The focus of this thesis is the measurement and simulation of integrated passive devices (capacitor and inductor) before and after packaging. Passive components (Resistors, Capacitors, and Inductors) occupy a large area of the electronic circuit boards, and the number is increasing, these are a major hurdle to the miniaturization of many electronic systems. Analog and mixed-signal applications, which use a large number of passives than typical digital system, almost no through-hole, axial leaded resistors and disk capacitors are used anymore;
they have been replaced with smaller, rectangular surface-mount components with solder joints at both ends. The size of these modern discrete is described by a number such as 0603, which indicates a size of 60 × 30 mils (1.5 × 0.75 mm). The 0402 (1.0 × 0.5 mm) size is commonly used, and the smallest discrete passives today are 0201 (0.50 × 0.25 mm).
Part on of the thesis presented the Introduction of Integrated Passive devices, Device structure and theory is also discussed. In the second part, Ansoft HFSS is introduced as we used this software for doing simulation
Measurement and simulation result is shown in the last part, and they are quiet fit.
5.1 Future Research
Integrated Passive Devices have all benefits we want for future Integrated Circuit, as describe in the first chapter, but there are many problems with implementing integrated passives, such as:
1. Indecision on materials and processes. Research continues on many resistor materials and capacitor dielectrics.
2. Lack of design tools, for both component sizing and system layout.
3. Requires vertical integration. The same company must manufacture both substrates and passives.
4. Yield issues. One bad component can lead to scrapping the entire board.
5. Tolerance issues. Integrated passives cannot be presorted prior to inclusion on the board.
6. Lack of standardization. The various segments of the integrated passive industry aren’t speaking the same language [14].
7. Surface-mount technology is improving—moving towards 01005.
8. Lack of costing models. It is not easy to tell when integrated passives might be more cost effective.
Table 5.1 Issues and status of integrated components
Over one trillion passive devices mounted on organic boards this year, this number will increase rapidly in the future, Integrated Passive devices will provide a great benefit if all the problem mention above can be solve.
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