第五章 結論與未來展望
5.2 未來展望
由實驗可得知元件通道內的應力分佈對於電晶體的表現有所提升，但是 本論文中建立的三維模型依舊無法很真實的呈現實際元件的幾何形狀，由於 電晶體製程的設計圖案佈局圖通常不是單一顆元件，是所有不同的電晶體之 閘極皆是串聯而成的，因此三維模型需要建立橫向 (元件通道寬度方向)延伸 之閘極寬度且選取適合之長度，以更正確地得知元件通道內之應力分佈與表 現。未來若能建立有延伸之閘極寬度的三維模型，更能夠匹配真實的電晶體 元件。
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