行政院國家科學委員會補助專題研究計畫成果報告
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模組化潔淨室應用於晶圓廠之規劃與評估
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計畫類別：個別型計畫
計畫編號：NSC89－2212－E－002－064
執行期間： 88 年 8 月 1 日至 89 年 7 月 31 日
計畫主持人：謝淑華
本成果報告包括以下應繳交之附件：
□赴國外出差或研習心得報告一份
□赴大陸地區出差或研習心得報告一份
□出席國際學術會議心得報告及發表之論文各一份
□國際合作研究計畫國外研究報告書一份
執行單位：國立台灣大學機械工程學系
中 華 民 國 89 年 8 月 21 日
行政院國家科學委員會專題研究計畫成果報告 模組化潔淨室應用於晶圓廠之規劃與評估 The design and evaluation of the IC fabr ication plant
by adopting the modular clean room 計畫編號：NSC89-2212-E-002-064 執行期間：88 年 8 月 1 日至 89 年 7 月 31 日 主持人：謝淑華 國立台灣大學機械工程學系 計畫參與人員：許榮通，陳宏偉 國立台灣大學機械工程學系 一、 中文摘要 為了加速半導體上市的速度，工 研院機械所吳顧問伯奮先生提出一以 模組生產為架構的概念廠，因應目前 半導體產業低稼動率、高在製品庫 存、巨額機器設備投資、過長的設廠 時間等等的問題。本研究主要目的在 於應用離散系統模擬，探討一個以此 模組生產化方式為架構的概念廠的可 行性。研究項目包括：1. 此概念廠在 高當機率與長修護時間下，是否仍可 維持合理的生產力? 2. 此概念廠所需 要的機器的機台數是否較多? 3. 概念 廠的機器應如何排列? 在本研究中， 一個模擬工廠模式將被建立，利用此 模式作敏感度分析，借此驗證此模組 化生產概念廠的可行性，以及提出具 體數據說明其優缺點，進而落實模組 化半導體概念廠的構想，期能提供業 界一清楚的模組生產為架構的概念廠 藍圖。 關鍵詞：模組生產工廠，半導體製造 業，平均當機時間，平均修護時間 Abstr act
To speed up the time to bring a new
IC device to market, ITRI of Taiwan proposed a conceptual modular-based IC fabrication plant. Under this approach, a machine should be replaced with a working machine instead of repairing the broken one in plant. This study investigates the feasibility of this concept for the Taiwan IC industry. The following issues are examined. First, can a modular plant maintain reasonable productivity with high machine failure rate and long machine-repair time? Second, does a modular plant require more machines than a traditional one? Third, how should a modular plant be laid out? Simulations are used to compare the performance of a modular plant with that of a traditional plant. Three different modular plant layouts, namely function-type, flow-line and process-layer, are constructed and compared to present a rough idea of the layout of a modular plant. Moreover, simulation results demonstrate the advantages and drawbacks of a modular plant, thus clarifying the feasibility of adopting a modular plant.
plant, semiconductor manufacturing, mean time between failure (MTBF), mean time to repair (MTTR)
二、 緣由與目的
In semiconductor manufacturing, long plant-construction time, high probability of machine failures, and long repair time significantly increase the time to bring a new device to market, subsequently reducing the competitiveness of Taiwan's IC products.
Industrial Technology Research Institute (ITRI) of Taiwan [Wu and Chiang, 1995] proposed a conceptual modular-based IC fabrication plant for solving the above mentioned problems. Unlike the construction of a traditional plant, the construction of the building itself and the installation of equipment and utility/exhaust/air-conditioning piping systems of a modular plant progress simultaneously at different places. Such progress is attributed to that the equipment of a modular plant is installed in a production module. The various production modules are then arranged within the building individually by using a crane installed in the center of the plant. The plant-construction time is therefore cut in half. Moreover, when the plant begins operating, once a machine in a production module breaks down, instead of repairing the machine in the plant, the
crane removes the module containing the broken machine and inserts a new module. By so doing, the aforementioned problems can be solved effectively.
This study investigates the feasibility of this idea for the Taiwanese IC industry. In particular, the following issues are addressed. First, can a modular plant maintain reasonable productivity with high machine failure rate and long machine-repair time? Second, does a modular plant require more machines than a traditional one? Third, how should a modular plant be laid out? Simulation is used to compare the performance of a traditional plant with that of a modular plant. Three different plant layouts, namely function-type, flow-line and process-layer, are constructed The evaluation indexes include production cycle times and the numbers of machines required. The simulation results reveal the advantages and drawbacks of a modular plant. Thus the feasibility of adopting a modular plant is clarified.
三、 結果與討論
A feasibility study of a modular-based IC fabrication plant has been carried out. Comparing the performance of a modular plant with that of a traditional plant indicates that a modular plant can provide reasonable cycle times regardless of frequent machine failure
and/or long machine repair times. Moreover, the number of on-line machines required in a modular plant is very close to that required in a traditional plant when the productivity is the same. The large amount of off-line machine investment affects the competitiveness of a modular plant. However, to maintain productivity in poor plant conditions, the additional machines in a modular plant could be much less than that in a traditional plant. Besides, the construction of a modular plant can be completed in only a half of the construction time of a traditional plant. Thus, when time is a major cost factor, a modular plant is worth considering. This paper has also presented three possible layouts for modular plants. The simulation results show that the function-type layout is the best. However, since this study only included a 60-operation case and did not consider the influence of transportation problems, a function-type layout is not conclusively better than the two alternatives. While this study provides some basic information regarding a modular plant layout more cases regarding a modular plant layout need to be studied. In addition, a transportation system for a modular plant is also worthy of future study.
四、計畫結果自評 本計畫執行情形與原計畫書相符 合，證實模組化晶圓廠在某些條件 下，值的被採用，已提供原構想單位 ITRI 參考。目前正在撰寫期刊論文一 篇。繼本研究後，將以製程層為基礎 的模組化晶圓廠的最佳佈置方案研究 作為下一階段的研究課題。 五、 參考文獻
Chang, C.F. and Hsieh, M.T., 1998, A process layer layout for IC fabrication, in Chinese, Journal of the Mechatronic Industry, pulished
by Mechanical Industry Research Laboratories, Industrial Technology Research Institute, Vol.187, pp.210-219.
Fowler, J. W., Hogg, G. L., and Phillips, D. T., 1992, Control of Multiproduct Bulk Service Diffusion/Oxidation Process, IIE Transactions, Vol.24, No.4,
pp.84-96.
Glassey, C. R.,and Resende, M.G.C., 1988, Closed-Loop Job Release Control for VLSI Circuit Manufacturing, IEEE Transactions on Semiconductor Manufacturing, Vol.1, No.1, pp. 36-46.
Glassey, C. R., and Weng, W.W., 1991, Dynamic Batching Heuristic for Simultaneous Processing, IEEE Transactions on Semiconductor Manufacturing, Vol. 4, No.2, pp.
77-82.
Goldratt, E. M., 1988, Computerized Shop Floor Scheduling,
International Journal of
Production Research, Vol.26, No.3,
pp.429-442.
Hung, Yi-Feng and Leachman, R. C., 1996, A Production Planning Methodology for Semiconductor Manufacturing Based on Iterative Simulation and Linear Programming Calculation, IEEE
Transactions on Semiconductor
Manufacturing, Vol. 9,No.2,
pp.257-269.
Lozinski, C., and Glassey,C.R., 1988, Bottleneck Starvation Indicators for Shop Floor Control, IEEE Transactions on Semiconductor Manufacturing, Vol. 1,No. 4, pp.
147-153.
Lu, C. H. S., Ramaswamy, D., and Kumar, P. R., 1994, Efficient Scheduling Policies to Reduce Mean and Variance of Cycle-Time in semiconductor Manufacturing Plants, IEEE Transactions on Semiconductor Manufacturing, Vol. 7, No.3, pp. 374-388.
Narahari, Y., and Khan, L. M., 1996a, Performance Analysis of Scheduling Polices in Reentrant Manufacturing Systems,
Computers Operations Research, Vol.23, No.1, pp.37-51.
Narahari, Y., and Khan, L. M., 1996b,
Modeling Reentrant
Manufacturing Systems with Inspection Stations, Journal of Manufacturing Systems, Vol.15, No.6, pp.367-378.
Schragenheim, E., and Ronen, B. 1990, Drum-buffer-rope Shop Floor Control, Production and Inventory Management Journal, Vol.31,Q3,
pp.18-23.
Simons, J. V., Jr., W.P. Simpson,Ⅲ, B. J. Carlson, S. W. James, C. A. Lettiere ,and B. A. Mediate, Jr., 1996,Formulation and Solution of The Drum-buffer-rope Constraint Scheduling Problem, International Journal of Production Research, Vol.34, No.9, pp.2405-2420.
Wein, L. M., 1988, Scheduling Semiconductor Wafer Fabrication,
IEEE Transactions on
Semiconductor Manufacturing, Vol. 1, No.3, pp. 115-130.
Weng,W. W. and Leachman, R. C. 1993, An Improved Methodology for Real Time Production Decisions at
Batch-Process Work Stations,
IEEE Transactions on
Semiconductor Manufacturing, Vol. 6, No.3, pp. 219-225.
Wu, B.P. and Chiang, S.C., 1995, A Proposed Architecture for Economical Flexible Automated Semiconductor Manufacturing,
Taiwan Packaging Seminar, 1995,
SEMI, Hsinchu, Taiwan.
Wu, B.P., Lee, H.C., Hsu, C.Y. and Chang, C.F, 1998, a Modular-based Clean Room. In Chinese, Lecture notes, Nov. 26, 1998,
Energy & Resources Laboratories, Industrial Technology Research Institute, pp.1-20.
