DPD series
Organic Alkaline Developer1. Outline
DPD series is designed for high resolution semiconductor device fabrication.
DPD series is TMAH(tetramethylammonium hydroxide) aqueous solution. So it is metal ion free.
It can be used in the immersion and batch spray module, ideal use is in spray and puddle process on automatic development units in Track system.
DPD series can be supplied as a concentrate. Custom dilutions are also available.
2. Characteristics
1. Scum free after development 2. Metal ion free type
3. Colorless, odorless, inorganic alkaline aqueous solution.
4. Little dependence on exposure energy and temperature of developer.
5. Very low contamination level. (Metal-ion & particles)
3. Properties
4. Specifications
ITEM UNIT SPEC.
APPERANCE - COLORLESS
YELLOWLESS SPECIFIC GRAVITY d25 1.000 ± 0.005
NORMALITY N *.** ± 0.01
Na ppb < 500
Fe ppb < 500
PARTICLE ( > 0.5 ㎛) EA/ml < 10
Developer DPD-100 DPD-200 TMAH(%) 2.15±0.1 2.38 ±0.1 Normality(N) 0.237±0.01 0.26 ±0.01 Surfactant with without
5. Usage
• Immersion
Use DPD series developer.
Recommended development process is following.
Dipping · · · 21~23℃, 50~70 seconds.
(Controlled to within ±1℃) Rinse · · · Deionized water 20~25℃
• In-Line Spray/Puddle
Control developer temperature at the dispensing head at a constant temperature(±1℃) within the range of 21~23℃.
Spray developer at a low presure(0.2~0.4bar) on a slowly spinning wafer for 5seconds maximum to establish a puddle.
Maintain the puddle for approximately 15seconds on a stationary wafer, and overlap a deionized water rinse with the developing cycle. After a 10~15 second deionized water rinse, spin the wafer dry.
DPD-200 is packaged in 1- gallon PE bottles and 20-liter PE bottles.
6. Packaging
How to Use the materials in Photolithography Process
Substrate Preparation ( Wafer Cleaning )
HMDS Priming
Photoresist Coating
Prebake 100~110℃
Exposure
Develop ( DPD-200) Post Exposure Bake
105~115℃
Post Bake 120~140℃
Etch/Ion Implant
Strip
( DPS-1000N & DPSS-1000)
Coating, Oven, Vaccum Chamber Wet, Dry
Spin, Roll, Spray
Hot plate, Oven
Stepper, Scanner, Aligner
Puddle, Spray, Dipping
Wet & Dry etching Metal & Ion Implantation
Spray, Dipping
