Chapter 5 A Novel Absorptive Common-Mode Filter (A-CMF) with an
5.2 Implementation and Performance Improvement
5.3.3 CM Noise Absorption in Time Domain
The simulated time-domain CM suppression using measured S-parameters is shown in Fig. 5.19. To compare the suppressing mechanism, a reflective CMF with a similar stopband of CM transmission coefficient (|Scc21|) as the proposed A-CMF is selected to be compared with. The structures (reference board, reflective CMF, and A-CMF) are all excited with the same PRBS source as in the previous section except there is a time skew of 13 ps between the positive and negative channels. The skew is usually unavoidable in the practical circuit and will induce some CM noise. As the green dashed curve in Fig. 5.19(a), if no CMF is applied, CM noise with a peak-to-peak voltage of 96 mV exists at the output port. By using either kind of CMFs, the noise can be reduced significantly, to 36 mV with reflective CMF (red curve) and to 11.7 mV with proposed A-CMF (blue curve). But as to the reflected CM noise seen at the input port as shown in Fig. 5.19(b), the result of the case using reflective CMF (red curve, 37 mV) is about twice as large as the reference one (green curve, 18 mV). If the proposed A-CMF is applied, the reflected CM noise will become much lower (blue curve, 12 mV). This is because the proposed A-CMF absorbs the CM power while the reflective CMF reflects the noise to the input port. Again, the advantage of the A-CMF can be seen and proved.
(a)
(b)
Fig. 5.19. The CM suppression in the time domain. (a) The transmitted CM noise.
(b) The reflected CM noise.
5.4 Summary
Based on the proposed equivalent circuit model and an analytic design method, an absorptive common-mode filter (A-CMF) in 2-layer PCB is implemented in this paper.
Using the transformation between short and open circuit, the proposed A-CMF has a deep transmission zero for |Scc21| at the Wi-Fi 2.4 GHz band and prevents the CM noise from propagating in the frequency range from 1.7 GHz to over 7.5 GHz. Besides, it can also provide a perfect match to the CM wave and make it reflectionless. Hence, the CM noise can be absorbed well. The absorption can be observed in both time- and frequency-domain simulation and measurement. With the help of step-impedance slotlines, the structure can be miniaturized and the available bandwidth of DM signal can be enhanced. The DM signal can transmit through the proposed A-CMF without degrading even when the data rate is as high as 7.5 Gbps.
As listed in Table 5.2, the proposed A-CMFs are compared with other state-of-the-art CMFs, including different fabrication process, DM cut-off frequency (insertion loss of 3 dB), available CM stopband (|Scc21| < -10 dB), fractional bandwidth of CM stopband (FBW of |Scc21|), CM absorbing band (both |Scc21| and |Scc11| are less than -10 dB), cutoff frequency ratio of DM (-3 dB) to CM (lower bound of -10dB), and electrical size (normalized to λg which is the wavelength in dielectric at the frequency of lower bound of the CM stopband). Most of the conventional CMFs can only reflect the CM noise [32]-[34], [36], [42], and only one of them [41] can absorb and eliminate the CM power. However, the idea in [41] is realized in the process of the integrated passive device (IPD) with higher cost. Although the proposed A-CMFs have the relatively large size, they can be implemented in cost-efficient 2-layer PCB process. In addition, compared with [41], the proposed bidirectional A-CMF has a wider CM stopband with
an FBW larger than 126% and a higher DM-to-CM cutoff frequency ratio of 4.4. The proposed circuit is the first A-CMF that can be implemented in PCB and with a good response in both DM transmission and CM suppression.
Table 5.2. Performance comparison with state-of-the-art CMFs
Chapter 6 pter 6 Conclusion
6.1 Conclusions of this Dissertation
High-speed digital differential signaling system can transmit a large amount of data and have high immunity to the noise interference at the same time, which has been widely used in the electrical devices and can provide higher performance and better experience to the users. Under this scenario, CM noise is in known as one of the most serious sources that cause the RFI/EMI problems, which may degrade the throughput of the wireless circuits or even make the devices harmful to other products and human bodies. Although this phenomenon is well known and the mechanism has been studied, it’s still uncertain why the radiation is mainly caused by CM but not DM power, and to what degree the radiation will be caused by a discontinuity.
In this dissertation, an analysis method and three CMF designs are proposed to characterize these interference problems. In Chapter 2, a modal method is developed to deal with the discontinuities in the MTL systems, and can be applied in analyses of both SI and EMI issues. The proposed method provides a more accurate prediction compared with the conventional circuit simulation tool, and takes much less simulation computing resource and time compared with the full-wave simulation tool. In chapter 3, a
TSV-based CMF in 3-D ICs is proposed to solve the CM-excited noise problem inside the chip package. By employing the parasitics of TSVs into design, the TSV-CMF has a high DM operating bandwidth and a relatively compact size. The CM stopband can be easily designed with the derived formula and can be enhanced by applying stacking technique of chips. In Chapter 4, a CMF with three designable TZs is proposed for different kinds of application. Once the center frequency of the stopband is decided, one of the TZ can be designed by the proposed method. Then the other two TZs can be used in the compromise between the bandwidth and suppressing level. In Chapter 5, a design method of CMF with absorption functionality is constructed. The proposed A-CMF can be easily implemented in cost-efficient PCB process with excellent performance. Not only absorption of CM noise, but also high cutoff frequency of DM to CM and high FBW of CM stopband can be all achieved.
6.2 Suggestions for Future Works
Strictly speaking, there are still something undone and to be improved in this dissertation. The MTL analysis method in Chapter 2 assumes that the propagating modes are TEM modes, but in the inhomogeneous system like microstrip coupled lines, the modes will be quasi TEM modes. Then the effect of resistance and conductance cannot be ignored. Although a possible solution is also discussed, but how the loss factor affects the modal decomposition has not been studied yet. In addition, theoretically this method can model the system with multiple differential pairs, but the validation is not done. More studies on these will make the mechanism of noise interference clearer. The TSV-CMF in Chapter 3 is designed with a lumped circuit model, which is known with a DM cutoff even under lossless environment. It is
suggested that higher order models or transmission-line-based models can be studied for more advanced design. Since the electrical behavior of transmission line is a transcendental function, there must be more than 3 TZs in the CMF design proposed in Chapter 4. Studying how to generate or involve more TZs in the stopband and how to control the TZs can make the CMF with better suppressing effect. Although step-impedance lines have been applied in the A-CMF in Chapter 5, there is still a DM TZ at the higher frequency, which may limit the application. In addition, to be implemented in PCB indeed reduces the cost, but the size is relatively large. It is suggested to study the duality circuit of the proposed one and to realize the CMF without slotlines.
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PUBLICATION LIST
I. Journal Paper:
[1] C.-H. Cheng, C.-H. Tsai, and T.-L. Wu, “A novel time domain method to extract equivalent circuit model of patterned ground structures,” IEEE Microw. Compon.
Lett., vol. 20, no. 9, pp. 486–488, Oct. 2010.
[2] C.-H. Cheng, T.-Y. Cheng, C.-H. Du, Y.-C. Lu, Y.-P. Chiou, Sally Liu, T.-L. Wu,
“An equation-based circuit model and its generation tool for 3-D IC power delivery networks with an emphasis on coupling effect,” IEEE Trans. Compon.
Packag. Manuf. Technol., vol.4, no.6, pp. 1062-1070, June. 2014.
[3] C.-Y. Hsiao, C.-H. Cheng, and T.-L. Wu, “A new broadband common-mode noise absorption circuit for high-speed differential digital systems,” IEEE Trans. Microw.
Theory Techn, vol.63, no.6, pp. 1894-1901, Jun. 2015.
[4] C.-H. Cheng, and T.-L. Wu, “An ultra-compact TSV-based common-mode filter (TSV-CMF) in three-dimensional integrated circuits (3-D ICs),” IEEE Trans.
Electromagn. Compat., accepted.
II. Conference Paper:
[1] Y.-C. Tseng, C.-B. Chang, C.-K. Tang, C.-H. Cheng, Y.-C. Lu, K.-Y. Lin, T.-L. Wu, and R.-B. Wu, “Design considerations for radio frequency 3DICs,” in Proc. IEEE.
Elect. Design Adv. Packag. Systems Symp., Taipei, Taiwan, Dec. 2012, pp.197-200.
[2] K.-Y. Chen, Y.-A. Sheu, C.-H. Cheng, J.-H. Lin, Y.-P. Chiou, and T.-L. Wu, “A novel TSV model considering nonlinear MOS effect for transient analysis,” in Proc.
IEEE. Elect. Design Adv. Packag. Systems Symp., Taipei, Taiwan, Dec. 2012, pp.
49-52.
[3] C.-H. Cheng, and T.-L. Wu, “A novel common-mode filter for multiple differential pairs with low crosstalk and low mode conversion level” in Proc. IEEE. Elect.
Performance Electron. Package. Systems, San Jose, CA, Oct. 2013, pp.259-262.
[4] C.-H. Cheng, and T.-L. Wu, “A compact dual-band common-mode filtering component for EMC in wireless communication,” in Proc. Asia-Pacific Symp.
Electromagn. Compat., Taipei, Taiwan, May 2015, pp. 349-351.
[5] C.-H. Cheng, and T.-L. Wu, “Effective current distribution analysis method for multiconductor-transmission-line (MTL) system with arbitrary conductor number variation,” in Proc. IEEE. Int. Symp. Electromagn. Compat., Dresden, Germany, Aug. 2015, pp. 594-599.
[6] Y.-A. Hsu, C.-H. Cheng, Y.-C. Lu, and T.-L. Wu, “A prediction method of heat generation in the silicon substrate for 3-D ICs”, in Proc. IEEE. Elect. Performance Electron. Package. Systems, San Jose, USA, Oct. 2015, pp. 89-92.
[7] Y.-A. Hsu, C.-C. Chou, C.-H. Cheng, and T.-L. Wu, “A radiation prediction method based on partial element equivalent circuit,” in Proc. Asia-Pacific Symp.
Electromagn. Compat., Shenzhen, China, May 2016, pp. 95-98.
[8] P.-J. Li, C.-H. Cheng, Y.-C. Tseng, and T.-L. Wu, “Novel absorptive design of common-mode filter at desired frequency band,” in Proc. IEEE. Workshop Signal Power Integrity, Turin, Italy, May 2016.