644 IEEE TRANSACTIONS ON ADVANCED PACKAGING, VOL. 32, NO. 3, AUGUST 2009
High-Performance and Low-Cost 40-Gb/s
CWDM Optical Modules
Min-Ching Lin, Tien-Tsorng Shih, Pei-Hao Tseng, Kuei-Ming Chu, Chieh Hu, and
Wood-Hi Cheng, Senior Member, IEEE
Abstract—High-performance and low-cost 40-Gb/s optical
modules using four different wavelength uncooled 10-Gb/s
dis-tributed-feedback (DFB) lasers are proposed and demonstrated.
The 40-Gb/s optical module was integrated with coarse wavelength
division multiplexing (CWDM) thin-film filters which enabled
four 10-Gb/s transmission channels output through a single fiber.
The 10-Gb/s DFB laser was packaged by commercialized low-cost
coaxial TO-Can technology. The results of the 40-Gb/s optical
module showed that the output optical power was above
1
dBm per channel and the system power budget was 12 dB. The
transmission distance with a single-mode fiber reached more than
30 km at a bit-error-rate of
10
9. Compared with conventional
40-Gb/s optical modules, the module is easy to fabricate and is low
cost. This proposed high-performance 40-Gb/s CWDM optical
module demonstrates not only the feasibility of a 30 km
trans-mission, but also shows the low-cost possibility of ensuring the
application of WDM-passive optical network fiber-to-the-home
systems.
Index Terms—Coarse wavelength-division multiplex (CWDM),
fiber-to-the-home (FTTH), low-cost, OC-192, wavelength division
multiplexing-passive optical network (WDM-PON), 40-Gb/s.
I. I
NTRODUCTIONT
HE high data rates requirements in telecom and datacom
are growing rapidly. The access network is the major
bot-tleneck in most modern telecom societies. Due to the
installa-tion cost reducinstalla-tion and the bandwidth demand of clients, these
access networks have been upgraded gradually from the
low-speed copper solution to the high-low-speed optical network. To
overcome access network bottleneck, a higher bit rate
transmis-sion is necessary.
Recently, the solutions of 40-Gb/s applications by using
ex-ternal modulated devices, such as electric-absorption
modula-tors or Mach–Zehnder modulamodula-tors have been developed [1]–[3].
However, the cost of these 40-Gb/s solutions is expensive for
the access network applications. In contrast, coarse wavelength
division multiplexing (CWDM) technology by using 10-Gb/s
Manuscript received December 18, 2007; revised May 03, 2008, March 18, 2009. Current version published August 05, 2009. This work was supported in part by MOE Program of the Aim for the Top University Plan, Taiwan. This work was recommended for publication by Associate Editor A. Shapiro upon evaluation of the reviewers comments.
M.-C. Lin, P.-H. Tseng, K.-M. Chu, and W.-H. Cheng are with the Insti-tute of Electro-Optical Engineering, National Sun Yat-Sen University, Kaoh-siung, Taiwan (e-mail: [email protected]; 1094319105@cc. kuas.edu.tw; [email protected]; [email protected]).
T.-T. Shih is with the Department of Electronic Engineering, National Kaoh-siung University of Applied Sciences, KaohKaoh-siung, Taiwan (e-mail: [email protected]. edu.tw).
C. Hu is with the Digital Imaging Department, Laser Application Technology Center, ITRIS/ITRI, Tainan, Taiwan (e-mail: [email protected]).
Digital Object Identifier 10.1109/TADVP.2009.2020691
components can leverage the advantage of moderate cost and
reliable technology effectively. Such technology is becoming
an attractive approach due to its low-cost requirements. Several
studies have developed parallel optical modules with an
aggre-gated transmission data rate up to 40-Gb/s [4]–[7]. These optical
modules required additional CWDM MUX/DEMUX couplers
to combine different wavelengths of signals into a single fiber.
This would not only increase the cost of the 40-Gb/s system, but
would also need more room to setup.
In this study, four different wavelength uncooled 10-Gb/s
distributed-feedback (DFB) lasers have been packaged into
a 40-Gb/s optical module. Due to cost consideration, these
10-Gb/s DFB lasers adopted the existing low-cost coaxial
TO-CAN package format [8]. In order to reduce the room
for additional CWDM MUX/DEMUX coupler, four coaxial
10-Gb/s DFB lasers were integrated with three band-pass
thin-film filters (TFFs) to form a zig-zag optical path inside
the module. The proposed optical module operating at 10-Gb/s
per channel could exceed over 30 km transmission at the
bit-error-rate (BER) of
. When the BER was set at
,
the module transmitted over 20 km. The average system power
penalty of the proposed optical module was about 12 dB. The
proposed high-performance 40-Gb/s CWDM module
demon-strates not only the feasibility of a 30 km single-mode fiber
(SMF) transmission, but also shows the low-cost possibility
that ensures the application of WDM-passive optical network
(WDM-PON) fiber-to-the-home (FTTH) systems.
The other sections of this paper are organized as follows.
Sec-tion II describes the device structure and fabricaSec-tion process.
The measurement results of the 40-Gb/s CWDM optical module
and discussion are presented in Section III. A brief conclusion
is given in Section IV.
II. M
ODULES
TRUCTURE ANDF
ABRICATIONA. Fabrication of the DFB Laser With Collimator Output
For cost-efficiency consideration, an uncooled 10-Gb/s DFB
laser diode was bonded on a conventional transistor-outline
(TO)-56 header. A ball lens cap was welded on the top of the
header to focus the laser light. The resonant effect induced
by the TO-Can package degraded the radio-frequency (RF)
performance. In order to reduce the impedance mismatch and
the parasitic effects, a built-in matching resistor was used inside
a low-cost TO laser module [8]. The impedance of the DFB
laser was designed at 25
. This low-cost coaxial type package
is suitable for 10-Gb/s applications.
In order to extend the propagation distance of the light source
in free-space, an optical collimator was integrated with the
LIN et al.: HIGH-PERFORMANCE AND LOW-COST 40-GB/S CWDM OPTICAL MODULES 645
Fig. 1. Photograph of the DFB laser module with a collimated light output.
Fig. 2. Coupling efficiency of the optical collimator as a function of position.
cost coaxial type DFB laser by adopting the laser welding
tech-nique [8]. Fig. 1 shows the photograph of the DFB laser with a
collimator output. Because the conventional optical collimator
with gradient index (GRIN) lens finds it difficult to obtain a long
working distance in free-space transmission, an optical
colli-mator with C-lens was used to increase the working distance and
the coupling efficiency, without increasing the cost. The
cou-pling efficiency between two optical collimators at different
po-sitions is shown in Fig. 2. The working distance of each optical
collimator was chosen at 85, 95, 115, and 125 mm in order to
propagate different optical paths. The coupling efficiency
main-tained above 70% within a propagation distance of 60–150 mm.
This coupling efficiency could be converted into 0.72 dB for the
insertion loss. The beam diameters of these optical collimators
were about 0.5 mm. This C-lens optical collimator was less
sen-sitive in working distances than the conventional collimator with
GRIN lens. The dimension of the DFB laser with a collimator
output was 3.0
0.5
0.5 cm . To ease the RF response
mea-surement, the DFB laser was attached to a FR4 printed-circuit
board (PCB) with an SMA connector. The performance of the
DFB laser will be described in Section III.
B. Structure and Fabrication of the Proposed 40-Gb/s CWDM
Optical Module
Fig. 3 shows the prototype of the 4-cahnnel CWDM optical
module with each channel modulated at 10-Gb/s giving an
ag-gregated data rate of 40-Gb/s. This CWDM module consisted of
four uncooled 10-Gb/s DFB lasers as the input port 1–4 and one
single-mode fiber as the output port. The emission wavelengths
Fig. 3. Photograph of the 40-Gb/s CWDM module.
of port 1–4 were 1275, 1350, 1325, and 1300 nm, respectively.
The DFB lasers were attached at the side of the module. Since
the propagation distances of these four DFB lasers with
inte-grated collimators were different, the working distance of the
devices were different. Because the 1300 nm DFB laser was
arranged at the longest propagation channel, it should be
inte-grated with the longest working distance collimator.
The zig-zag architecture was adopted as the optical path by
using three pieces of band-pass thin-film filters to transmit or
reflect the collimated laser beams. The dimensions of the TFFs
were 1.4
1.4
1.0 mm . The band-pass wavelengths of the
TFF1, TFF2, and TFF3 were 1275, 1350, and 1325 nm,
respec-tively. The transmission bandwidth of the TFFs was about 16
nm. The transmission-band and stop-band losses of the TFFs
were 0.3 and 30 dB, respectively. Because a larger incident
angle would shift the bandwidth range of band-pass TFFs to
short wavelengths, the incident angle of every TFF was limited
by 12 . Therefore, the maximum full angle of every light trace
in the optical module was designed at 22 . The coupling
toler-ance of optical collimator alignment was very sensitive at the
tilted angle (smaller than 0.1 ). The coupling tolerance at the
-direction was less sensitive by adopting the C-lens. The
di-mension of the zig-zag architecture can be reduced by adopting
wider acceptance-angle TTFs.
The fabrication process of the zig-zag architecture TFFs
CWDM coupler is described as follows. First, the ouput port
collimator with an SMF was attached to the metal base. Then
the TFFs were placed at the mark position on the metal base.
The rotation angles of the TFFs can influence the light coupling
severely. The optimized angle of TFF1 was determined by
the maximum coupling power of 1350-nm DFB laser to the
output port fiber. The TFF was fixed by using UV epoxy after
the alignment process. After the coupling measurements of
the 1325 and 1300 nm DFB lasers, the angles of TFF2 and
TFF3 were determined. The dimension of the metal base was
63
46
5 mm . The insertion loss of the zig-zag architecture
TFFs CWDM coupler was less than 2.5 dB for every channel.
The fabrication flow chart of the 40-Gb/s CWDM module
is shown as Fig. 4. Compared with the conventional CWDM
MUX/DeMUX coupler which dimension was 110
80
20
mm
[9], the dimension of this proposed module was
110
60
20 mm . The designed module is compact, which
can save a lot of installation space.
LIN et al.: HIGH-PERFORMANCE AND LOW-COST 40-GB/S CWDM OPTICAL MODULES 649
R
EFERENCES[1] H. Takeuchi, K. Tsu, K. Sato, M. Yamamoto, Y. Itaya, A. Sano, M. Yoneyama, and T. Otsuji, “NRZ operation at 40 Gbit/s of a compo-nent module containing am MQW electroabsorption modulator inte-grated with a DFB laser,” IEEE Photon. Technol. Lett., vol. 9, no. 5, pp. 572–574, May 1997.
[2] M. Sugiyama, M. Doi, S. Taniguchi, T. Nakazawa, and H. Onaka, “Driverless 40 Gbit/s LiNb03 modulator with sub-1 V drive voltage,” in Proc. OFC, 2002, pp. 853–856.
[3] K. S. Choi, Y. H. Kwon, J. S. Choe, Y. D. Chung, Y. S. Kang, J. Kim, B. T. Ahn, and J. T. Moon, “Development of packaging technologies for high-speed (>40 Gb/s) optical modules,” IEEE J. Select. Top. Quant.
Electron., vol. 12, no. 5, pp. 1017–1024, Sep./Oct. 2006.
[4] T. Sakamoto, S. Nobuo, S. Koike, K. Hadama, and K. Naoya, “4 channel x 10 Gbit/s optical module for CWDM links,” in Proc. ECTC
2004, 2004, vol. 1, pp. 1024–1028.
[5] D. Kuchta, Y. Kwark, C. Schuster, C. Baks, C. Haymes, J. Schaub, P. Pepeljugoski, L. Shan, R. John, D. Kucharski, D. Rogers, M. Ritter, J. Jewell, L. Graham, K. Schrodinger, A. Schild, and H. M. Rein, “120 Gb/s VCSEL-based parallel optical link and custom 120 Gb/s testing station,” in Proc. ECTC 2004, May 2006, vol. 1, pp. 1003–1011. [6] K. Tsuruoka, R. Kobayashi, Y. Ohsawa, T. Tsukuda, T. Kato, T. Sasaki,
and T. Nakamura, “Four-channel 10–Gb/s operation of A1GaInAs-MQW-BH-DFB-LD array for 1.3m CWDM systems,” IEEE J.
Se-lect. Top. Quant. Electron., vol. 11, no. 5, pp. 1169–1173, Sep./Oct.
2005.
[7] T. Ban, R. Mita, Y. Matsuoka, H. Ichikawa, and M. Shishikura, “1.3 four-channel x 10-Gb/s parallel optical transceiver with polymer PLC platforms for very-short-reach applications,” IEEE J. Select. Top.
Quant. Electron., vol. 12, no. 5, pp. 1001–1007, Sep./Oct. 2006.
[8] T. T. Shih, M. C. Lin, and W. H. Cheng, “High-performance low-cost 10 Gb/s coaxial DFB laser module packaging by conventional TO-Can materials and process,” IEEE J. Select. Top. Quant. Electron., vol. 12, no. 5, pp. 1009–1016, Sep./Oct. 2006.
[9] Y. Li, C. L. Lee, D. Wang, L. Li, J. Li, F. Wu, and W. S. Tsay, “Perfor-mance of an ultra-low loss, ultra compact, free-space packaging plat-form for CWDM applications,” in Proc. LEOS, Jun. 2004, pp. 73–74.
Min-Ching Lin was born in Taipei, Taiwan, in 1979.
He received the B.S. degree in electrical engineering from Yuan-Ze University, Taoyuan, Taiwan, in 2001, the M.S. and Ph.D. degrees in electro-optical engi-neering from National Sun Yat-Sen University, Kaoh-siung, Taiwan, in 2003 and 2009, respectively.
His main research interests are high-speed opto-electronic packaging and radio-frequency circuit de-sign for telecommunication applications.
Tien-Tsorng Shih was born in Taiwan, in 1965. He
received the B.S. and Ph.D. degrees from the National Chiao Tung University, Taiwan, in 1986 and 1991, respectively.
In 1991, he joined Telecommunication Laborato-ries, Taiwan, as a Research Associate. From 1996 to 2000, he was a Project Manager at Chunghwa Telecommunication Laboratories, Taiwan. In 2000, he founded Infomax Optical Technology Corpo-ration and was the CEO during 2000–2003. He is now an Assistant Professor at the Department of Electronic Engineering, National Kaohsiung University of Applied Sciences, Taiwan. His main research interests include the theoretical study of optical waveguides and III-V optoelectronic devices, fabrication of laser diodes, photo-diodes, and planar lightwave circuits, packaging technology for optoelectronic devices, transceiver modules, and transmission technologies for the fiber optics communication applications.
Pei-Hao Tseng was born in Kaohsiung, Taiwan, on
October 30, 1981. He received the B.S. degree in electrical engineering from Chung Hua University, Hsinchu, Taiwan, in 2004 and the M.S. degree in Institute of Photonics and Communications engi-neering at the National Kaohsiung University of Applied Sciences. He is currently working Ph.D. degree in electro-optical engineering, National Sun Yat-sen University, Kaohsiung, Taiwan.
His research interests include radio-frequency cir-cuit design and measurement for telecommunication applications.
Kuei-Ming Chu was born in Kaohsiung, Taiwan.
He received the B.S. degree in electrical engineering from National Sun Yat-Sen University, Kaohsiung, Taiwan, in 2008. He is currently working toward the M.S. degree in electro-optical engineering, National Sun Yat-sen University, Kaohsiung, Taiwan.
His main research is high-speed optoelectronics packaging.
Chieh Hu was born in Taichung, Taiwan, in 1967, He
received the M.S. and Ph.D. degrees in mechanical engineering from the University of National Central, Taoyuan, Taiwan, in 1991 and 1996, respectively.
In 1996, he joined the Industrial Technology Research Institute (ITRI), Hsin Chu, Taiwan. Since 2000, he was the Head of the Department of Laser Lightwave Technology. His main research interests include scientific and technical aspects associated with the device of optical fiber communication and fiber laser.
Wood-Hi Cheng (M’95–SM’00) was born in
Changhua, Taiwan, in 1944. He received the Ph.D. degree in physics from Oklahoma State University, Stillwater, in 1978.
From 1978 to 1980, he was a Research Asso-ciate at Telecommunication Laboratories, Taiwan. From 1980 to 1984, he was a Research Engineer at General Optronics, Edison, NJ. From 1984 to 1991, he was a Principal Design Engineer at Rockwell International, Newbury Park, CA. From 1991 to 1994, he was an Optoelectronic Packaging Manager at Tacan Corporation. Carlsbad, CA. He is now a Professor at the Institute of Electro-Optical Engineering and Director of Southern Taiwan Opto-Electronic Center of Excellence, National Sun Yat-Sen University, Kaoshiung, Taiwan. His research and development activities have been focused on the design and fabrication of high-speed semiconductor lasers for lightwave communications, highly efficient light coupling from lasers into fibers, fiber couplers, character-ization of III-V semiconductors materials, and optoelectronic packaging. His current research interests are the design, fabrication, and finite-element-method analysis for laser module packaging, high-speed laser module packaging for digital lightwave systems, fabrication of high density WDM components, and novel materials for electromagnetic shielding. He served as a consultant for Chunghwa Telecom Laboratories, Opto-Electronics and System Laboratories, and Chung-Shan Institute of Science and Technology, all from Taiwan.
Dr. Cheng is a member of the Optical Society of America (OSA) and the Photonics Society of Chinese-Americans. He served as a Chair for the IEEE Lasers and Electro-Optics Society (LEOS), Taipei Chapter during 1999-2000, and served as a Chair for the OSA, Taiwan Chapter, during 2005-2006.