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電機學院 IC 設計產業研發碩士班

平面顯示器玻璃基板上具有位階轉

換功能之類比輸出級電路設計

Design of Analog Output Buffers with Level

Shifting Function on Glass Substrate for Panel

Application

研 究 生:陳紹岐

指導教授:柯明道 教授

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平面顯示器玻璃基板上具有位階轉

換功能之類比輸出級電路設計

Design of Analog Output Buffers with

Level Shifting Function on Glass

Substrate for Panel Application

研 究 生:陳紹岐 Student :Sao-Chi Chen

指導教授:柯明道 Advisor :Ming-Dou Ker

國 立 交 通 大 學

電機學院 IC 設計產業研發碩士班

碩 士 論 文

A Thesis

Submitted to College of Electrical and Computer Engineering National Chiao Tung University

in partial Fulfillment of the Requirements for the Degree of

Master in

Industrial Technology R & D Master Program on IC Design

July 2008

Hsin-Chu, Taiwan, Republic of China

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平面顯示器玻璃基板上具有位階轉換功能之

類比輸出級電路設計

學生: 陳 紹 岐 指導教授: 柯 明 道 教授

國立交通大學

國立交通大學電機學院產業研發碩士班

摘要

低溫複晶矽(low temperature poly-silicon, LTPS)薄膜電晶體(thin-film transistors, TFT) 已被視為一種材料廣泛地應用於可攜帶式系統產品中,例如數位相機、行動電話、個人 數位助理(PDA) 、筆記型電腦等等,這是由於低溫複晶矽薄膜電晶體的電子遷移率 (electron mobility)約是傳統非晶矽(amorphous silicon)薄膜電晶體的百倍大。此外,低溫

複晶矽技術可藉由將驅動電路整合於顯示器面板之週邊區域來達到輕薄、小巧且高解析 度 的 顯 示 器 。 這 樣 的 技 術 也 將 越 來 越 適 合 於 系 統 整 合 型 面 板 (system-on-panel /system-on-glass)之實現。 近年來,低溫複晶矽技術具有將所有控制與驅動電路整合入玻璃基板的趨勢。一般 而言,液晶顯示器的驅動電路包含閘極驅動電路、資料驅動電路以及直流對直流轉換電 路。其中,資料驅動電路則是由移位暫存器、閂鎖器、電位移轉器、數位類比轉換器以

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及類比輸出緩衝器所組成。然而,在量產線上仍無法精確控制複晶矽薄膜電晶體之晶粒 大小與晶粒邊界的一致性,這會使得複晶矽薄膜電晶體因為元件特性變化而具有較差的 一致性。元件特性的變化對於在液晶顯示面板上的類比電路設計是一個嚴重的問題。也 由於這個原因,在本論文中將著重於資料驅動電路中的類比電路設計。 在本篇論文中,提出了一個著重於元件特性變化考量之資料驅動電路的類比輸出緩 衝器,並以此緩衝器為基礎提出兩個具有位階轉換功能的類比輸出級電路,以上電路皆 以 3-m LTPS 製程技術實現。類比緩衝器可以在 100 kHz 的方波輸入訊號下具有 0.8 V 至 9 V 的輸出範圍。此具有位階轉換功能的類比輸出級電路也與數位類比轉換電路整合 在一起。可以藉由電路本身的位階轉換功能,在不需要修改驅動電路的前提下可驅動不 同工做電壓之面板,並且符合該面板所需的珈瑪補償曲線。

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Design of Analog Output Buffers with Level Shifting

Function on Glass Substrate for Panel Application

Student: Shao-Chi Chen Advisor: Prof. Ming-Dou Ker

Industrial Technology R & D Master Program of

Electrical and Computer Engineering College

National Chiao-Tung University

ABSTRACT

Low temperature poly-silicon (LTPS) thin-film transistors (TFTs) have been widely

investigated as a material for portable systems, such as digital camera, mobile phone, personal

digital assistants (PDAs), notebook, and so on, because the electron mobility of LTPS TFTs is

about 100 times larger than that of the conventional amorphous silicon TFTs. Furthermore,

LTPS technology can achieve slim, compact, and high-resolution display by integrating the

driving circuits on peripheral area of display. This technology will also become more suitable

for realization of system-on-panel/system-on-glass (SOP/SOG) applications.

Recently, LTPS technology has a tendency towards integrating all control circuits and

driver circuits on the glass substrate. In general, the liquid-crystal display (LCD) driver

contains gate driver, data driver, and DC-DC converter. The gate drive usually utilizes high

voltage to enhance the response time of LCD monitor. The data driver is composed of shifter

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However, the poly-Si TFTs suffered poor uniformity with large variations on the device

characteristics due to the narrow laser process window for producing large-grained poly-Si

TFTs. The device variation becomes a very serious problem for analog circuit design on LCD

panel. For this reason, the analog circuits of the data driver are focused in my works.

In this thesis, an on-panel analog output buffer for data driver with consideration of

device characteristic variation and output buffers with level shifting function are proposed in a

3-m LTPS technology. The proposed analog output buffer can be operated at 100 kHz rail-to-rail square wave input with a 0.8-to-9 V output swing. The proposed output buffer with

level shifter can be integrated with the digital-to-analog converter (DAC). This circuit can

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誌謝

兩年的碩士生涯很快就過去了,在這兩年之中,首先最要感謝的是我的指導教授, 柯明道教授的殷殷教誨,在研究上他給予我們許多的自由、指導與建議,引導我們發揮 自己的創意及構想,還提供我相當多的資源,讓我能不斷地的充實自我;教導我們做事 情要抱持嚴謹的態度,待人處事要圓融等,平常也會關心我們的生活狀況,讓我獲益良 多。此外,由於老師的努力,讓我能有與業界合作與接觸的機會,也因此擁有了許多晶 片驗證的機會,在研究上不會有後顧之憂,另外,老師也常常為了修改我們的論文而廢 寢忘食。在此,我要向柯明道教授致上我最深的謝意,謝謝您讓我在碩士的兩年中能有 如此的成長。 在這段求學的過程中,『友達光電股份有限公司』給予我許多的研究的資源與幫助, 使我的電路能夠順利完成。在此特別感謝謝曜任處長、李純懷經理、郭俊宏副理、白承 丘、楊坤彥、李宇軒等諸位長官,在晶片下線與量測設備上,所給予我的許多幫助。 此外,我也要感謝『奈米晶片與系統實驗室』的陳榮昇、顏承正、張瑋仁、蕭淵文、 王資閔、林群祐、李宇軒、蒙國軒、莊介堯、黃曄仁、蔡佳琪、林彥良、翁怡歆、林佑 達、陳思翰等諸位實驗室學長姐以及學弟妹們,在各方面給予我許多幫助使我能順利完 成碩士論文。感謝『奈米晶片與系統實驗室』及助理卓慧貞小姐給予我在研究上的資源 及行政上的幫助,讓我完成學業。 接著要感謝的是一起打拼的同學們,小州哥、小胖、北鴨、小帆、99 範、科科、阿 宅、微笑阿邦、建名、宗恩、歐陽叔叔、歐威、國維以及塔哥,大家一起修課、熬夜、 看電影、聚餐、出遊,讓我的碩士生活多采多姿,大家在研究上互相討論、互相加油更 是碩士生涯中令我難忘的回憶;萬諶、維德、神童、豪哥、宗裕、舜哥、忠哥、松諭、 巧玲等等實驗室的學長姐,在學業上或其他方面上對我的幫助。 最後我要謝謝我的父親陳平護、母親魏如好、哥哥陳春陽以及女友逸雯,給予我一 切的支持與協助,使我無後顧之憂,在我失去信心時給我的支持與鼓勵,未曾對我失去 過信心。你們一直都是我精神上最大的支柱以及困難時的避風港。 還要感謝很多人,不可勝數,在此一併謝過,我不會讓你們失望的。 陳 紹 岐 僅誌於竹塹交大 民國九十七年七月

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CONTENTS

ABSTRACT(CHINESE) ... i

ABSTRACT ... iii

ACKNOWLEDGEMENT ... v

CONTENTS ... vi

TABLE CAPTIONS ... viii

FIGURE CAPTIONS ... ix Chapter 1 Introduction ... 1 1.1 BACKGROUND ... 1 1.2 MOTIVATION ... 1 1.3 THESIS ORGANIZATION ... 3 Chapter 2 Background Knowledge of Thin-Film Transistor Liquid Crystal Displays ... 7

2.1 LIQUID CRYSTAL DISPLAY STRUCTURE ... 7

2.1.1 Material and Display Theory of Liquid Crystal [4], [5] ... 7

2.1.2 Liquid Crystal Display Module Structure ... 9

2.1.3 Equivalent Model of Dot in each Pixel Cell ... 9

2.2 DRIVING METHOD IN TFT-LCD PANEL ... 11

2.2.1 Driving Method ... 11

2.2.2 Gamma Correction ... 12

2.3 PERIPHERY CIRCUIT BLOCK ... 13

2.3.1 Scan Driver Circuit ... 13

2.3.2 Data Driver Circuit ... 14

Chapter 3 An On-Panel Analog Output Buffer for Data Driver ... 24

3.1 INTRODUCTION ... 24

3.2 DEVICE CHARACTERISTIC VARIATION IN LTPS TECHNOLOGY ... 25

3.3 ON-PANEL ANALOG OUTPUT BUFFER ... 26

3.31 Source Follower Analog Output Buffer [16], [17] ... 26

3.3.2 Unity-Gain Output Buffer with an OPAMP [18]... 26

3.4 EXPERIMENTAL RESULTS ... 28

3.5 DISCUSSION ... 29

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Chapter 4

The Analog Output Buffers with Level Shifting Function for DAC ... 43

4.1 INTRODUCTION ... 43

4.2 DIGITAL-TO-ANALOG CONVERTERS [19]-[23] ... 43

4.2.1 R-String DAC with Switch Array Decoding ... 44

4.2.2 R-String DAC with Binary Tree... 44

4.2.3 R-String DAC with Digital Decoding ... 44

4.2.4 Charge-Redistribution DAC ... 44

4.2.5 Resistor-Capacitor Hybrid DAC ... 45

4.2.6 Current-Steering DAC ... 46

4.3 ANALOG OUTPUT BUFFER with LEVEL SHIFTING FUNCTION ... 47

4.3.1 Analog output buffer with level shifting function type I ... 47

4.3.2 Analog output buffer with level shifting function type II ... 48

4.4 EXPERIMENTAL RESULTS ... 49

4.5 DISCUSSION ... 49

4.6 SUMMARY ... 50

Chapter 5 Conclusion and Future Works ... 67

5.1 CONCLUSION ... 67

5.2 FUTURE WORKS ... 68

REFERENCES ... 69

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TABLE CAPTIONS

Table 3.1 The mobility variation for n-type and p-type TFTs at different stress conditions ... 30 Table 3.2 Summary of the simulated circuit performances of the output buffer in

Fig. 3.8 ... 30 Table 3.3 The total measurement results of the unity-gain output buffer ... …31 Table 4.1 The comparisons of six kinds of the digital-to-analog converter circuits

... …..51 Table 4.2 The resistance of R2 in 0~63 Gray Level ... …51 Table 4.3 The resistance of the analog output buffer with level shifting function type

I ... 52 Table 4.4 The resistance of the analog output buffer with level shifting function type

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FIGURE CAPTIONS

Fig. 1.1 System integration roadmap of LTPS TFT-LCD. ... 4

Fig. 1.2 A CPU with an instruction set of 1-4bity and 8-bit data bus on glass substrate. ... 4

Fig. 1.3 Basic concept of pixel memory technology. ... 5

Fig. 1.4 The roadmap of LTPS technologies leading toward the realization of sheet computers. ... 5

Fig. 1.5 (a) Comparison of an amorphous silicon TFT-LCD module and (b) a low-temperature polycrystalline silicon TFT-LCD module. ... 6

Fig. 2.1 Phase of liquid crystal materials versus temperature. ... 15

Fig. 2.2 (a) A couple of polarizers with 90∘phase shift. (b) A couple of polarizers with liquid crystal. ... 15

Fig. 2.3 The structure of a TN-LCD (a) while light is passing, and (b) while light is blocked. ... 16

Fig. 2.4 The transmitted luminance versus the normalized voltage (VLC/V0) across the LC cell for the normally white mode and the normally black mode. ... 16

Fig. 2.5 The cross section structure of TFT-LCD panel. ... 17

Fig. 2.6 The basic layout and cross section of an AMLCD sub-pixel. ... 17

Fig. 2.7 The equivalent circuit of a TFT in the sub-pixel with voltages, currents, and parasitic capacitances. ... 17

Fig. 2.8 The layout view of a TFT-LCD sub-pixel: (a) CS on common mode and (b) CS on gate mode. ... 18

Fig. 2.9 The equivalent circuit of a TFT-LCD sub-pixel: (a) CS on common mode and (b) CS on gate mode. ... 18

Fig. 2.10 The polarity inversions of TFT-LCD panel. ... 19

Fig. 2.11 The operation waveform of direct driving method. ... 20

Fig. 2.12 The operation waveform of AC modulation driving method. ... 20

Fig. 2.14 The input digital code vs. pixel voltage curve of data driver in TFT-LCD panel. ... 21

Fig. 2.15 The block diagram of the entire TFT-LCD panel circuits. ... 21

Fig. 2.16 The entire addressing system in detail. ... 22

Fig. 2.17 The basic diagram of scan driver circuit. ... 22

Fig. 2.18 The basic diagram of data driver circuit. ... 23

Fig. 3.1 The Variation on threshold voltage (VTH) of 120 LTPS n-type TFTs in different location on the LCD panel. ... 32

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bias voltage. ... 32

Fig. 3.3 (a) The conventional source follower output buffer and (b) its output waveforms at different input voltage. ... 33

Fig. 3.4 The Monte Carlo simulation results of the conventional source follower output buffer... 33

Fig. 3.5 The source follower output buffer with a compensation capacitor. ... 34

Fig. 3.6 The source follower output buffer compensation by device matching (a) the circuit schematic and control signal (b) the measurement results. .. 34

Fig. 3.7 The output unity-gain buffer with OPAMP. ... 35

Fig. 3.8 The two-stage OPAMP with p-type TFTs input circuit. ... 35

Fig. 3.9 The simulation results of analog output buffer with p-channel input. .. 36

Fig. 3.10 The die photo of analog output buffer with p-channel input in 3-m LTPS process. ... 36

Fig. 3.11 The measurement setup of frequency response. ... 37

Fig. 3.12 The measurement procedure of unity-gain frequency. ... 37

Fig. 3.13 The unity-gain bandwidth measurement results of unity-gain buffer with OPAMP. ... 38

Fig. 3.14 The measurement setup of large signal (rail-to-rail square wave ). ... 38

Fig. 3.15 The output waveform of large signal measurement at 100k Hz input signal (a) the pulse width of output waveform is larger than 1/4 period. (b) the pulse width of output waveform is smaller than 1/4 period. ... 39

Fig. 3.16 The measurement results of large signal. ... 39

Fig. 3.17 The offset voltage measurement setup of unity-gain buffer. ... 40

Fig. 3.18 The measurement of offset voltage when vi is 2.5V. ... 40

Fig. 3.19 The measurement of offset voltage when vi is 5V. ... 41

Fig. 3.20 The measurement of offset voltage when vi is 7.5V. ... 41

Fig. 3.21 (a) Circuit and signal-timing diagram of the analog output buffer with the offset compensation technique. (b) The measurement result of this analog output buffer with the offset compensation technique under 50-kHz square wave with a swing of 2-to-8 V. ... 42

Fig. 4.1 The 6-bit R-string DAC with switch array decoding. ... 53

Fig. 4.2 A 3-bit R-string DAC with binary-tree decoding. ... 53

Fig. 4.3 The R-string DAC with digital decoding. ... 54

Fig. 4.4 The charge-redistribution DAC. ... 54

Fig. 4.5 The resistor-capacitor hybrid DAC. ... 55

Fig. 4.6 The current-steering DAC. ... 55

Fig. 4.7 Two gamma curves of different panels. ... 56

Fig. 4.8 The level change circuit by SHARP. ... 56

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Fig. 4.10 The noninverting amplifier circuit with variable resistor. ... 57 Fig. 4.11 Total circuit of analog output buffer with level shifting function type I.……

... 58 Fig. 4.12 The decoder1 in analog output buffer with level shifting function type I.

... ……58 Fig. 4.13 The decoder2 in analog output buffer with level shifting function type I.

... ……59 Fig. 4.14 The operation method of analog output buffer with level shifting function

type I when the Din is “000100”. ... 59 Fig. 4.15 The simulation results of analog output buffer with level shifting function

type I. ... 60 Fig. 4.16 The noninverting amplifier with an amendment voltage. ... 60 Fig. 4.17 The value of the amendment voltage (Va). ... 61 Fig. 4.18 Total circuit of analog output buffer with level shifting function type II.

... ……61 Fig. 4.19 The decoder2 of analog output buffer with level shifting function type

II.… ... 62 Fig. 4.20 The operation method of the output buffer with level shifting function type

II, when Din is “001000”. ... 62 Fig. 4.21 The simulation results of analog output buffer with level shifting function

type II. ... 63 Fig. 4.22 The die photo of output buffer with level shifting function type I. ... 63 Fig. 4.23 The die photo of output buffer with level shifting function type II. ... 64 Fig. 4.24 The measurement setup of analog output buffer with level shifting

function type I. ... 64 Fig. 4.25 The measurement setup of analog output buffer with level shifting

function type II. ... 65 Fig. 4.26 The measurement results of analog output buffer with level shifting

function type II. ... 65 Fig. 4.27 The measurement result of analog output buffer with level shifting

function type II. ... 66 Fig. 5.1 To reduce the power system of analog output buffers with level shifting

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Chapter 1

Introduction

1.1 B

ACKGROUND

At present, active matrix liquid crystal display (AMLCD) is a huge industry in Taiwan,

because AMLCD panel is an important part in many electronic products. We can know that

the revenue of LCD industry in Taiwan is over one trillion NT dollars in 2007. Not only the

large size LCD TV, the small and middle size LCD market are also in growth now. For

portable application we need low power, slim and lighter weight. But between panel and

display driving circuit has many interconnects in conventional amorphous silicon (a-Si)

thin-film transistors (TFTs) technology. In order to reduce the size and cost down, a new

technology is needed.

1.2

M

OTIVATION

However, the low field-effect mobility (ability to conduct current) of amorphous silicon

(a-Si) thin-film transistor (TFT) slows their application only as pixel switching device. There

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temperature they can withstand. The process of high-temperature poly-Si TFTs has a problem

in expensive quartz substrate. Low temperature poly-silicon (LTPS) TFTs had been widely

used in active matrix liquid crystal display (AMLCD), because electron mobility can be 100

times faster than that of the conventional amorphous silicon (a-Si) TFTs. Many small-sized to

mid-sized AMLCDs fabricated by LTPS technology have been used in mobile phone, digital

camera, personal digital assistants (PDAs), notebook, and so on. The state-of-the-art design

efforts focus on realization of system-on-panel/system-on-glass (SOP/SOG) application to

integrate more control and driver circuits on the glass substrate. Fig1.1 shows the system

integration roadmap of LTPS TFT-LCD [1].

System-on-panel (SOP) displays are value-added displays with various functional

circuits. For example, a CPU with an instruction set of 1-4 bytes and an 8bit data bus on glass

substrate is shown in Fig. 1.2 [2]. The static random access memory (SRAM) also has been

integrated in each pixel as Fig. 1.3 [1]. When SRAMs and a liquid crystal AC driver are

integrated in a pixel area under the reflective pixel electrode, the LCD is driven by only the

pixel circuit to display a still image. It means that no charging current to the data line for a

still image. Fig. 1.4 shows the roadmap of LTPS technologies leading toward the realization

of sheet computers. Finally, all of the necessary function will be integrated in LTPS

TFT-LCD [3].

The distinctive feature of the LTPS TFT-LCD is the elimination of TAB-ICs (integrated

circuits formed by means of an interconnect technology known as tape-automated bonding).

LTPS TFTs can be used to manufacture complementary metal oxide semiconductors (CMOSs)

in the same way as in crystalline silicon metal oxide semiconductor field-effect transistors

(MOSFETs). The PCB connection pads are thus reduced to one-twentieth the size of those in

a-Si TFT-LCDs. The most common failure mechanism of TFT-LCDs, disconnection of the

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a high-resolution display because the TAB-IC pitch (spacing between connection pads) limits

display resolution to 130 ppi (pixels per inch). A higher resolution of up to 200 ppi can be

achieved by LTPS TFT-LCDs. Therefore, the SOP technology can effectively relax the limit

on the pitch between connection terminals to be suitable for high-resolution display.

Furthermore, eliminating TAB-ICs allows more flexibility in the design of the display system

because three sides of the display are now free of TAB-ICs [3]. Fig. 1.5 shows a comparison

of a-Si and LTPS TFT-LCD modules.

1.3

T

HESIS

O

RGANIZATION

Chapter 2 introduces background knowledge of thin-film transistor liquid crystal

displays, liquid crystal display structure in TFT-LCD, panel, driving method of TFT-LCD and

periphery circuit block. The nonlinear relationship between luminance, human visual system

(HVS), and gamma correction method will be discussed in this chapter.

In chapter 3, an analog output buffer fabricated in 3-m LTPS process is proposed. The device character variation of LPTS process has been discussed in this chapter. The design of

analog output buffer had considered with the device variation.

In chapter 4, we will talk about digital-to-analog converter (DAC) circuit and proposed

analog output buffers with level shifting function. Simulation results and measured results

about analog output buffers with level shifting function are shown in this chapter.

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Fig. 1.1 System integration roadmap of LTPS TFT-LCD [1].

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Fig. 1.3 Basic concept of pixel memory technology [1].

Fig. 1.4 The roadmap of LTPS technologies leading toward the realization of sheet computers [3].

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Fig. 1.5 (a) Comparison of an amorphous silicon TFT-LCD module and (b) a low-temperature polycrystalline silicon TFT-LCD module.

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Chapter 2

Background Knowledge of Thin-Film Transistor

Liquid Crystal Displays

2.1

L

IQUID

C

RYSTAL

D

ISPLAY

S

TRUCTURE

2.1.1 Material and Display Theory of Liquid Crystal [4], [5]

Liquid crystal is a phase of matter whose order is intermediate between that of a liquid

and that of a crystal. Fig. 2.1 shows the phase variation of liquid crystal in different

temperature. Most liquid crystals consist of molecules shaped like the rod. Rod-shaped

molecules are referred to as calamitic. Calamitic (Bahaur, 1990; Demus et al., 1998a,b) liquid

crystal has many applications. One characteristic of the phase variation of liquid crystal

materials is ―the twice melting‖ showing in Fig. 2.1. Below the melting point (Tm) they are solid, crystalline and anisotropic, when above the clearing point (Tc) they are clear and

isotropic liquid. The material has the appearance of a milky liquid between Tc and Tm but still

exhibit the ordered phases.

The phases during Tc and Tm can roughly be divided into smectic phase and nematic

phase by its molecules arrangement. The molecules are ordered in two dimensions in smectic

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nematic phase is the basis and widely used as Twisted Nematic (TN) cell with active matrix

addressing. Because the twist of liquid crystals can be controlled by the electric field that is

applied across it, liquid crystals are used as a switch that passes or blocks the light.

The polarizer can block or pass the specific light by changing the phase of the polarizer.

In general, the first polarizer of a couple of polarizers is called polarizer and the second

polarizer of these is called analyzer. The light can be blocked by a couple of polarizers with

90° phase shift, is shown in Fig. 2.2 (a). If we twist the liquid crystal molecule by applying

the specific electric field across it, the light still can pass the polarizer. This is because the

direction of liquid crystal molecules varies with electric field and it can guide the light along

the long axis, shown in Fig. 2.2 (b).

Fig. 2.3 (a) shows a pixel of a transmissive twisted nematic LC-cell with no voltage

applied. The white backlight f passes the polarizer. The light leaves it linearly polarized in the

direction of the lines in the polarizer, and passes the glass substrate, the transparent electrode

out of Indium-Tin-Oxide (ITO) and the transparent orientation layer. In this case, the analyzer

is crossed with polarizer. The light can pass the analyzer without applied voltage due to the

twisted nematic LC-cell and the pixel appears white. If a voltage VLC of the order of 10 V is

applied across the cell, as shown in Fig. 2.3 (b), all molecules aligned parallel to the electric

field. In this state, the wave that reaches the crossed analyzer is polarized in the same

direction as at the input. Therefore, the analyzer blocks the light and the pixel appears black.

This operation is termed the normally white (NW) mode. On the contrary, if the analyzer is

rotated by 90°, paralleled with polarizer, the light is blocked in the analyzer. The pixel is black.

This is called the normally black (NB) mode. The transmitted luminance, also termed

transmittance, of the light. Fig. 2.4 shows the transmitted luminance versus the normalized

voltage (VLC/V0) across the LC cell for the normally white mode and the normally black

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2.1.2 Liquid Crystal Display Module Structure

The cross section structure of TFT-LCD panel is shown in Fig. 2.5 particularly. It can be

roughly divided into two part, TFT array substrate and color filter substrate, by liquid crystal

filled in the center of LCD panel. We still need a backlight module including an illuminator

and a light guilder since liquid crystal molecule cannot light by itself. However it usually

consumes the most power of the system, some applications such as mobile communications

try to exclude or replace it from the system. In TFT array substrate, we need a polarizer, a

glass substrate, a transparent electrode and an orientation layer. In color filter substrate, we

also need an orientation layer, a transparent electrode, color filters, a glass substrate and a

polarizer. Most transparent electrodes are made by ITO, and they can control the directions of

liquid crystal molecules in each pixel by voltage supplied from TFT on the glass substrate.

Color filters contain three original colors, red, green, and blue (RGB). As the degree of light,

named ―gray level‖, can be well controlled in each pixel covered by color filer, we will get more than million kinds of colors.

2.1.3 Equivalent Model of Dot in each Pixel Cell

One dot is the most fundamental unit of LCD panel and each dot can express one kind of

original color. Because one full color should be mixed with three original colors, each pixel

composed of three dots. Fig. 2.6 shows the basic layout and cross section of the AMLCD

sub-pixel. The equivalent circuit of a TFT sub-pixel with voltages, currents, and parasitic

capacitances is shown as Fig. 2.7 [4].

Fig. 2.8 and Fig. 2.9 show the layout and equivalent circuit of each sub-pixel, including

two major structures, the CS on common mode and CS on gate mode. The right-down region

of the sub-pixel layout is the TFT switch, and the region of each sub-pixel area excluding TFT

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light passing. So the larger ratio of aperture region to pixel area is the better performance of

the TFT-LCD panel. In Fig. 2.9, the MS is a thin film transistor as a switch. The Clc is the

effective capacitor of liquid crystals, and CS is the storage capacitor used to maintain the

voltage level of liquid crystals during the hold time of frame transitions. The Cgd is the

parasitic capacitor between gate line and effective liquid crystal capacitor. The structure, CS

on gate, which connects the bottom of the storage capacitor to the previous row of the gate

line has some benefits. By this structure, we can compensate the unstableness of voltage level

due to the clock feed-through effect from Cgd. Furthermore, this structure also has larger

aperture ratio. But the trade-off with the CS on gate method is an increase in the RC time

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2.2

DRIVING

METHOD

IN

TFT-LCD

PANEL

2.2.1 Driving Method

Liquid crystal molecules can‘t be under a fixed voltage in the long period. The DC blocking effect and the DC residue (stick image) will be appeared under this condition.

Therefore, the electric field polarity should be inversed every period to avoid the destruction

of liquid crystals. The torque caused by electric filed is dependent on the magnitude of

electric filed, not dependent on the polarity of electric filed. Therefore, the polarity of electric

filed would not affect the twisting of the liquid crystal molecules. When the frame picture will

be kept on the same gray level, the electric field across liquid crystals is changed into two

polarities (positive and negative), alternately. As electric field is higher than common mode

voltage the polarity is called positive polarity, otherwise it is called negative polarity. By this

way, the liquid crystal molecules will avoid defection in the fixed applied voltage. In term of

above description, the polarity inversions of LCD panel can be principally divided into four

general types: frame inversion, row inversion, column inversion, and dot inversion [6]. They

are listed in Fig. 2.10. Frame inversion is that all the adjacent pixels of the LCD panel have

the same polarity. Row inversion (column inversion) is that each adjacent row pixels (adjacent

column pixels) have different polarity. Finally, all the adjacent pixels of LCD panel have

different polarity is called dot inversion. Dot inversion is the major driving method of LCD

panel. This polarity inversion method has some benefits. By this method, we can achieve

higher quality image due to the reduction in both horizontal and vertical cross-talk. The

flicker of image also can be reduced due to the spatial averaging of pixels. But the penalty of

dot inversion method is an increase of the power consumption due to the line inversion

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Based on the operational type of common mode voltage, the driving method can also be

classified into direct driving and AC modulation driving. Fig. 2.11 and Fig. 2.12 show these

two driving methods. Direct driving method would keep its common voltage on a constant

level. However, the common mode voltage of AC modulation driving method is not a constant

level, is a period voltage. The characteristics of two driving methods are listed below:

 Direct driving method:

– Frame, row, column, and dot inversion are all available. – Crosstalk and flicker can be eliminated.

 AC modulation driving method:

– Frame and row inversion are available. – Low power dissipation in data driver.

2.2.2 Gamma Correction

Gamma correction of liquid crystal displays is involved due to the nonlinearity between

luminance and human visual system (HVS). This is because the pupils of the human‘s eyes would vary automatically for the change of the ambient light. For this reason, a data driver

with gamma correction is necessary in TFT-LCD panel. The data driver often is required to

compensate for the human visual system‘s transfer function. Moreover, it must also compensate for the LCD transfer function [6]. Fig. 2.13 shows the operation of the gamma

correction for the normally white TN type LCD panel. The gamma correction system is

composed of three relationships: luminance vs. HVS brightness, input digital code vs. pixel

voltage, and the V-T curve of the NW-TN type liquid crystal. By this system, the relationship

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2.3 P

ERIPHERY

C

IRCUIT

B

LOCK

The periphery circuit blocks of LCD panel are roughly composed of four parts — display

panel, timing control circuit, scan driver circuit and data driver circuit [10]. In Fig. 2.15 is the

block diagram of the entire TFT-LCD panel circuits. Display panel is constructed of the active

matrix liquid crystals. The operation of the active matrixes is similar to DRAM (dynamic

random access memory) which is used to charge and discharge the capacitor of the pixel.

Timing controller is responsible for transiting RGB (red, green, and blue) signals to the data

driver and controlling the behavior of scan driver. As soon as one voltage level of the scan

lines rises, the RGB signals will be transited through the data driver. After a period, the

voltage level of this scan line will be disabled and next scan line will be turned on. All voltage

levels of those scan lines will be raised in turn. Addressing system, in Fig. 2.16, is composed

of scan driver and data driver [4]. These two driver circuits will be further discussed in the

following sections.

2.3.1 Scan Driver Circuit

Scan driver, shown in Fig. 2.17, consists of shifter register, level shifter, and digital

output buffer. Shifter register is used to store digital input signals and transit them to the next

stage according to timing clock. Because the turn-on voltage of active matrixes is higher, scan

driver should drive the active pixels with a high voltage. The purpose of the level shifter is

just to convert the digital signals to a higher level voltage. Finally, since the scan lines can be

modeled as RC (resister and capacitor) ladder, the digital output buffer should be used in the

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2.3.2 Data Driver Circuit

Data driver, shown in Fig. 2.18, mainly contains shifter register, data latch, level shifter,

digital-to-analog converter (DAC) and analog output buffer [7]. Furthermore, the first three

parts classify as digital architectures. The other two parts belong to analog architectures.

Shifter register and data latch manage to transit and store the RGB signals. Also, the purpose

of level shifter is the same as the one in scan driver. It is applied to translate the RGB signal to

a higher level voltage. As implied by the name, digital-to-analog converter is used to convert

the digital RGB signal to analog gray level. Its structures can be divided into many types, and

there will be much more detailed discussion in the next chapter. As for analog output buffer,

its purpose is applied to drive active pixels into a desired gray level. However, The LCD panel

usually has large loading, especially in larger panel display or higher resolution display. For

this reason, the analog output buffer should enhance the driving capability of the data driver.

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Fig. 2.1 Phase of liquid crystal materials versus temperature.

Fig. 2.2 (a) A couple of polarizers with 90∘phase shift. (b) A couple of polarizers with liquid crystal.

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Fig. 2.3 The structure of a TN-LCD (a) while light is passing, and (b) while light is blocked.

Fig. 2.4 The transmitted luminance versus the normalized voltage (VLC/V0) across the LC cell

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Fig. 2.5 The cross section structure of TFT-LCD panel.

Fig. 2.6 The basic layout and cross section of an AMLCD sub-pixel.

Fig. 2.7 The equivalent circuit of a TFT in the sub-pixel with voltages, currents, and parasitic capacitances.

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(a) (b)

Fig. 2.8 The layout view of a TFT-LCD sub-pixel: (a) CS on common mode and (b) CS on gate mode.

Fig. 2.9 The equivalent circuit of a TFT-LCD sub-pixel: (a) CS on common mode and (b) CS on gate mode.

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Fig. 2.11 The operation waveform of direct driving method.

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Fig. 2.14 The input digital code vs. pixel voltage curve of data driver in TFT-LCD panel.

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Fig. 2.16 The entire addressing system in detail.

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Chapter 3

An On-Panel Analog Output Buffer for Data Driver

3.1

I

NTRODUCTION

We know that the LTPS TFTs have been widely investigated as a material for portable

systems, like mobile phone, personal digital assistants (PDAs), digital camera, and so on. The

electron mobility of LTPS TFTs is about 100 times larger than the electron mobility of

conventional amorphous silicon TFTs, so LTPS can integrate driving circuit on panel and

smaller pixel transistor. Display of LTPS TFTs technique can achieve slim, compact, and

high-resolution. The system on panel (SOP) will be realized if the electron mobility of poly-Si

continuity increased in the future. The CPU, memory, and display will be integrated in one

panel by SOP technology [8], [9].

Now, the LTPS TFTs technology is toward integrating the driving circuits on the glass

substrate [10], [11]. In general, the driving circuits of display contain gate driver, data driver,

and DC-DC converter. The data driver contains shift register, latch, level shifter,

digital-to-analog converter (DAC), and analog output buffer. DAC and analog output buffer

are the region of analog circuit. Analog output buffer is proposed in this chapter. The output

buffer design is critical to achieve low power dissipation, high resolution, and large output

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3.2

D

EVICE

C

HARACTERISTIC

V

ARIATION

I

N

L

TPS

T

ECHNOLOGY

Although the electron mobility of LTPS TFTs is larger than that of conventional a-Si

TFTs, LTPS TFTs technology confront by the variation of device characteristic. The LTPS

process can enlarge poly-grain size to improve the device performance, but the electron

mobility across the grain boundary is various and gate-insulator interface defect. The LTPS

devices have a random device-to-device variation on LCD panel. Fig. 3.1 shows the variation

on threshold voltage (VTH) of 120 LTPS n-type TFTs in different locations on the LCD panel

[12]. The distribution of VTH is from 0.75 V to 2.15 V [12]. Fig. 3.2 shows the device

characteristic variation of LTPS p-type TFTs in different gate bias voltage [13]. Based on

these figures, we know that the variation of LTPS technology is larger than the variation of

CMOS technology. In real products, LTPS technology is limited in small size panel. Because

the LTPS TFTs technology has poor uniformity and large variation on the device

characteristics due to the narrow laser process window for producing the large-grained

poly-Si thin film. The grain boundaries exist in the channel randomly. This causes the

non-uniformity brightness in the panels, current or voltage gain mismatching in analog

circuits and error reading in digital circuits [14]. Based on these reasons, the variation of

device characteristic becomes an important issue of the design for analog circuit in LTPS

TFTs technology [15]. In this work, an analog output buffer with consideration of device

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3.3 O

N

-P

ANEL

A

NALOG

O

UTPUT

B

UFFER

3.31 Source Follower Analog Output Buffer [16], [17]

Source follower output buffer is the most common pattern integrated on the glass

substrate for data driver. Source follower can be an output buffer because it has high input

impedance and low output impedance, but there are some drawbacks like low output swing

and higher input offset voltage. Fig. 3.3 shows the circuit of conventional source follower

output and its output waveforms at different input voltage. From this figure, we can find that

there is always an offset voltage between input voltage and output voltage. The value of offset

voltage is the threshold voltage of TFT. Besides, the threshold voltage is not a constant in

different panel location. The Monte Carlo simulation results of source follower output buffer

is shown in Fig. 3.4. Even though the source follower output buffer has a threshold voltage

offset, there are many ways of compensation technique to compensate the offset voltage. Like

Fig. 3.5 shows, it uses the switches, a capacitor and control signals to reduce the offset

voltage. Fig. 3.6 (a) shows the other technique, this circuit only used switching transistors to

eliminate the offset voltage. The simulation results and measurement results are shown as Fig.

3.6 (b).

3.3.2 Unity-Gain Output Buffer with an OPAMP [18]

Compared with source follower output buffer, unity-gain output buffer with OPAMP has

lower offset and better output swing range. The relation function between the input voltage

and output voltage of unity-gain buffer with OPAMP is

𝑉𝑜𝑢𝑡 = 𝐴

(40)

The unity-gain output buffer with OPAMP is shown as Fig. 3.7. In this work, the two-stage

OPAMP is adopted as a unity-gain buffer. Two-stage OPAMP has high open-loop gain, large

output swing, and medium bandwidth.

A class-A two-stage OPAMP with P-type TFTs input circuit schematic as Fig. 3.8 shows.

When the output node (Vout) is connected with the negative input node (Vin-), there is a

unity-gain buffer with OPAMP circuit. The class-A OPAMP with p-type TFTs input circuit is

composed of four parts. The first part is composed of a p-type differential pair (M1-M2),

current mirror load (M3-M4) and current source (M5). It is the input stage and it provides

gain to OPAMP. The second part is a common-source stage and active load (M6-M7) which is

the output stage. The third part is constant-Gm bias stage (M11-M16 and RB) which can

provide the bias voltage for this circuit. Constant-Gm bias circuit produces a

supply-independent current for the first and second parts. The fourth part is a start-up circuit

(M21-M24) which turns on the bias circuit in the beginning and turn off automatically after

bias circuit works. In this circuit, the Miller compensation capacitor and null resistor (Cc and

M10) are adopted as frequency compensation, which provide a pole and a zero.

Based on Table 3.1 [13], the variation of p-type TFTs in LTPS process is smaller than the

variation of n-type TFTs in LTPS process. The differential pair is the most important part in

the OPAMP circuit. The variation of input stage device has large influence on the performance

of OPAMP. That is the reason for using p-type TFTs input in OPAMP circuit. Fig. 3.9 shows

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3.4 E

XPERIMENTAL

R

ESULTS

The class-A output buffers with p-type input stage has been designed and fabricated in

3-m LTPS process. Fig. 3.10 shows the photograph of a class-A output buffer with p-type TFTs input stage. The measurement setup is as Fig. 3.11shown. Tektronix TDS 3054 is an

oscilloscope using to detect and display the signal waveforms. HP 8116 Pulse/Function

Generator is function generator which can provide input signals, like square wave form or

sine waveform. The programmable power supply (GW PPT-1630 GPIB) can provide three

independent voltage sources.

The measurement procedure of unity-gain frequency is shown as Fig. 3.12. When the

input frequency rises up, the output waveform will suffer a gain pick. After the gain pick, the

output waveform will be smaller as frequency rise up. Fig.3.13 shows the unity-gain

bandwidth measurement results. The numbers in the figure bars are the number of samples.

Fig. 3.14 shows the measurement of large signal input. The large signal means the rail-to-rail

square wave. Fig. 3.15 shows the output waveform of large signal input. The measurement

results of large signal input are shown in Fig. 3.16. The offset voltages of the unity-gain buffer

had been measured as Fig. 3.17. We give the input a DC voltage and measurement the output

voltage by meter. The measurement of offset voltage is shown in Fig. 3.18, Fig. 3.19 and Fig.

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3.5 D

ISCUSSION

The accuracy of the data driver is determined by DAC circuit combined with analog

output buffer. Even though the DAC has high accuracy, the data driver also does not have

enough accuracy with a low accuracy analog output buffer. For this reason, the input offset

voltage of the analog output buffer will become a serious issue in data drivers. Fig. 3.21

shows a valid input offset compensation method and the measurement results of this analog

output buffer with the offset compensation technique [12]. During the period I, the offset

voltage is stored in CH. In the period II, the detected offset voltage in CH is added into the

inverting input node. From Fig. 3.21 (b), we can find that the offset voltage of this analog

output buffer can be compensated under the second period by using this offset compensation

technique.

3.6 S

UMMARY

In this chapter, a class-A output buffer with pTFT-pair as input stage to suppress device

variation in LTPS technology has been proposed and fabricated in a 3-μm LTPS technology.

The output buffer with P-TFTs input stage can be operated at 100-kHz operation frequency

with about 0.8-to-9 V output swing under AVDD of 10 V and GND of 0 V. The offset voltages

are less than 150 mV in three different input voltage conditions. The device characteristic

variation has been successfully suppressed by replacing the critical part of analog circuits by

the P-TFTs. The proposed output buffer with P-TFTs input stage can be used in the on-panel

data drivers to provide a uniform brightness and high resolution display. Furthermore, this

proposed analog output buffer is also suitable for ambient light sensor system to boost the

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Table 3.1 The mobility variation for n-type and p-type TFTs at different stress conditions [13]

Average Variation (%) Std. Dev Hot-Carrier Stress Condition N-Type -38.627 6.65 P- Type +7.054 2.72 On-Current Stress Condition N- Type +11.828 3.28 P- Type +2.251 0.6525

Table 3.2 Summary of the simulated circuit performances of the output buffer in Fig. 3.8

Open Loop Characterization Gain 55.09 dB Phase Margin 114˚ Unity-gain Bandwidth 1.83 MHz CMRR 58.3 dB Close Loop Characterization PSRR AVDD 57.3 dB PSRR GND 50 dB Output Swing @50kHz 0.81~9.72 V Slew Rate L to H 1.29 V/s Slew Rate H to L 2.22 V/s

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Table 3.3 The total measurement results of the unity-gain output buffer Sample Number Output Swing Range (V) @100k Hz Maximum Operation Frequency under Sinusoidal Wave Input

(Hz) Maximum Operation Frequency under Rail-to-Rail Square Wave Input (Hz) Offset Voltage (mV) Simulation 0.7~9.6 1.82M 70K - 01 0.4-9.6 2.1M 190k 50~110 02 0.28-9.4 1.9M 210k 1100~1260 03 0.44-9.5 3M 200k 30~90 04 0.2-9.1 2.7M 210k 110~190 05 0.4-9 2.4M 240k 40~90 06 0.2-8.8 2.2M 180k 10~50 07 0.2-8.8 2.3M 230k 20~90 08 0-9.6 2M 210k 10~70 09 0-10 2.3M 300k 0~90 10 0-8.6 1.2M 150k 10~90 11 0-8.6 900k 100k 1300~1460

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Fig. 3.1 The Variation on threshold voltage (VTH) of 120 LTPS n-type TFTs in different location

on the LCD panel [12].

Fig. 3.2 The device characteristic variation of LTPS p-type TFTs in different gate bias voltage [13].

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Fig. 3.3 (a) The conventional source follower output buffer and (b) its output waveforms at different input voltage.

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Fig. 3.5 The source follower output buffer with a compensation capacitor.

Fig. 3.6 The source follower output buffer compensation by device matching (a) the circuit schematic and control signal (b) the simulated and measurement results [17].

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Fig. 3.7 The unity-gain output buffer with OPAMP.

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Fig. 3.9 The simulation results of analog output buffer with p-channel input.

Fig. 3.10 The die photo of analog output buffer with p-type TFTs input stage in a 3-m LTPS process.

V

i

V

o

AVDD

GND

C

C

M6

M1

M2

M7

R

B

AVDD = 10 V

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Fig. 3.11 The measurement setup of frequency response.

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Fig. 3.13 The unity-gain bandwidth measurement results of unity-gain buffer with OPAMP.

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Fig. 3.15 The output waveform of large signal measurement at 100k Hz input signal (a) the pulse width of output waveform is larger than 1/4 period. (b) the pulse width of output waveform is smaller than 1/4 period.

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Fig. 3.17 The offset voltage measurement setup of unity-gain buffer.

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Fig. 3.19 The measurement of offset voltage when vi is 5V.

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Fig. 3.21 (a) Circuit and signal-timing diagram of the analog output buffer with the offset compensation technique. (b) The measurement result of this analog output buffer with the offset compensation technique under 50-kHz square wave with a swing of 2-to-8 V [21].

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Chapter 4

The Analog Output Buffers with Level Shifting

Function for DAC

4.1

INTRODUCTION

Based on Chapter 2, we know that the data driver of LCD is composed of shift register,

latch, level-shifter, DAC, analog output buffer. In small size application, some requirements

are claimed to drive different voltage level LCD panels without changing the DAC. It is the

feature of analog output buffers with level shifting function. In this chapter, we will describe

the DAC circuit, and analog output buffers with level shifting function. An OPAMP had been

proposed in chapter 3. OPAMP is an important part of analog output buffers with level

shifting function.

4.2

D

IGITAL

-T

O

-A

NALOG

C

ONVERTERS

[19]-[23]

Digital-to-analog converter (DAC) circuit is a basic part of LCD data driver which

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analog gray level voltage of DAC circuit and charges the loading capacitor to the same

voltage which it senses. There are some common kinds of DAC circuits as follow:

4.2.1 R-String DAC with Switch Array Decoding

Fig 4.1 shows the 6-bit R-string DAC with switching array decoding circuit. This circuit

is widely used in most of LCD data driver, because this architecture requires no digital

decoder and suitable for gamma correction design. This circuit can be easy layout in the sides

of panel. However, the area of switches becomes larger and larger due to the high resolution

DAC. The output node (Vout) loading becomes larger due to the huge switch array.

4.2.2 R-String DAC with Binary Tree

Fig. 4.2 shows a 3-bit R-string DAC with binary-tree decoding. The R-string DAC with

binary-tree decoding has less transistors compare with R-string DAC with switch array

decoding. But in the high resolution, this architecture becomes larger and larger in the

decoding circuit. The loading of output node (Vo) also becomes larger because of the

binary-tree decoder.

4.2.3 R-String DAC with Digital Decoding

The R-string DAC with digital decoding is shown as Fig. 4.3. Compare with last two

architectures, the digital decoder can reduce the loading of output node (Vo). The area of

digital decoder still becomes larger and larger in high resolution DAC. And the decoder also

becomes more complex in high resolution DAC. This architecture of DAC circuit is usually

used in high speed applications.

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replace the input capacitor of a switched-capacitor (SC) gain amplifier by programmable

capacitor array (PCA) of binary-weighted capacitors. In this circuit, it has two phases. In first

phase (φ1), all capacitor bottom plates are connected to a reference voltage and top plates are connected to ground. During second phase (φ2), capacitor bottom plates are connected to a

reference voltage or ground according to logic high or logic low in codes. By this operation,

the voltage level in output terminal can be determined by a formula which is shown in follow:

𝑉𝑜 = 𝑉𝑟𝑒𝑓 × 𝐶 2𝑁𝐶 + 𝐶 𝑝 × 𝑏𝑖2 𝑖 𝑁−1 𝑖=0 (2) Where bi is the bit number in input code, N is the total bit number and Cp is top plate parasitic

capacitance. This circuit structure has some advantages better than the resistor-string DAC.

First, the process matching for capacitor is better than resistor string. Second,

charge-redistribution DAC can save more power because it has no DC path in the circuit.

However, it has a big problem in LCD panel application. That is, this method is very difficult

to achieve gamma correction. In other word it cannot compensate the inherent characteristic

of liquid crystal.

4.2.5 Resistor-Capacitor Hybrid DAC

The benefits and drawbacks of resistor-string DAC and charge-redistribution DAC have

been discussed previously. In order to get their benefits and exclude the drawbacks in the

DAC, a hybrid structure has been proposed in Fig. 4.5. In this circuit, the upper bits are

adopted in resistor-string architecture and the lower bits are employed the

charge-redistribution structure. There are two phases in this circuit operation. In first phase

(φ1), all capacitor bottom plates are connected to ground. During second phase (φ2), capacitor bottom plates are connected to a reference voltage V1 or connected to the other reference

voltage V2 which is according to logic high or logic low in input codes. Furthermore, a

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𝑉𝑜 = 𝑉𝑟𝑒𝑓 2𝑀 × 𝑏𝑖+𝐿2𝑖 𝑀−1 𝑖=0 × 1 2𝑀 × 𝑉𝑟𝑒𝑓 2𝐿 × 𝑏𝑗2𝑗 = 𝑉𝑟𝑒𝑓 2𝑁 × 𝑏𝑖2𝑖 (3) 𝑁−1 𝑖=0 𝐿−1 𝑗 =0

Where M is the total bit number in resistor-string DAC, L is the total bit number in

charge-redistribution DAC and N is the total bit number in this DAC (N = M + L).

This hybrid structure can achieve high performance in operational speed, die area, and

power consumption. Besides, it is also suitable in gamma correction DAC.

4.2.6 Current-Steering DAC

Current-steering DAC is very similar to resistor-based converter, but is intended for

higher-speed application due to the current type. The basic idea is to switch currents to either

the output or to ground, as shown in Fig. 3.8. Here, the total output current is sum of the

currents which are selected, as shown below:

𝐼𝑜 = 𝐼 × 𝑏𝑁−1 × 2𝑁−1+ 𝑏

𝑁−2× 2𝑁−2+ ⋯ + 𝑏1× 21 + 𝑏0× 20 (4)

This output current is converted to a voltage through a resistor (RF). Although, this circuit has

potentially large glitches due to timing skews and the monotonicity in this DAC is not

guaranteed. But, we can reduce the glitches and provide the guaranteed monotonicity by using

the thermometer decoding method.

From previous description and analysis, we can summarize a table about many kinds of

the DAC circuits, as shown in Table 4.1. In this table, we can clearly find the characteristics

of those DAC, like: suitable for gamma correction design, operation speed, power

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4.3 A

NALOG

O

UTPUT

B

UFFERwith

L

EVEL

S

HIFTING

F

UNCTION

In general, a DAC circuit is only suitable to drive one kind of panel. Therefore, we have

an idea that one DAC circuit to drive multi panels. As shows in Fig. 4.7, there are two gamma

curves. We had a DAC for 3V panel and fit its gamma curve. Now we need a circuit to level

shift the voltage to fit the gamma curve of 5V panel. Sharp had published a circuit which has

such ability. As Fig. 4.8 shows, Sharp called this circuit ―level change circuit‖ [24].

4.3.1 Analog output buffer with level shifting function type I

The basic idea here is a noninverting amplifier as Fig. 4.9 [22]. Even if the gain of the

OPAMP is large in Fig. 4.9, the function of this noninvertin amplifier is shown in below:

Vout = Vin 1 +R1

R2 (5) When the R2 of this noninverting amplifier is a vary-resistor, the circuit will be like Fig.4.10.

Table 4.2 shows the resistance of R2 in different Gray Level. But the variable resistor can‘t be

fabricated in the integrated circuit. The R-string with switching array has the same capability.

As shown in Fig. 4.11, we use the R-string and switching array to achieve variable resistor in

the total circuit. The DAC for 3V panel is composed of RS00~RS64, MS01~MS64 and

decoder1. The R201~237 and MR01~MR37 achieve the variable resistor R2. The structure of

OPAMP is a differential input single output operator amplifier that we had proposed in

chapter 3. The circuit of OPAMP is show as Fig. 3.8. But the power supply of the OPAMP

becomes 0-to-6V. The decoder1 of this circuit is a digital decoder as shown in Fig. 4.12. The

output Do101~Do164 are the delegate of the 64 gray levels. When the input signal (Din) is a

6-bit signal, one of the outputs (Do101~Do164) will be in logic ―1‖. The decoder2 is also a

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Do201~Do237. As Fig. 4.13 shows, the principle of decoder2 is using the input signal

(Do101~Do164) which represent the Gray level to choose the R2 value.

The operation method is shown as Fig. 4.14. When the digital input signal (Din) is

―000100‖. The output Do105 of decoder1 will be in logic ―1‖, and MS105 will turn on. The voltage value of Vin+ and Vin- will be as V4. In decoder2, the Do205 will be in logic ―1‖.

MR205 will turn on. The output voltage is shown in below:

𝑉𝑜𝑢𝑡 = 𝑉4 × 1 + 𝑅1

𝑅201 + 𝑅202 + 𝑅203 + 𝑅204 + 𝑅205 (6) The resistance value of output buffer with level shifter is shown in Table 4.3. The simulation

results are shown in Fig. 4.15.

4.3.2 Analog output buffer with level shifting function type II

Moreover, we have another idea to level shift the 3V gamma curve to 5V gamma curve.

The basic idea is also a noninverting amplifier, but the R2 is a constant resistance as Fig. 4.16

shown. The Va is an amendment voltage. The function of this circuit is shown in below:

𝑉𝑜𝑢𝑡 = 𝑉𝑖𝑛 × 1 +𝑅1

𝑅2 − 𝑉𝑎 𝑅1

𝑅2 (7) The value of amendment voltage Va is shown as Fig. 4.17 when the resistance of R1is equal

to the resistance of R2. We achieve the Va by R-string and decoder2. The total circuit

schematic is shown as Fig. 4.18. The DAC for 3V panel is composed of RS00~RS64,

MS01~MS64 and decoder1. The RA01~RA30, MA01~MA29 and decoder2 achieve the

amendment voltage Va. The resistance of RA01~RA30 are list in Table 4.4. Fig.4.19 shows

the decoder2 circuit schematic of analog output buffer with level shifting function type II. The

decoder1 of output buffer with level shifting function type II is the same as the decoder1 of

output buffer with level shifting function type I. The operation method is like the output

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4.4 E

XPERIMENTAL

R

ESULTS

Fig. 4.22 shows the photograph of the output buffer with level shifting function type I.

The measurement setup is shown as Fig. 4.24. The photograph of analog output buffer with

level shifting function type II is as Fig. 4.23 shown. Fig 4.25 shows the measurement setup of

analog output buffer with level shifting function II. The programmable power supply (GW

PPT-1630 GPIB) can provide three independent voltage sources. The voltage value of node

with FPC PAD (Vout, Vin+, and Vin-) can be measured by the multimeter ( HP 34401A

MULTIMETER). The digital signal input (Din) achieve by bread board and manual

switching.

The measured results of analog output buffer with level shifting function type I are

shown in Fig. 4.26. The measured results of analog output buffer with level shifting function

type II are shown as Fig. 4.27

4.5 D

ISCUSSION

The differences in voltage value between the measured results of analog output buffer

with level shifting function type I and idea value are from 10 to 300 mV. But the differences

in voltage value between the measured results of analog output buffer with level shifting

function type II and idea value are from 10 to 70 mV. Compare with the measured results of

analog output buffer with level shifting function type II, the measured results of analog output

buffer with level shifting function type I are worse. The reason is that the layout of R-String

of analog output buffer with level shifting function type II has been modified after measuring

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4.6 S

UMMARY

According to the measured results of the two analog output buffers with level shifting

function, the function of them are correct. Two kinds of analog output buffer with level

shifting function have been proposed and fabricated in a 3-m LTPS process. They also contain the DAC circuit with gamma correction in the circuit. Therefore, these two analog

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Table 4.1 The comparisons of six kinds of the digital-to-analog converter circuits

Type Correction Speed Power Area Complexity

R-String DACs with Switch Array Decoding

Best Poor Normal Poor Easy

R-String DACs with Binary Tree

Best Normal Normal Normal Easy

R-String DACs with Digital Decoding

Best Good Normal Normal Medium

Charge-Redistribution DAC Poor Good Best Normal Medium

Resistor-Capacitor Hybrid DAC

Good Good Good Good Hard

Current-Steering DAC Poor Best Poor Normal Hard

Table 4.2 The resistance of R2 in 0~63 Gray Level

Gray Level Resistance (k) Gray Level Resistance (k) Gray Level Resistance (k) Gray Level Resistance (k) 0 90 16 456 32 613 48 635 1 106 17 472 33 620 49 635 2 145 18 483 34 620 50 620 3 183 19 496 35 635 51 620 4 211 20 508 36 635 52 620 5 241 21 519 37 635 53 613 6 268 22 531 38 640 54 606 7 294 23 541 39 640 55 596 8 317 24 550 40 640 56 596 9 337 25 560 41 645 57 587 10 359 26 570 42 645 58 570 11 376 27 579 43 645 59 560 12 398 28 587 44 645 60 550 13 411 29 596 45 640 61 541 14 427 30 598 46 640 62 531 15 442 31 606 47 635 63 483

數據

Fig. 1.2 A CPU with an instruction set of 1-4bity and 8-bit data bus on glass substrate [2]
Fig. 1.4 The roadmap of LTPS technologies leading toward the realization of sheet computers  [3]
Fig. 2.3 The structure of a TN-LCD (a) while light is passing, and (b) while light is blocked
Fig. 2.6 The basic layout and cross section of an AMLCD sub-pixel.
+7

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