本文所研究的分析種類有十二種，利用 ANSYS 有限元素軟體分析錫 球的應力-應變行為，再分別代入四種疲勞壽命預測方法和求得比例因子，
並且將分析結果做以下結論:
1. FC-PBGA 錫球進行非等溫熱傳分析時，基板材料在 Y 方向具有較小的 熱傳導係數，造成基板溫度梯度在 Y 方向較為複雜；TCT 非等溫熱傳 分析的最大溫差為 1℃，在 TST 非等溫熱傳分析的最大溫差為 4.8℃，
預估 TST 非等溫分析熱傳的結果會對結構分析造成較大的影響。
2. TCT 和 TST 測試中，FC-PBGA 錫球進行等溫和非等溫分析最大等效應 力的位置皆發生在晶片邊緣下方錫球的右上角，預期此處為 FC-PBGA 最先發生疲勞破壞的位置。
3. 在 TCT 和 TST 測試中，錫球的遲滯曲線在第二週次溫度循環後有逐漸 穩定收斂的趨勢。
4. 在 TCT 測試中，等效塑性應變、塑性剪應變、累積塑性應變和累積塑 性應變能密度的數值，由於數值很小並不會對結構分析和壽命計算造成 影響，但是在 TST 測試中，其數值對結構分析和疲勞壽命的影響不能 忽略。
5. 在 TCT 和 TST 測試中，發現錫球在第三週次低溫停留區，Primary + Secondary 潛變模式的應力釋放比另外兩種穩態潛變模式的應力釋放 慢。
6. 在 TCT 測試中，可以發現潛變行為是造成錫球疲勞的主要原因；在 TST 測試中，因為潛變行為在升溫和降溫時無足夠的時間發展，而造成錫球
7. 在 Darveaux 能量法中，用 Primary + Secondary 潛變模式和 Norton 潛變 模式的疲勞壽命比值比較，發現主要潛變對 TCT 等溫分析和非等溫分 析影響不大，但在 TST 等溫分析和非等溫分析中由於快速升溫和降溫 必須考慮到主要潛變的影響。
8. 等溫分析和非等溫分析對於 TCT 和 TST 的影響不大。
9. 以本文中使用的四種疲勞壽命公式計算得到的結果，發現 Darveaux 和 Engelmaier 的疲勞壽命偏高，Coffin-Mason 的疲勞壽命偏低。
10. TCT 和 TST 疲勞壽命的比例因子，以 Darveaux 能量法計算發現 TCT 的 疲 勞 壽 命 比 TST 的 疲 勞 壽 命 長 ， 以 Coffin-Mason 、 Engelmaier 、 Creep-Fatigue 三種方式計算疲勞壽命發現 TCT 疲勞壽命比 TST 疲勞壽 命短。
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