HONG KONG TECHNOLOGY
Tel: (852) 358 6316 Fax: (852) 358 0537
For Immediate Release 10 February 1995
HKUST to Hold Workshop on Electronic Packaging
A workshop designed as an introductory course on electronic packaging for practising engineers and researchers will be held at the Hong Kong University of Science & Technology from 14 to 18 February (Tuesday to Saturday) and on 21 February (Tuesday) 1995.
Packaging of microelectronic devices is the science and art of establishing the interconnections that allow electrical circuits to process and store information. Packaging technologies are used throughout the entire microelectronics industry ranging from consumer electronics to high-performance systems.
Sponsored by HKUST’s Department of Mechanical Engineering and Centre for Computer-aided Design and Manufacturing, the workshop will present an overview of electronic packaging engineering, together with an in-depth review of structural modelling in surface mount packages.
Leading the workshop will be Professor William T. Chen and Dr. John H. Lau. Professor Chen is a senior technical staff member of IBM Microelectronics and an expert on electronic packaging products. Through the years he has organised and participated in many projects related to electronic packaging design and applications.
Dr. Lau is a senior engineer with Hewlett-Packard in California. He has more than 24 years of R & D experience in the petroleum, nuclear, defense and electronics industries.
For more information about the Electronic Packaging Workshop, please contact Miss Tsang of the CAD/CAM Centre by telephoning 2358-8671 or faxing 2335-9298.
(Please direct enquiries to the Office of Public Affairs at 23586306 or pager 1163388 call 2651)
