The heterogeneous design challenges

The 3D-IC technology reveals the future of semiconductor industry, however it also impacts the chip design and test methodology. Low cost [62] and heterogeneous [63, 64] integration are important characteristics of 3D system design. Some digital 3D test schemes are been developed in [65], but the test method of integrated digital, mixed signal and other heterogeneous devices is still a challenge.

Some of the heterogeneous design challenges are shown below:

• We may need to pay more attentation on the reliability issues in bio-based system when we develope the test schemes.

• We need some new ideas to integrate the various test methods in heterogeneous system.

• The test methodology of the heterogeneous system still needs researchers to put more efforts on it.

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