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Crystallinity vs. modulating the H 2 flow percentage of next layer

CHAPTER 4    RESULTS AND DISCUSSIONS

4.5 D EPOSITION TECHNIQUES FOR MICROCRYSTALLINE SILICON

4.5.4 Crystallinity vs. modulating the H 2 flow percentage of next layer

H2/SiH4 F0(sccm)

60 1525 54 1375 44 1125

Fig. 4-21 Crystallinity vs. relative total gas flow (F / F0)

4.5.4 Crystallinity vs. modulating the H

2

flow percentage of next layer

In order to maintain the crystallinity of whole film, we modulate the H2 flow by decreasing the flow with four layers in series and the total thickness is 1500 nm. The symbol Z represent that the next layer H2 is divided by present H2 flow. We set the H2 flow in first layer to be 710 sccm and the substrate is glass. As the Fig. 4-22 shown, although the

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crystallinity increases with the Z, the crystallinity is still too high..

Fig. 4-22 Crystallinity vs. next layer H2 flow percentage Z

4.5.5 Crystallinity vs. modulating the initial H

2

flow

In last section, we modulate the H2 flow ratio each layer but the crystallinity of whole film is still high. Thus we vary the initial H2 flow (F0) and maintain the deceasing ratio each layer (Z) to be 80%. The total thickness of film is 400nm and the substrate is glass. As the Fig.

4-23 shown, the initial H2 flow influence the crystallinity drastically. When the initial H2 flow (F0) is 600 sccm, the crystllinity of the film is about 55%. In brief, the incubation layer is very crucial for the crystallinity of the film, and controlling the initial condition of deposition is worth studying.

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Fig. 4-23 Crystallinity vs. initial H2 flow F0

4.5.6 Effect of varied SiH

4

flow rate of three substrates on crystallinity of µc-Si:H film

We are curious about the effect of varying substrate on µc-Si:H film, thus using three different substrates, glass, glass/a-Si:H, Asahi U/a-Si:H to study the effect of substrate on crystallinity of µc-Si:H film. The H2 flow, thickness of each layer, and total thickness have shown in Fig. 4-24. The Fig. 4-25 shows the crystallinity is lowest when the substrate is Glass and crystallinity decreases as SiH4 increases. We consider that a-Si:H is the key for crystallinity decreasing. In conclusion, the initial conditions of deposition can almost control the crystallinity of whole µc-Si:H film and the crystallinity of µc-Si:H film about 50% is also achieved.

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Fig. 4-24 The deposited parameters of µc-Si:H film.

10 15 20 25 30

45 50 55 60 65 70 75 80 85

X c (%)

SiH4 (sccm) Glass

Glass / a-Si:H Asahi-U / a-Si:H

Fig. 4-25 Crystallinity with different SiH4 flow rate on three different substrates.

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Chapter 5 Conclusions

In this study, computer modeling with the Atlas program is used as a new approach for obtaining optimal performance of the solar cell. Increasing the dangling bond density from 5x1015cm-3 to 5x1018cm-3 in a-Si:H i-layer, the solar cell efficiency decreased from 8.37% to 5.91%. The increase in the dangling bond density increases the amount of the recombination centers and recombination capability. These defects may be caused by light illumination which plays a major role in the degradation of a-Si:H solar cells.

The crucial point for tandem solar cell is the insertion of a special layer (x-layer) between individual cells. The simulation results showed a drastically drop of electron and hole current in p and n layers, respectively. This indicates a very strong recombination process occurred in the TRJ. The tunneling is needed through the n-layer for electrons to supply the x-layer and through p-layer for holes to supply the x- layer. The key process in TRJ is recombination.

Tandem solar cell performance was simulated by altering the bottom cell bandgap (Eg) and the tail state distribution. The spatial disorder in the atomic structure results in the localized states within the mobility gap strongly influence the electron transition. Thus, when tail state distribution of DOS becomes broader with increasing Eg, the region of carrier confinement expands which leads the reduction of Jsc in the cell. The open circuit voltage (Voc) increases with Eg, but the short circuit current (Jsc) decreases as the bandgap lower than 1.4 eV.

Combining the effects of Voc and Jsc, the efficiency increases from 8.78% to 10.78%, and then decline to 9.43% with the increase of bandgap. Considering the value of Eg, the higher Eg gets a better performance. The results in the study showed the Eg of bottom cell should not be lower than 1.3eV to avoid the efficiency decline.

In realistic deposition process we deposited the µc-Si:H film by plasma-enhanced

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chemical vapor deposition (PECVD). H2 flow rate, rf power and grading H2 flow rate were used to control the crystallinity. In this study we have found that the initial H2 flow rate and substrate surface strongly influence the crystallinity of µc-Si:H. The initial deposition condition determined the crystallinity of the whole µc-Si:H film. The crystallinity would drop sharply when amorphous silicon was deposited on glass and used as substrate. Finally crystallinity of about 50% was achieved by modulating H2 flow.

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