壓電厚膜微致動器之製作 謝仁豪、鄭江河
E-mail: [email protected]
摘 要
本篇論文將低溫燒結壓電粉末進行漿料調配，以刮刀成型法製作壓電厚膜生胚。將壓電厚膜生胚貼附在矽晶片上，並共 燒900℃1 小時，製作致動器模組，藉由晶圓切割機切割陣列狀之壓電厚膜微致動器，以阻抗分析儀量測致動器之共振頻率
，計算出壓電厚膜之楊氏係數，並藉由雷射位移計量測位移量，反算壓電係數 值。 經由文獻可發現壓電厚膜在高溫燒結 時容易與矽晶片產生反應，而降低壓電特性。因此本文將燒結溫度降低使結構緻密，並且網版印刷障礙層，阻隔壓電厚膜 之鉛含量擴散至矽晶片，使得壓電特性提高。本文將障礙層、底部電極、壓電厚膜、上部電極沉積於基板上，其基板為氧 化鋯或矽晶片。
關鍵詞 : 壓電、低溫燒結、致動器、網版印刷、障礙層
目錄
第一章 諸論--P1 1.1 壓電材料簡介--P1 1.2 研究背景-壓電致動器技術--P4 1.3 研究動機--P5 1.4 文獻回顧--P6 1.5 本文架 構--P10 第二章 壓電理論--P11 2.1 壓電性質及材料--P11 2.2 壓電理論--P13 第三章 壓電厚膜之貼覆生胚製程--P18 3.1壓電厚 膜製程簡介--P18 3.2壓電粉末製作程序--P18 3.3壓電圓片生胚製作--P21 3.4電性量測--P23 3.5燒結溫度與時間對電性的影 響--P32 3.6壓電厚膜生胚製作--P33 3.6.1壓電生胚漿料調配--P33 3.6.2壓電生胚刮刀成型--P34 3.7壓電厚膜生胚貼附矽晶片之 製程--34 3.7.1沉積底部電極--P35 3.7.2貼附壓電厚膜生胚與熱壓--P36 3.7.3抽真空與熱水均壓--P37 3.7.4沉積上部電極--P39 3.7.5燒結與電性量測結果--P40 3.8 陣列狀壓電厚膜致動器製作--P41 3.9量測結果--P44 3.10壓電生胚於不同基板之電性量測 結果--P47 3.11本章討論--P51 第四章 壓電厚膜之網印製程--P52 4.1壓電厚膜製程簡介--P52 4.2壓電厚膜網版印刷於矽晶片之 製程--P52 4.2.1壓電厚膜配置--P52 4.2.2矽晶片切割及酸洗--P53 4.2.3網版印刷底部電極層--P54 4.2.4壓電厚膜網印--P55 4.3 本章討論--P57 第五章 絕緣油墨對壓電特性的影響--P58 5.1絕緣油墨對壓電特性的簡介--P58 5.2網版印刷絕緣油墨--P58 5.3 電性量測--P61 5.4網印絕緣油墨於矽晶片與壓電厚膜生胚結合共燒--P63 5.5本章討論--P65 第六章 結論--P66 6.1 結論--P66 第七章 未來努力方向--P68 7.1未來努力方向--P68 參考文獻--P69
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