本篇論文中，使用多晶片模組架構去構裝而且實現了一個小型化 60GHz 射頻 收發器模組。在這個模組中，不僅包含了傳送器模組(Transmitter module)、接 收器模組(Receiver moduel)、偏壓穩定電路和空腔共振抑制-電磁能隙架構
（Electromagnetic Band Gap ; EBG），並且實現在一個非常小尺寸的封裝當中，
整個尺寸為 39.6 mm × 30.8 mm × 9 mm，如圖 4.1。在空腔共振抑制-電磁能隙 架構的設計上，將整個系統模組封裝的效應合併到電路設計中，而所提出的電磁 能隙架構能在非操作的頻帶上產生額外的傳輸零點，並且能夠抑制一些不需要的 訊號。在論文中，也分別對毫米波銀膠構裝技術、共熔合金構裝技術及覆晶構裝 技術過程與特性做詳細介紹，並且能夠充分運用於毫米波的收發器模組的製作與 構裝，對通量測到的結果也蠻符合預期的。在未來的工作中，或許能夠往更高頻 不用執照的商用頻段(如)進行電路設計與構裝，真正的去實現一個更快速的高資 料量傳輸的射頻前端模組。
圖 4.1 60GHz 多晶片模組實體圖
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