CHAPTER 5 A NEW ION SENSOR CHIP
6.2 FUTURE WORK
In the future, the performance of thermal imaging systems with cooled or uncooled FPA technologies will be further enhanced by the development of new detection methodologies and signal processing techniques. Moreover, the concept of military and commercial dual-use technology in IR imaging systems will lead to the cost-driven and application-oriented development. Some advanced development directions on IR imaging systems such as on-chip A/D conversion, optical link, background suppression, and smart-FPA concept are future directions.
In this thesis, cryogenic CMOS readout techniques for infrared detector array of IR imaging systems are proposed and analyzed. All the structures and technologies discussed above have their uniqueness and features for different applications. Due to the development of commercial uncooled IR imaging systems and the fast advancement of submicron CMOS technologies, high-p
circuit techniques and structure. Moreover, the emerging technologies of CMOS visible-light imaging systems will share the advantages of the developed IR imaging systems due to their similarities. Both will be driven by rapid development and wide
can be further modified and designed as new techniques for the room temperature application.
With innovative development of readout circuit, a new generation of CMOS imaging systems is highly expected.
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