Table 10 lists the TQ score of FLEXium, Carrier and Mektron estimated by the formula designed in this study. According to the result of Table 10, we can see that Mektron truly had the highest score in these three companies as below.
Table 10 Technical quantity score list of FLEXium, Carrier and Mektron
Company Total
patents of FLEXium are utility models without any technical reports. Therefore, those patents could not provide the real and powerful right for FLEXium. In other words, the value of the patents would be very difficult to be evaluated. According to Table 8, we can find that FLEXium focuses on equipment (A90) and tooling (B30) to improve process and yield. Actually, the equipment and the tooling usually cannot be restored in product, which causes those related patents are lack of value. If a patent is just applied for satisfying total quantity rather than quality, the application will be regarded as an idleness. In other words, FLEXium is still in the growing period; and does not realize the importance of patent yet. Carrier has the same situation as FLEXium, but Carrier might not focus on its patent quantity as much as FLEXium. What causes thisanalysis. This kind of evaluation often focuses on the quantity, citation, and cited times, etc. In other words, people analyze the patent without reading the specification in the patent, and are short of the understanding the industry characteristic. Therefore, this study designed the specific parameter “Patent Effect” to analyze and estimate the patent value from the viewpoint of FPC industry in order to make the patent value more referable and objective. For more details, here presents some cases to explain how to estimate the patent value from the viewpoint of FPC industry, especially explain if the patent application is suitable or not.
Case 1:
Patent number M395328
Title Flexible printed circuit board capable of increasing utilization of surface mounting process
Technical method
After removing the bad unit 20a, the combined opening 30 will be formed on the FPC 1. And then, the operator can place another good unit into the combined opening 30. Thus, there will be a complete panel to SMT.
In case 1, this patent (M395328) teaches a method to increase utilization of SMT. But, the method will be difficult to be restored in product. Therefore, if the method is truly useful to SMT process, the method of this patent should be regarded as trade secret and no need to be disclosed in public.
Case 2:
Patent number M381245
Title Gilding residue reducing for soft plate structure
Technical method
The fingers 30 are formed inside the FPC unit 10. Actually, using the design is normal for ENIG process because ENIG does not need conducting wire.
In case 2, this patent (M381245) teaches a finger structure processed by electroless nickel immersion gold (ENIG). However, ENIG is a general surface finish method to be performed on every object. Thus, the finger of this patent processed by ENIG can easily be accomplished by any ordinary skilled person in the relevant art based on existing prior art before this application is filed.
Case 3:
Patent number M328126
Title Adapter of front plug micro memory card
Technical method
The adapter has a shell 10 and a circuit board 20.
In case 3, this patent (M328126) teaches an improved adapter for micro SD card. But, there is no description about the relationship between the adapter structure and FPC in this patent. Therefore, this patent might protect the new structure of the adapter rather
Case 4:
Patent number I316834
Title Flexible printed circuit
Technical method
The block bars 10 are expanded from the circuit of FPC to block electroplating solution between the two plated areas 1 and 2.
In case 4, this patent (I316834) teaches a new circuit design with block bar. The block bar is a part of the circuit of FPC, but it provides block function rather than electrical function. Besides, the block bar can be displayed on the product. Therefore, we can say the patent can be restored on the product and is useful to FPC industry.
Case 5:
Patent number I300421
Title Novel polyimide copolymer
Technical method
The polyimide copolymer includes pyromellitic acid dianhydride, 3, 3’, 4, 4’-benzophenonetetracarboxylic acid dianhydride and 6-amino-2-(p-amino phenyl)benzimidazole.
In case 5, this patent (I300421) teaches a new material about polyimide with better dimensional stability. In order to improve the dimensional stability of FPC, many engineers strive for this innate problem of material. The patent will inspire other engineers to keep studying in the right direction and can be restored. Therefore, the patent will be regarded as the key technology to bring a new start.
Case 6:
Patent number I338539
Title Flexible circuit board
Technical method
This patent discloses that the thickness of the base 1 is below 25 μm with 5~27 ppm/℃ CTE, the thickness of the adhesive 2 is 0.3~9 μm and the thickness of the plated layer 4 is below 9μm.
In case 6, this patent (I338539) introduces that the thickness of each layer to laminate the flexible circuit board in order to achieve the lower rigidity with lower cost. The engineers can obviously realize the detailed technical method in the patent specification.
As the biggest supplier in the world, Mektron also has the greatest technical quantity and masters the key technology, for example, the new composition of polyimide, the manufacturing method of FPC and the new FPC structure, etc. In fact, Mektron has still been constantly researching the new technology and applying for patent application in Japan. However, according to the patent activities of FLEXium and Carrier shown in this study, we can know Taiwan’s FPC industry highly relies on