室將以修正 T 型等效電路實現長差動對傳輸線效應為目
標。
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