本研究針對以緩冷凝固製備且基地結晶(Zr48Cu32Al8Ag8,Ta4)Si0.75 金屬玻 璃複材(約 1.0mm 厚度)，以 Nd:YAG 雷射進行重融非晶化改質研究，以確認 基地結晶的金屬玻璃複材是否可透過雷射改質再利用，其研究結果如下:
Part I、雷射表面改質 BMGC
1. 經過雷射表面改質後，XRD 圖顯示在 2θ 角為 30˚-50˚間出現一個明顯的 非晶峰，此外SEM 途中能發現結晶相 Zr/Cu 明顯消失。
2. TEM 觀測銲道與銲道重疊區域，結果顯示此二種區域表面分布次微米化 的Ta 顆粒，其周圍與基材間分布一層界面相，經擇區繞射鑑定為 ZrCu 相。
3. 熱物性質結果顯示，MC-BMGC 並不具有明顯的 BMG 特徵溫度峰；經 過雷射改質後的LSAF-BMGC 其各項特徵溫度接近於 IMA-BMGC。
4. 機 械 性 質 結 果 經 過 雷 射 表 面 改 質 後 ， LSAF-BMGC 的 硬 度 值 與 IMA-BMGC 無太大差異。
5. 恆電位儀對 IMA-BMGC、MC-BMGC 及 LSAF-BMGC 浸泡至 3.5wt%
NaCl 水溶液之極化曲線結果表示在自然腐蝕發生的情況下，IMA-BMGC 與 LSAF-BMGC 發生腐蝕反應的機率略低，而 MC-BMGC 發生腐蝕反 應的機率較高；LSAF-BMGC 的腐蝕電位略低於 IMA-BMGC 推測其原 因在於銲點重疊部分殘留應力較高，腐蝕優先發生。
6. 表面腐蝕後觀察發現結晶與非結晶兩種 BMGC 表面上的腐蝕機制並非 相同，IMA-BMGC 與 LSAF-BMGC 採局部腐蝕的孔蝕與伽凡尼腐蝕，
MC-BMGC 受腐蝕表面則發現產生的均勻腐蝕行為。
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Part II、整塊式雷射改質 BMGC
1. SEM 圖結果顯示經過參數 C(7.0J)與參數 D(7.5J)雷射整塊式雷射改質 後，原基地相中析出的葉片狀Zr/Cu 析出物在改質後消失，而銲道中的 Ta 強化相總體基百分率也有下降的趨勢，其部分轉變為次微米級的尺 寸，部分則來不及重新析出。
2. XRD 鑑定結果顯示參數 C(7.0J)、參數 D(7.5J)的 LWBAF-BMGCs 基材基 材呈現非晶態，除了特意添加的Ta 強化相峰值外，在 2θ 為 30˚-50˚時呈 現寬廣的非晶繞射峰。
3. 由 TEM 可以得知，基材與 Ta 顆粒的界面相環繞著一層 ZrCu，探討原因 為ZrCu 與 Ta 強化相具有相似的晶體結構與晶格常數，使 ZrCu 能於 Ta 周圍優先成核；此外，在經過連續的改質過程後，有部分 ZrCu 相厚度 會明顯增長，但基地相仍保有完好的非晶態。
4. 熱物性質量測結果指出，在經過雷射改後 Tg下降會使的ΔTx區間變寬，
而探討可能的原因為冷卻速率越快，原子自由體積越大會導致 BMGC 在升溫時越容易跨過玻璃轉態溫度。
5. 機械性質部分使用微小維氏硬度機量測，可以發現 MC-BMGC 由於基地 相內遍布大量結晶相，其硬度值最低；而LSAF-BMGC 與參數 C、D 的 LWBAF-BMGC 在硬度量測時與 IMA-BMGC 相差無幾，顯示總體基百 分率下降的Ta 顆粒對於硬度質的影響較小。
6. 腐蝕時， LWBAF-BMGC 的腐蝕機率會隨著雷射能量的上升而增高，是 由於銲道外圍的優先腐蝕所引發；但觀察腐蝕發生後的腐蝕速率，由於 雷射後部分的 Ta 強化相細化為次微米級，ZrCu 相的成核點較少，且部 分來不及析出的 Ta，有助於形成鈍態層，因此腐蝕速率較 IMA-BMGC 與MC-BMGC 低。
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7. 觀 察 極 化 曲 線 的 鈍 態 層 區 域 ， 可 以 知 道 參 數 C 與 參 數 D 的 LWBAF-BMGC 有較厚的鈍態層，其原因可以歸咎於未析出的 Ta 強化相 能進一步幫助基地相形成緻密的鈍態層。
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