1 ms 0.95 3.48X10
-910 ms 0.82 4.27X10
-1130 ms 0.45 2.01X10
-1650 ms 0.35 4.18X10
-1880 ms 0.29 3.76X10
-19表 4.1-1 2.2 ML RTA750 不同填充偏壓時間下熱退火缺陷活化能與缺陷捕捉截 面積表
圖 4.1-15 圖解熱退火缺陷能階圖
59
表 4.1-2 熱退火缺陷活化能與缺陷捕捉截面積表
60 filling pulse changes
ln( SH435 2.2 ML RTA650
2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 SH438 2.8 ML RTA650
圖 4.2-1 DLTS 和 transient 阿瑞尼斯圖
DLTS
DLTS
61
-4 -3 -2 -1 0
150 200 250 300 350 400 450
C ( p F )
Bias (V)
T:300K F:10KHz
sh454(2ML) sh435(2.2ML) sh438(2.8ML)
-0.10 -0.15 -0.20 -0.25 -0.30 -0.35 -0.40 4x1016
6x1016 8x1016 1017
T:300K F:10KHz
sh454(2ML) sh435(2.2ML) sh438(2.8ML)
N (cm -3 )
Depth ( m)
圖 4.3-1(a)(b) 2.0,2.2,2.8 ML 室溫 CV 及縱深分布圖
QD1
62
-0.20 -0.25 -0.30 -0.35
4.0x1016
-0.20 -0.25 -0.30 -0.35
4x1016
63
-0.10 -0.15 -0.20 -0.25 -0.30 -0.35 -0.40 3x1016
-0.10 -0.15 -0.20 -0.25 -0.30 -0.35 -0.40 3x1016
64
-5 -4 -3 -2 -1 0
50 100 150 200 250 300 350 400 450
sh438(2.8ML) T:300 K
C ( p F )
Bias (V)
30K 50K 100K 300K
-0.1 -0.2 -0.3 -0.4 -0.5 -0.6 1015
1016 1017
sh438(2.8ML) T:300 K
N (cm -3 )
Depth ( m)
30K 50K 100K 300K
圖 4.3-6(a)(b) 2.8 ML 室溫大偏壓 CV 及縱深分布圖
QD1 QD2
65
-5 -4 -3 -2 -1 0
50 100 150 200 250 300
350 sh435(2.2ML) RTA650 T:85K
C ( p F )
Bias (V)
1K 5K 10K 50K 100K 300K
0.0 -0.1 -0.2 -0.3 -0.4 -0.5 -0.6 -0.7 -0.8 1013
1014 1015 1016 1017
sh435(2.2ML) RTA650 T:85K
N (cm -3 )
Depth ( m)
1K 5K 10K 50K 100K 300K
圖 4.3-7(a)(b) 2.2 ML RTA650 低溫 CV 及縱深分布圖
66
-5 -4 -3 -2 -1 0
200 300 400 500 600 700 800
sh435(2.2ML) RTA650 T:300K
C ( p F )
Bias (V)
5K 10K 50K 100K 300K 500K
-0.05 -0.10 -0.15 -0.20 -0.25 -0.30 -0.35 1016
1017
sh435(2.2ML) RTA650 T:300K
N (cm -3 )
Depth ( m)
5K 10K 50K 100K 300K 500K
圖 4.3-8(a)(b) 2.2 ML RTA650 室溫 CV 及縱深分布圖
67
-5.0 -4.5 -4.0 -3.5 -3.0 -2.5 -2.0 -1.5 -1.0 -0.5 0.0 0.5 50
100 150 200 250 300
350 sh438(2.8ML) RTA650 T:100K
C ( p F )
Bias (V)
1K 5K 10K 50K 100K 300K
-0.2 -0.4 -0.6 -0.8 -1.0
1014 1015 1016 1017
sh438(2.8ML) RTA650 T:100K
N (cm -3 )
Depth ( m)
1K 5K 10K 50K 100K 300K
圖 4.3-9(a)(b) 2.8 ML RTA650 低溫 CV 及縱深分布圖
68
-5 -4 -3 -2 -1 0
100 200 300 400 500
600 sh438(2.8ML) RTA650 T:300K
C ( p F )
Bias (V)
1K 5K 10K 50K 100K 300K
-0.10 -0.15 -0.20 -0.25 -0.30 -0.35 -0.40 -0.45 -0.50 1015
1016 1017
sh438(2.8ML) RTA650 T:300K
N (cm -3 )
Depth ( m)
1K 5K 10K 50K 100K 300K
圖 4.3-10(a)(b) 2.8 ML RTA650 室溫 CV 及縱深分布圖
69
70
900 sh438(2.8ML) RTA650 F:10K Hz
1017 sh438(2.8ML) RTA650
F:10K Hz
71
圖 4.3-12 2.8 ML RTA650 室溫 C-V 圖
2.8 ML RTA650 Nt (cm
-3) -0~-0.5V 2.04X10
15-0.5~-1V 3.00X10
15-1~-1.5V 2.95X10
15-1.5~-2V 2.23X10
15-2~-2.5V 1.87X10
15-2.5~-3V 1.11X10
15表 4.3-1 2.8 ML RTA650 各偏壓下的 Nt
-5 -4 -3 -2 -1 0
150 200 250 300 350 400
sh438(2.8ML) RTA650 T:300K
C ( p F )
Bias (V)
5 K 10 K 50 K 100 K 300 K
defect
72
圖 4.4-1(a) 2.2 ML RTA650 HRTEM
73
圖 4.4-1(b) 2.2 ML RTA650 HRTEM(經傅立葉轉換)
74
第五章 結論
從光激發螢光光譜(Photoluminescence, PL)的討論,根據 Varshni fitting 解析出 2.2 ML 和 2.8 ML 長波長訊號為 InSb QDs,了解到 Sb 在 InAs+Sb QDs 的成長中,會有 相分離的情形產生(InSb QDs 和 InAs-rich QDs)。由於 Sb 表面活化效應的影響,使 得受表面活化效應影響不一的 InAs-rich QDs 生長形成大大小小尺寸不一的量子 點,跟 AFM 所顯現出的量子點均勻性不一可以互相應證。根據 Sb 表面活化效應 延遲 InAs QDs 生長概念,推演出 InAs+Sb QDs 生長情況。
熱退火 InAs+Sb QDs,讓跟 GaAs 基板不匹配程度大的 InSb QDs 發生晶格鬆弛現 象,可從 PL 光譜看出 2.2 ML 和 2.8 ML 的 InSb QDs 經熱退火以後強度衰減,推 測熱退火所提供的熱能讓 InSb QDs 產生晶格鬆弛,減少 InSb QDs 發光數目。另 外深層暫態能階頻譜(DLTS)也可觀察到熱退火缺陷,故此缺陷是影響 InSb QDs 發 光減弱的原因。而熱退火對於 InAs-rich QDs 的影響,可改善尺寸不均勻情況。2.2 ML 和 2.8 ML 經過熱退火後,PL 半寬明顯縮減並解析出兩個清楚可見的訊號。高 溫度退火 2.8 ML,InAs-rich QDs 顯示具有 InAs QDs 發光行為。
熱退火 2.2 ML 和 2.8 ML 產生的缺陷,根據 DLTS 改變填充偏壓時間以及 transient 量測,判斷熱退火缺陷具有點缺陷特性。但熱退火缺陷的活化能又隨著填充偏壓 時間變化有巨大的改變,以及缺陷捕捉截面積跟缺陷活化能之間成指數關係!根 據捕捉位能障會影響缺陷活化能大小的理論,推測熱退火讓缺陷擁有多個缺陷能 階,也因此產生捕捉位能障改變缺陷捕捉截面積的大小。
退火 2.2 ML 和 2.8 ML 的 C-V 頻譜,可以觀察到靠近表面的缺陷訊號牽制量子點,
影響量子點頻率響應,並隨著溫度變化影響量子點遷移。另外從 2.8 ML 退火 650oC 變溫 C-V 觀察到兩群量子點隨著溫度傳輸的行為可以對應 PL 載子在 InSb QDs 和 InAs-rich QDs 間的傳輸行為。
TEM 顯現熱退火缺陷佐證 PL,DLTS,Transient,以及 C-V 所觀察。
75
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