Chapter 4 Implementation Results
4.5 Summary
In this section, the features of low power techniques are summarized. Table 5 shows the summary of the low power techniques introduced in this thesis. Because of dual-supply standard cell is not available in our research; the area overhead of dual-supply cell indicates the star mark and the meaning of the number represent the increase percentage per cell compare with general cell. Beside the method using dual-supply cell for body bias, other design methods need extra pattern to realized techniques. The semi-automation represents that some design phases are realized by designer, not EDA tool.
All techniques introduced in our research, e.g. voltage separation, body bias and power switch, are realized and implemented on SIMD MAC. Actually, all techniques introduced in this thesis can realize on every design circuit which adopts cell-based design flow. Figure 4.12 shows a layout diagram of streaming clusters with voltage separation technique. Streaming architecture has been suggested as an efficient architecture for both media applications and baseband architecture for software defined radios.
Table 5 Summary of low power techniques
Technique type Area overhead Extra pattern Implementation style
Voltage Separation 1.1% DNW Semi-automation
Dual-supply
cell *7.9% none Fully-automation
Body
Bias General
cell 17 % Contact / DIFF Semi-automation
Power Switch -- none Semi-automation
* The cell height of dual-supply accounts to 7.9% area overhand compared to general cell.
Cluster 1 Cluster 2
Cluster 3 Cluster 4
Memory
Power Ring Power Ring
Power Ring Power Ring
Power Ring
Figure 4.12 Layout diagram of streaming cluster with voltage separation. Each cluster has its own power ring.
Chapter 5
Conclusion and Future Work
5.1 Conclusion
As the power consumption of VLSI design increases from one generation to the next, it is becoming more important to control power dissipation even when circuit in idle mode. To meet the power requirement of advanced VLSI design, several simple yet effective physical design flows using existent commercial EDA tool have been presented.
By using Voltage Separation techniques, the design circuit can be partitioned into several islands and providing minimum voltage for reducing power is possible. At the same time, the deep n-well (DNW) is added to diminish noised coupling towards common substrate. Moreover, a cell layout style with build-in dual supply rail is proposed. By using the cell layout type, body bias can be immediately embedded in typical cell-based design flow. The extra power grid creation and port connection is also presented. By using conventional cell library, the body bias also can be added into cell-based design flow via a simple contact modification and well pattern insertion. Finally, the power switch which is suitable for cell-based design flow is shown. By the careful design, the power switches are inserted between metal-1 and metal-2 layer and suffer less area overhead.
By embedding low power techniques into physical design flow. A design circuit with low power technique feature is available. Therefore, this thesis provides an opportunity to realize several low power techniques relied on cell-based method.
Although some simple low power techniques are realized, several enhancements, such as partition islands, sizing of power switch and physical design considerations, are still needed for the EDA tool. Further, creating an industry-wide design flow with robust capability is essential. These include functional partitioning, synthesis, timing analysis, power analysis, test, simulation and physical design.
5.2 Future Work
Although several low power techniques have been added into the cell-based design flow, a comprehensive power management unit is still essential for a real SoC system.
This power management unit not only deals with performance coherence between functional blocks as well as handles power sequencing and communication issues, but also determines the minimum voltage level for each functional block or provides optimized voltage for body bias immediately. This information may be different according to using process technology such as low power process or high speed process. Further, some side effect, e.g. leakage current of NMOS increases dramatically in small channel width, will probably damage the effectiveness of the low power techniques in 0.13nm generation or beyond. Therefore, a robust block-level simulation for leakage efficiency in needed.
Bibliography
[1] D. E. Lackey, P. S. Zuchowski, T. R. Bednar, D. W. Stout, S. W. Gould, and J.M. Cohn, “Managing power and performance for system-on-chip designs using voltage islands,” IEEE/ACM International Conference on Computer Aided Design, ICCAD 2002, pp. 195-202, 10-14 November, 2002.
[2] T. Kam, S. Rawat, D. Kirkpatrick, R. Roy, G. S. Spirakis, N. Sherwani, and C.Peterson, “EDA challenges facing future microprocessor design,” IEEE Transactions on Computer Aided Design, vol. 19, pp. 1498-1506, Dec. 2000.
[3] J. W. Tschanz, S. G. Narendra, Y. Ye, B. A. Bloechel, S. Borkar, and V. De,
“Dynamic sleep transistor and body bias for active leakage power control of microprocessors,” IEEE Journal of Solid-State Circuits, vol.38, no. 11, pg.
1838-1845, November 2003.
[4] J. Tschanz, Y. Ye, L. Wei, V. Govindarajulu, N. Borkar, S. Burns, T. Karnik, S.
Borkar, and V. De, “Design optimizations of a high performance microprocessor using combinations of dual-Vt allocation and transistor sizing,” in Symp. VLSI Circuits Dig. Tech. Papers, 2002, pp. 218–219.
[5] T. Kuroda, T. Fujita, S. Mita, T. Nagamatsu, S. Yoshioka, K. Suzuki, F. Sano, M. Norishima, M. Murota, M. Kako, M. Kinugawa, M. Kakumu, and T. Sakurai,
“A 0.9-V, 150-MHz, 10-mW, 4mm , 2-D discrete cosine transform core processor with variable threshold-voltage (VT) scheme,” IEEE Journal of Solid-State Circuits, vol. 31, pp. 1770-1779, Nov. 1996.
[6] Calhoun, B., F. Honore, A. P. Chandrakasan, "A Leakage Reduction Methodology for Distributed MTCMOS," IEEE Journal of Solid-State Circuits, pp. 818-826, May 2004.
[7] V. Kursun and E. G. Friedman, " Sleep Switch Dual Threshold Voltage Domino Logic with Reduced Standby Leakage Current," IEEE Transactions on Very Large Scale Integration (VLSI) Systems, Vol. 12, No. 5, pp. 485-496, May 2004.
[8] Kao, J., A. P. Chandrakasan, "Dual-Threshold Techniques for Low-Power Digital Circuits," IEEE Journal of Solid-State Circuits, pp. 1009-1018, July 2000.
[9] S. Thompson, I. Young, J. Greason, and M. Bohr, “Dual threshold voltages and substrate bias: keys to high performance, low-power, 0.1-m logic designs,” in Symp. VLSI Technology Dig. Tech. Papers, 1997, pp. 69-70.
[10] S. Narendra, A. Keshavarzi, B. A. Bloechel, S. Borkar, and Vivek De, “Forward Body Bias for Microprocessors in 130-nm Technology Generation and Beyond,” IEEE Journal of Solid-State Circuits, vol. 38, pp. 696-701, May 2003.
[11] L. T. Clark, E. J. Hoffman, J. Miller,M. Biyani, Y. Liao, S. Strazdus, M.
Morrow, K. E. Velarde, and M. A. Yarch, “An embedded 32b microprocessor core for low-power and high-performance applications,” IEEE J. Solid-State Circuits, vol. 36, pp. 1599-1608, Nov. 2001.
[12] W. K. Yeh, S. M. Chen, Y. K. Fang (2004) “ Substrate Noise-Coupling Characterization and Efficient Suppression in CMOS Technology", IEEE T-Electron Device, Vol. 51, No.5, pp.817-827
[13] http://www.cic.org.tw
[14] J. Hu, Y. Shin, N. Dhanwada and R. Marculescu, “Architecting Voltage Islands in Core-based System-on-a-Chip Designs,” in Proc. ISLPED, oo.180-185, Aug.
2004.
[15] K. A. Bowman, S. G. Duvall, and J. D. Meindl, “Impact of die-to-die and within-die parameter fluctuations on the maximum clock frequency distribution,” in IEEE ISSCC Dig. Tech. Papers, Feb. 2001, pp. 278-279.
[16] J. Tschanz, J. Kao, S. Narendra, R. Nair, D. Antoniadis, A. Chandrakasan, and V. De, “Adaptive body bias for reducing impacts of die-to-die and within-die parameter variations on microprocessor frequency and leakage,” IEEE Int.
Solid-State Circuits Conf. Dig. Tech. Papers, 2002, pp. 422-423.
[17] J. Tschanz et. al., "Effectiveness of adaptive supply voltage and body bias for reducing impact of parameter variations in low power and high performance microprocessors," IEEE Journal of Solid-State Circuits, pp. 826-829, May 2003.
[18] Kao, J., A. P. Chandrakasan, "Dual-Threshold Techniques for Low-Power Digital Circuits," IEEE Journal of Solid-State Circuits, pp. 1009-1018, July 2000.
[19] Calhoun, B., F. Honore, A. P. Chandrakasan, "A Leakage Reduction Methodology for Distributed MTCMOS," IEEE Journal of Solid-State Circuits, pp. 818-826, May 2004.
[20] S. Mutoh, T. Douseki, Y. Matsuya, T. Aoki, S. Shigematsu, and J. Yamada,
“1-V Power Supply High-Speed Digital Circuit Technology with Multithreshold-Voltage CMOS,” IEEE Journal of Solid-State Circuits, pp.
847-854, August 1995.
[21] H. Kawaguchi, K. Nose, and T. Sakurai, “A CMOS scheme for 0.5 V supply voltage with pico-ampere standby current,” IEEE Int. Solid- State Circuits Conf.
Dig. Tech. Papers, Feb. 1998, pp. 192-193.
[22] L. M. Franca-Neto, P. Party, M. P. Ly, R. Rangel, S. Suthar, T. Syed, B.
Bloechel, S. Lee, C. Burnett, D. Cho, D. Kau, A. Fazio and K. Soumyanath,
“Enabling High-Performance Mixed-Signal System-on-a-Chip (SoC) in High Performance Logic CMOS Technology,” IEEE VLSI Circuit Symposium, June, 2002