行政院國家科學委員會專題研究計畫 成果報告
矽鍺(100)2X1 表面矽甲烷和鍺甲烷分解吸附之 DFT 計算 研究成果報告(精簡版)
計 畫 類 別 : 個別型
計 畫 編 號 : NSC 95-2221-E-011-157-
執 行 期 間 : 95 年 08 月 01 日至 96 年 07 月 31 日 執 行 單 位 : 國立臺灣科技大學化學工程系
計 畫 主 持 人 : 蔡大翔
計畫參與人員: 博士班研究生-兼任助理:鄭家樑
碩士班研究生-兼任助理:沈明逸、梁嘉文
處 理 方 式 : 本計畫可公開查詢
中 華 民 國 96 年 07 月 19 日
矽鍺(100)2×1 表面矽甲烷和鍺甲烷分解吸附之 DFT 計算
DFT calculation of silane and germane dissociative adsorption on SiGe(100)-2×1 計畫編號 NSC 95-2221-E011-157
執行期限: 95 年 08 月 01 日 至 96 年 07 月 31 日 主持人:蔡大翔 執行單位:台灣科技大學化工系
參與人員:蔡大翔、鄭家樑、碩士班研究生
一、中文摘要
我 們 使 用 密 度 泛 函 數 法 (density functional theory,DFT)用以計算分析 矽甲烷(SiH4)和鍺甲烷(GeH4)於矽鍺 (100)-2×1 表面上之分解吸附反應。由 於鍺加入於矽(100)-2×1 表面不僅影 響了二聚體(dimer)的傾斜與其表面 的反應性(surface reactivity),鍺的加 入於反應能量學上發現矽甲烷和鍺 甲 烷 與 四 種 不 同 dimer : Si*-Si 、 Ge*-Si、Ge*-Ge 和 Si*-Ge。於半氫覆 蓋表面,矽甲烷和鍺甲烷之吸附能障 (energy barrier)均相對於純淨(pristine) 表面來得高。且於相同 dimer 上矽甲 烷的能障是高於鍺甲烷,對於速率常 數(rate constant)之計算為使用過渡狀 態理論(transition-state theory)加以計 算,我們整理可得 SiGe 表面吸附反 應之反應性與其 dimer 上之鍺存在之 型式有關,若表面鍺之型式為 Ge*-Ge 時,表面之反應性隨著 Ge*-Ge 之含 量上昇而下降;若於低鍺含量下表面 之鍺是較傾向形成 Ge*-Si 之型式,則 開始時表面反應性先上昇,然後由於 Ge*-Ge 的形成後再下降。鍺甲烷吸附 反應之計算所得之速率常數於 Si*-Si 上對 Ge*-Ge 上於 650℃下為 2.1,此 值相當符合鍺甲烷於 Si(100)相對於 Si(100) 覆 蓋 一 層 鍺 之 吸 附 機 率 (adsorption probability)實驗比值,此 值為 1.7 是經由超音速分子束技術。
由於理論計算與實驗結果相當吻合 以支持於 Si(100)上之單層鍺存在有 Ge*-Ge 型式之 dimer。
二、英文摘要
SiH4 and GeH4 dissociative adsorptions on buckled SiGe(100)-2×1 surface have been analyzed using density functional theory (DFT) at the B3LYP level. The Ge alloying in Si(100)-2×1 surface affects the dimer buckling and its surface reactivity.
Systematic Ge influences on the reaction energetics are also found in SiH4 and GeH4 reactions with four dimers of Si*-Si, Ge*-Si, Ge*-Ge, and Si*-Ge (*
denotes the protruded atom). On the half H-covered surface, the energy barriers for silane and germane adsorption are higher than those on the pristine surface.
The energy barrier for silane adsorption is higher than the corresponding barrier for germane adsorption. Rate constants are also calculated using the transition-state theory. We conclude that the SiGe surface reactivity in adsorption reaction depends on the Ge presence in dimer form. If surface Ge is present in form of Ge*-Ge, the surface reactivity decreases as the Ge*-Ge content increases. If surface Ge prefers to be in
2
form of Ge*-Si at low Ge content, the surface reactivity increases first, then decreases at high Ge surface content when Ge*-Ge prevails. The calculated rate constant ratio of GeH4 adsorption on Si*-Si over Ge*-Ge at 650°C is 2.1, which agrees with the experimental ratio of GeH4 adsorption probability on Si(100) over Si(100) covered by one monolayer Ge. The experimental ratio is 1.7 measured through supersonic molecular beam techniques. This consistency between calculation and experimental results supports that one monolayer of Ge on Si(100) exists in form of Ge*-Ge dimer.
三、計畫緣由與目地
本研究為一理論計算之計劃,由 於晶片計算速率之提昇,促使近年來 計算化學快速進步,許多實驗上困難 之細節,可由理論計算提供較細部之 了解,而化學氣相沉積之模擬計算已 成風潮,引導研究走向分子和原子層 面之了解。由文獻報導可知使用鍺甲 烷作為前驅物用以沉積矽鍺薄膜時,
其膜成長速率較純矽來得快,有相當 多研究認為是由於鍺元素存在於表面 之故,使得成長過程中增強了表面氫 分子之脫附,進而提供了更多的懸鏈 鍵(dangling bond)使能夠沉積之位置增 多。由已發表文獻可知於矽鍺(100) 2×1 表面上矽甲烷與鍺甲烷之吸附分 解反應之反應機構的研究不是很多,
因此本計劃針對此議題使用密度泛函 數理論法以模擬矽甲烷與鍺甲烷之吸 附分解反應機構於矽鍺(100) 2×1 表面 上。
四、模擬方法
於圖一中所示為經最適化之矽鍺 (100)2×1 之叢集模型,用以模擬矽甲 烷與鍺甲烷之吸附分解反應之反應機 構,此八種不同表面矽鍺排列方式代 表 不 同 之 dimer 對 經 重 構 (reconstruction)之矽鍺(100)2×1 表面模 型。
所有計算均以 DFT 方法、B3LYP 修 正函數和基底函數 (basis set)為使用 6-311+G*所完成。分子結構之最適化 過 程 均 無 任 何 之 幾 何 束 制 。 零 點 能 (zero-point energy)亦計算於相同之方 法。過渡狀態結構為由延著擬反應座 標(pseudoreaction coordinate)和一級鞍 點(first-order saddle point)過程求得。所 有計算結果均為使用 Gaussian 03 商 用套裝軟體所完成。
五、結果與討論
當 我 們 以 6-31G* 、 6-31G**
和 6-31+G*為 basis set 作 計 算 , 根 據 所 得 之 總 能 量 結 果 指 出 是 Si*-GeSi1 3H1 8 模 型 比 Ge*-SiSi1 3H1 8 來 得 低 , 亦 即 Si*-GeSi1 3H1 8 模 型 比 Ge*-SiSi1 3H1 8 穩 定 , 可 是 和 文 獻 上 , 不 論 是 理 論 或 實 驗 研 究 之 結 果 不 合 , 於 是 使 用 triple-zeta basis set 作 計 算 , 發 現 使 用 6-311G* 、 6-311+G* 和 6-311++G**時 , 由 零 點 能 量 結 果 指 出 是 Si*-GeSi1 3H1 8 比 Ge*-SiSi1 3H1 8 來 得 高 , 亦 即 Ge*-SiSi1 3H1 8 比 Si*-GeSi1 3H1 8 來 得 穩 定 , 其 零 點 能 量 差 之 計 算 結 果 列 於 表 一 中 。
表 二 所 列 為 Si*-SiSi1 3H1 8 、 Ge*-SiSi1 3H1 8和 Ge*-GeSi1 3H1 8分 別 代 表 Si*-Si、Ge*-Si 和 Ge*-Ge dimer 的 叢 集 模 型 計 算 所 得 之 dimer 鍵 長 R 和 dimer 傾 斜 角 θ 與 文 獻 中 理 論 計 算 結 果 , dimer 鍵 長 R 為 dimer 兩 原 子 之 距 離 , 傾 斜 角 θ 為 dimer 和 表 面 平 面 之 夾 角 , 由 6-311G*、 6-311+G*和 6-311++G** 之 計 算 結 果 與 文 獻 上 實 驗 結 果 和 其 它 理 論 計 算 結 果 較 吻 合 , 也 比 以 較 低 basis set(6-31G 系 列 ) 計 算 結 果 來 得 準 確 , 由 此 計 算 結 果 可 以 看 出 當 使 用 6-31G 系 列 之 basis set 的 結 果 , 不 論 是 加 入 極 化 或 擴 散 函 數 是 不 足 以 提 供 較 佳 之 計 算 結 果 , 且 考 慮 計 算 資 源 和 時 間 之 故 , 於 其 後 之 計 算 工 作 上 選 擇 用 6-311+G* 基 底 函 數 且 方 法 為 B3LYP 為 主 。
於 表 三 中 所 列 為 研 究 所 使 用 所 有 叢 集 模 型 之 dimer 鍵 長 、 傾 斜 角 和 電 荷 量 (charge) 之 計 算 結 果 。 對 Si1 5 - xGexH1 8 (x=0-2)叢 集 模 型 而 言 , 傾 斜 角 隨 著 於 dimer 中 Ge 原 子 數 目 的 增 加 而 呈 現 穩 定 地 增 加 , 分 別 為 9.9°(Si*-Si),
14.5°(Ge-Si*) , 16.3°(Ge*-Ge) 。 相 同 的 趨 勢 亦 呈 現 在 dimer 鍵 長 上 , 2.234 Å (Si*-Si) , 2.347Å (Ge*-Si),2.429Å(Ge*-Ge)。對 於 Si1 5 - xGexH1 6 (x=0-2) 叢 集 模 型 為 代 表 純 淨 表 面 , 其 dimer 傾 斜 角 可 以 看 出 是 稍 微 大 於 Si1 5 - xGexH1 8 系 列 叢 集 模 型。其 傾 斜 角 亦 是 隨 Ge 原 子 數 目 的 增 加 而 增 加 , 分 別 為 12.4°(Si*-Si) ,
15.2°(Ge*-Si) , 16.5° (Ge*-Ge) , dimer 鍵 長 亦 是 相 同 之 趨 勢 , 不 再 贅 述 。
表 四 所 列 為 SiH4 和 GeH4分 解 吸 附 於 Si1 5 - xGexH1 8 系 列 叢 集 模 型 之 活 化 能 障 (activation energy barrier, EA) 和 反 應 熱 (reaction energy, ΔERXN) 由 結 果 可 看 出 SiH4於 不 同 dimer 對 上 吸 附 反 應 的 反 應 熱 作 比 較 , 隨 著 dimer 的 鍺 原 子 數 目 的 增 加 而 增 加 。 由 鍵 的 形 成 和 斷 裂 觀 點 可 以 瞭 解 此 反 應 熱 數 據 趨 勢 , 由 於 SiH4 中
Si-H( g )鍵 須 打 斷 以 進 行 吸 附 反
應,且 Si-SiH3 ( a )和 Si-H( a )此 兩 個 新 的 鍵 結 要 形 成 , 若 當 dimer 對 為 Ge*-Si 時 , 此 新 鍵 結 為 Ge-SiH3 ( a )和 Si-H( a ), 而 當 dimer 對 為 Ge-Ge 時 , 此 新 鍵 結 為 Ge -SiH3 ( a )和 Ge-H( a ),由 於 Ge-SiH3 ( a ) 的 鍵 強 度 (bond strength) 比 Si-SiH3 ( a )來 得 弱,且 Ge-H( a )的 鍵 強 度 比 Si-H( a )亦 來 得 弱 , 以 致 於 當 dimer 鍺 原 子 愈 多 其 反 應 熱 愈 小 。 另 一 方 面 , 若 比 較 SiH4 和 GeH4於 相 同 之 dimer 上 之 反 應 熱 來 看,GeH4 之 反 應 熱 總 是 比 SiH4 來 得 更 低 , 其 原 因 為 需 打 斷 較 弱 的 Ge-H 鍵 之 故 。 相 關 之 束 縛 能 (binding energy) : 84[Ge-H( g )] 、 90[Si-H( g )] (kcal/ mol) 。 SiH4 和 GeH4 吸 附 於 純 淨 表 面 之 反 應 熱 計 算 結 果 列 於 表 五 中 。
SiH4 和 GeH4 之 吸 附 反 應 速 率 常 數 是 以 傳 統 過 渡 狀 態 理 論 (conventional transition-state theory) 作 計 算 , 其 穿 遂 效 應 (tunneling effect)使 用 Wigner 近
4
似 法 加 以 計 算 。 理 論 計 算 所 得 之 SiH4 和 GeH4 於 純 淨 表 面 吸 附 反 應 之 速 率 常 數 繪 製 於 圖 二 中 , 其 選 擇 之 溫 度 範 圍 為 氫 脫 附 足 夠 快 的 溫 度,650~800℃。通 常 具 有 較 低 能 障 之 SiH4和 GeH4之 速 率 常 數 是 較 高 的 。 僅 有 一 例 外 為 SiH4 於 Ge*-GeSi1 3H1 6 叢 集 模 型 上 之
速 率 常 數 是 較 於 Si*-SiSi1 3H1 6 上 來 得 高 的 。 此 例 外 亦 隱 含 著 當 能 障 較 小 時 , 分 布 函 數 (partition function) 的 效 應 是 決 定 速 率 常 數 的 重 要 因 素 。 GeH4 於 Si*-Si 和 Ge*-Ge 之 速 率 常 數 比 插 入 於 圖 二 中 , 可 看 出 其 比 率 隨 成 長 溫 度 上 昇 而 降 低 。
六、結論
我 們 理 論 分 析 了 鍺 原 子 於 dimer 幾 何 結 構 的 影 響 和 SiH4/GeH4 分 解 吸 附 於 SiGe(100)-2×1 表 面 上,此 計 算 結 果 是 完 成 於 無 氫 覆 蓋 dimer 和 半 氫 覆 蓋 dimer 二 種 不 同 two-dimer 系 列 叢 集 模 型 上 。 隨 著 dimer 上 鍺 原 子 數 目 增 加 使 得 dimer 結 構 更 為 傾 斜 , 且 純 淨 表 面 之 dimer 傾 斜 角 較 半 氫 覆 蓋 表 面 來 得 大 。 同 時 反 應 熱 亦 隨 dimer 鍺 原 子 數 目 增 加 而 增 加 。 若 不 考 慮 較 不 穩 定 Si*-Ge dimer, SiH4 和 GeH4 吸 附 於 Ge*-Si 的 能 量 障 礙 是 最 低 的,而 在 Ge*-Ge 則 是 最 高 的 。 對 於 Si*-Ge 之 反 應 熱 和 能 量 障 礙 仍 列 出 作 比 較 參 考 。 計 算 所 得 速 率 常 數 之 趨 勢 通 常 是 和 能 量 障 礙 之 趨 勢 相 符 合 。 此 計 算 結 果 不 僅 和 超 音 速 分 子 束 技 術 實 驗 結 果 相 吻 合 且 提 供 了 更 詳 細 的 了 解 。
七、參考文獻
1. Chia-Liang Cheng, Dah-Shyang Tsai and Jyh-Chiang Jiang, Surf.
Sci., 600, 3194(2006)
八、附圖與附表
圖 一 經 最 適 化 後 SiGe(100)-2×1 結 構
0.95 1.00 1.05 1.10
10000 100000 1000000 1E 7 1E 8 1E 9 1E 10 1E 11
G eH4 rate constant Si*-S iS i13H16 G e*-S iS i13H16 Si*-G eS i13H16 G e*-G eS i13H16
S iH4 rate constant S i*-S iS i13H16 G e*-S iS i13H16 S i*-G eS i13H16 G e*-G eS i13H16
600 700 800
1.5 2.0 2.5
Ratio of reaction constant
Temperature (oC) GeH4 adsorption reaction constant ratio of Si*-Si/Ge*-Ge
k (s-1 )
1000/T K
圖 二 SiH4(空 心 )和 GeH4(實 心 )吸 附 於 pristine SiGe(100)表 面 之 速 率 常 數 。 GeH4於 Si*-Si 和 Ge*-Ge dimer 上 之 速 率 常 數 比 圖 插 入 於 圖 上 。
6
表一 Si*-GeSi13H18 和 Ge*-SiSi13H18叢 集 模 型 零 點 能 差 ΔE 比 較 表 Zero-point energy (hartree)
method/basis set Si*-GeSi13H18 Ge*-SiSi13H18 ΔE (kcal/mol) B3LYP/6-31G* -6138.694626 -6138.690882 -2.35 B3LYP/6-31G** -6138.715418 -6138.711612 -2.39 B3LYP/6-31+G* -6138.724014 -6138.721354 -1.67 B3LYP/6-311G* -6140.991354 -6140.993953 1.63 B3LYP/6-311+G* -6140.995512 -6140.998195 1.68 B3LYP/6-311++G** -6141.024512 -6141.027217 1.70 ΔE=E(Si*-GeSi13H18)-E(Ge*-SiSi13H18 )
表 二 Si*-SiSi1 3H1 8、Ge*-SiSi1 3H1 8 和 Ge*-GeSi1 3H1 8之 計 算 所 得 dimer 鍵 長 R 和 傾 斜 角 θ 與 文 獻 中 理 論 計 算 結 果
Si*-SiSi13H18 Ge*-SiSi13H18 Ge*-GeSi13H18
Basis set R (Å)
θ
(o) R (Å)θ
(o) R (Å)θ
(o) 6-31G* 2.240 10.1 2.296 13.9 2.349 14.2 6-31G** 2.240 10.8 2.296 14.1 2.349 14.5 6-31+G* 2.237 10.3 2.307 10.9 2.384 15.3 6-311G* 2.240 9.8 2.347 14.0 2.430 15.6 6-311+G* 2.234 9.9 2.347 14.5 2.429 16.3 6-311++G** 2.233 9.9 2.347 14.5 2.429 16.2 表 三 於 B3LYP/6-311+G*下 Si1 5 - xGexH1 8(x=0-2)和 Si1 5 - xGexH1 6 (x=0-2)叢集模型之 dimer 鍵長 R 和 dimer 傾斜角 θ 比較表
Cluster R (Å)
θ
(o) Charge(NBO) Δcharge Si*-SiSi13H18 2.234 9.9 -0.157(Si*) 0.077(Si) 0.234 Ge*-SiSi13H18 2.347 14.5 -0.139(Ge*) 0.192(Si) 0.331 Ge*-GeSi13H18 2.429 16.3 -0.107(Ge*) 0.237(Ge) 0.344 (Si*-GeSi13H18) 2.313 9.8 -0.164(Si*) 0.154(Ge) 0.318Si*-SiSi13H16 2.261 12.4 -0.185(Si*) 0.176(Si) 0.361 Ge*-SiSi13H16 2.373 15.2 -0.131(Ge*) 0.245(Si) 0.376 Ge*-GeSi13H16 2.454 16.5 -0.105(Ge*) 0.285(Ge) 0.390 (Si*-GeSi13H16) 2.342 12.5 -0.172(Si*) 0.234(Ge) 0.406
表 四 SiH4 和 GeH4 分 解 吸 附 於 Si1 - xGexSi1 3H1 8 叢 集 模 型 之 活 化 能 障 EA和 反 應 熱 ΔER X N 之 比 較 表
Precursor/cluster EA (kcal/mol) ΔERXN (kcal/mol)
SiH4/Si*-SiSi13H18 13.8 -48.9 SiH4/Ge*-SiSi13H18 12.6 -44.8 SiH4/Ge*-GeSi13H18 18.1 -38.0 (SiH4/Si*-GeSi13H18) 17.4 -43.4
GeH4/Si*-SiSi13H18 12.0 -52.4 GeH4/Ge*-SiSi13H18 10.5 -47.7
GeH4/Ge-GeSi13H18 14.0 -41.4 (GeH4/Si*-GeSi13H18) 15.7 -46.7 (Si*-GeSi13H18)是較 Ge*-SiSi13H18叢 集 模 型 不 穩 定
表 五 SiH4 和 GeH4 分 解 吸 附 於 Si1 - xGexSi1 3H1 6 叢 集 模 型 之 活 化 能 障 EA和 反 應 熱 ΔER X N 之 比 較 表
Precursor/cluster EA (kcal/mol) ΔERXN (kcal/mol)
SiH4/Si*-SiSi13H16 11.8 -48.5 SiH4/Ge*-SiSi13H16 11.3 -42.7 SiH4/Ge*-GeSi13H16 17.4 -36.1 (SiH4/Si*-GeSi13H16) 15.8 -42.4
GeH4/Si*-SiSi13H16 10.7 -51.1 GeH4/Ge*-SiSi13H16 8.0 -47.3 GeH4/Ge*-GeSi13H16 13.3 -39.1 (GeH4/Si*-GeSi13H16) 14.6 -45.3 (Si*-GeSi13H18)是較 Ge*-SiSi13H18叢 集 模 型 不 穩 定
DFT study on dissociative adsorption of SiH
4and GeH
4on SiGe(1 0 0)-2 · 1 surface
Chia-Liang Cheng, Dah-Shyang Tsai
*, Jyh-Chiang Jiang
Department of Chemical Engineering, National Taiwan University of Science and Technology 43, Keelung Road, Section 4, Taipei 106, Taiwan Received 7 December 2005; accepted for publication 7 June 2006
Available online 30 June 2006
Abstract
SiH4and GeH4dissociative adsorptions on a buckled SiGe(1 0 0)-2· 1 surface have been analyzed using density functional theory (DFT) at the B3LYP level. The Ge alloying in the Si(1 0 0)-2· 1 surface affects the dimer buckling and its surface reactivity. Systematic Ge influences on the reaction energetics are found in SiH4and GeH4reactions with four dimers of Si*–Si, Ge*–Si, Ge*–Ge, and Si*–Ge (* denotes the protruded atom). On a half H-covered surface, the energy barriers for silane and germane adsorption are higher than those on the pristine surface. The energy barrier for silane adsorption is higher than the corresponding barrier for germane adsorption. Rate constants are also calculated using the transition-state theory. We conclude that the SiGe surface reactivity in adsorption reaction depends on the Ge presence in dimer form. If the surface Ge is present in form of Ge*–Ge, the surface reactivity decreases as the Ge*–Ge content increases. If the surface Ge prefers to be in form of Ge*–Si at low Ge contents, the surface reactivity increases first, then decreases at high Ge surface contents when Ge*–Ge prevails. The calculated rate constant ratio of GeH4adsorption on Si*–Si over Ge*– Ge at 650C is 2.1, which agrees with the experimental ratio of GeH4adsorption probability on Si(1 0 0) over Si(1 0 0) covered by one monolayer Ge. The experimental ratio is 1.7 measured through supersonic molecular beam techniques. This consistency between calcu- lation and experimental results supports that one monolayer of Ge on Si(1 0 0) exists in form of Ge*–Ge dimer.
2006 Elsevier B.V. All rights reserved.
Keywords: Density functional calculations; Surface chemical reaction; Adsorption kinetics; Silane; Germane
1. Introduction
The growth kinetics of SiGe heteroepitaxial thin film is of importance in the semiconductor industry since SiGe/
Si(1 0 0) heterostructures allow band-gap engineering on high-speed devices in conjunction with the established sili- con technology. The SiGe epitaxial growth is generally car- ried out using either gas-source molecular beam epitaxy or ultrahigh vacuum chemical vapor deposition[1–4]. These techniques typically employ conditions of high vacuum and low precursor pressure, hence gas-phase reactions are hardly involved in the growth kinetics. Major surface reac- tion paths consist of direct interactions between the precur- sors and the growing SiGe alloy surface. Silane SiH4and
germane GeH4 are two common precursors used in the SiGe heteroepitaxy, and their dissociative adsorptions are the starting points of surface reaction paths.
It is known that GeH4inclusion in the precursor source changes the silicon hydride deposition kinetics. For in- stance, an addition of 10% GeH4was reported to accelerate the SiH4growth rate on Si(1 0 0) by a factor of 25 at 550C [5]. The acceleration effect at low growth temperatures (6600C) originates from the Ge assistance in surface hydrogen desorption, which is the rate-determining step [6–8]. At high growth temperature (P650C), desorption of hydrogen is sufficiently fast, opening up most sites of dangling bonds for dissociative adsorption which becomes a critical step. The dependence of growth rate on the GeH4
content is not monotonic under high temperatures, the growth rate increases with the GeH4 content in the low concentration range, reaches a maximum, and decreases
0039-6028/$ - see front matter 2006 Elsevier B.V. All rights reserved.
doi:10.1016/j.susc.2006.06.011
*Corresponding author. Tel.: +886 2 27376618; fax: +886 2 27376644.
E-mail address:[email protected](D.-S. Tsai).
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at a higher GeH4content. Kim et al. reported a maximum growth rate between 0.8 and 2.6% GeH4content in the high temperature range[9]; Racanelli and Greve reported that a maximum was between 0.8 and 1.25% GeH4 content at 665C[10]. Since the dissociative adsorption is considered to be a critical step at high temperatures, the reactivity of strained SiGe surface in hydride adsorption has been a cen- tral issue. Engstrom et al. showed that the Si(1 0 0) surface was more reactive than the Ge(1 0 0) surface in the GeH4
dissociative adsorption, and the reactivity of a strained Ge surface was in between[11,12].
To precisely control the composition of epitaxial layer, a detailed understanding on chemisorption of both SiH4and GeH4 is necessary. Based on adsorption experiments, Gates et al. argued that SiH4dissociation should be most favorable at the adjacent dangling bonds of a single dimer on Si(1 0 0)-2· 1 [13–15]. Kang and Musgrave confirmed that the energy barrier of SiH4adsorption on a single dimer was lower than that across two dimers based on the density functional theory (DFT) results [16]. Miyamoto et al.
formulated a model that assumed chemisorption on two dangling bonds (two-site) below 600C and switched to four-site chemisorption above 600C [17]. More specifi- cally, the first step in SiH4 chemisorption was scission of one of the four Si–H bonds across a dimer pair of dangling
bonds on Si(1 0 0)-2· 1. The following step could be SiH3
desorption or stabilization of SiH3with two more dangling bonds [18–20]. This was the so-called two-site two-step model. The GeH4 chemisorption is expected to follow a similar path consisting of lower energy barriers. Lin and Chou studied the GeH4 adsorption on Si(1 0 0)-2· 2 and Ge(1 0 0)-2· 2 surface using the supercell model [21]. Lin and Lee calculated the energetics of SiH4 and GeH4
adsorptions on the Si(1 0 0)-2· 2 surface based on DFT with generalized gradient approximation and pseudopoten- tial approximation [22]. In the literature, few theoretical articles estimated the kinetic differences in SiH4 and GeH4adsorption on dimers of the mixed SiGe surface.
In this work, we investigate SiH4and GeH4dissociative adsorption reaction on the SiGe(001)-2· 1 surfaces with and without hydrogen coverage using the DFT method.
Discussion is focused on influences of the Ge surface alloy- ing on energetics and rate constants of the SiH4and GeH4 adsorptions.
2. Methodology
Clusters of Si15xGexH18 and Si15xGexH16 (x = 1, 2) with one or two Ge atoms among four surface atoms are used to represent a two-dimer surface. Other clusters with
C.-L. Cheng et al. / Surface Science 600 (2006) 3194–3201 3195
more than two Ge surface atoms are also used in calcula- tion, but the results are supplementary since the differences are small. The surface of Si15xGexH18 cluster has one dimer with two dangling bonds and the other dimer passiv- ated with hydrogen, while that of Si15xGexH16cluster is a pristine surface with two dimers of four dangling bonds.
Only the dimer of dangling bonds is considered in SiH4
and GeH4 adsorption reaction. The truncated bulk Si–Si bonds are terminated with 16 Si–H bonds to preserve the sp3hybridization of the subsurface Si atoms.
When the importance of dimer reactant needs to be emphasized, the first two elements of cluster notation de- note the dimer on which SiH4or GeH4is adsorbed. Since a dimer of dangling bonds is buckled (or tilted), a star sign is used to denote the protruded atom of the buckled dimer involved in adsorption. For example, Ge*-SiSi13H18 has a buckled Ge*–Si dimer and the Ge atom is a protruded atom. Ge*–GeSi13H16cluster has a buckled Ge*–Ge dimer, the Ge*–Ge dimer is involved in adsorption and the other Si–Si dimer of dangling bonds is not involved in adsorp- tion. This paper mainly discusses eight surface clusters, which are Si*–SiSi13H18, Ge*–SiSi13H18, Si*–GeSi13H18, Ge*–GeSi13H18, Si*–SiSi13H16, Ge*–SiSi13H16, Si*–Ge- Si13H16, and Ge*–GeSi13H16. Structures of four optimized clusters are illustrated inFig. 1.
Geometry optimizations of the clusters were performed without artificial symmetric or geometric constraints. The B3LYP three-parameter hybrid exchange-correlation func- tional was employed for all the DFT calculations[23–25].
Unscaled zero-point energies were also evaluated at the same level. Si*–SiSi13H16 was the first cluster being opti- mized by removing four surface hydrogen atoms from an optimized structure of Si15H20. Other clusters were subse- quently optimized after substituting surface Si with Ge, or adding surface hydrogen to Si*–SiSi13H16. One SiH4or GeH4 molecule was placed on top of a dimer, and the geometry of reactant adduct was optimized again. The transition state (TS) structure was obtained by following a pseudo-reaction coordinate, and the first-order saddle point was located using the Berny transition-state algo- rithm. All calculations were performed using the Gaussian 03 suite of programs[26]. The definitions of activation en- ergy barrier EAand reaction energy DERXNare illustrated inFig. 2.
3. Benchmark calculation
Equilibrium geometries of Si*–GeSi13H18 and Ge*– SiSi13H18 were optimized at the B3LYP level using 6-31G*, 6-31G**, 6-31+G*, 6-311G*, 6-311+G*, and 6- 311++G** Pople basis sets as benchmark study. Table 1 compares values of the energy difference DE between opti- mized isomers of Si*–GeSi13H18 and Ge*–SiSi13H18. Results using the basis sets of 6-31G*, 6-31G**, and 6- 31+G* indicate Si*–GeSi13H18 is a more stable isomer.
On the contrary, results using the higher level basis sets of 6-311G*, 6-311+G*, and 6-311++G** show that Ge*–
SiSi13H18 is more stable. Jenkins and Srivastava [27], and Miwa[28]calculated the total energy of mixed Si–Ge dimer surface using the so-called supercell methods and found that the configuration with a Ge atom in the up position was energetically favorable compared with the Si-up con- figuration. They also showed that energy of the Si–Ge dimer was lower than those of Si–Si and Ge–Ge dimers.
These theoretical results are consistent with the high reso- lution photoemission spectra results of Patthey and his coworkers[29,30].
Dimer bond lengths and buckle angles of Si*–SiSi13H18, Ge*–SiSi13H18, Ge*–GeSi13H18of this work, along with the reported values in the literature[27–35], are listed inTable 2. The dimer bond length is the distance between two dimer atoms. The buckle angle is the angle between the dimer and the nominal surface plane, which is defined by the second Si layer in a cluster. Again, our results of Si*–Si, Ge*–Si, Ge*–Ge bond lengths and tilt angles using 6-311G*, 6- 311+G*, and 6-311++G** are generally in line with the experimental results and other theoretical results, much better than those results using the low level basis sets.
Therefore we conclude that using a basis set higher than the Pople triple-zeta basis (6-311G) is crucial in the DFT calculation of SiGe cluster at the B3LYP level. Basis sets lower than 6-311G, either with polarization functions or
Fig. 2. Potential energy diagram of a typical adsorption reaction (GeH4+ Ge*–SiSi13H18) and its TS geometry.
Table 1
Zero point energies of Si*–GeSi13H18 and Ge*–SiSi13H18 optimized clusters, and the difference between two clusters DE in a benchmark study Method/basis set Zero-point energy (hartree) DE(kcal/mol)
Si*–GeSi13H18 Ge*–SiSi13H18
B3LYP/6-31G* 6138.694626 6138.690882 2.35 B3LYP/6-31G** 6138.715418 6138.711612 2.39 B3LYP/6-31+G* 6138.724014 6138.721354 1.67 B3LYP/6-311G* 6140.991354 6140.993953 1.63 B3LYP/6-311+G* 6140.995512 6140.998195 1.68 B3LYP/6-311++G** 6141.024512 6141.027217 1.70 DE= E(Si*–GeSi13H18) E(Ge*–SiSi13H18).
3196 C.-L. Cheng et al. / Surface Science 600 (2006) 3194–3201
with diffuse functions, are insufficient to generate accurate results. To ensure accurate results in not only optimization but also TS calculation, we employ the 6-311+G* basis set throughout this work.
4. Results and discussion 4.1. Surface of buckled dimers
A number of experimental and theoretical studies have demonstrated that the Si(1 0 0), Ge(1 0 0), mixed SiGe(1 0 0) pristine surfaces are composed of the buckled dimers. The geometries of all optimized clusters in this study also show that those dimers with dangling bonds are buckled and those H-covered dimers are lying in the nominal surface plane. Values of the dimer bond length and the buckle an- gle of two representative surface clusters are listed inTable 3. For Si15xGexH18 (x = 0–2) clusters, the buckle angle steadily increases with the number of Ge atoms in dimer, 9.9 (Si*–Si), 14.5 (Ge*–Si), and 16.3 (Ge*–Ge). The di- mer bond length also increases, 2.234 (Si*–Si), 2.347 (Ge*–Si), and 2.429 A˚ (Ge*–Ge). The dimer buckle angle of Si15xGexH16 (x = 0–2) clusters, representing a pristine surface, is slightly larger than that of Si15xGexH18, repre-
increases as the number of Ge atoms, 12.4 (Si*–Si), 15.2
(Ge*–Si), 16.5 (Ge*–Ge), so does the bond length. In short, as the number of Ge atoms increases, the dimer be- comes longer and further buckled.
Also listed in Table 3 are the parameters of Si*-Ge- Si13H18 cluster, which is an isomer of Ge*–SiSi13H18. Although, the configuration with the Ge atom in the up position is more stable than the configuration with Si in the up position, both configurations are considered in the dissociative adsorption reactions. The zero-point energy difference between Ge*–SiSi13H18and Si*–GeSi13H18is only 1.68 kcal/mol, shown inTable 1. The Boltzmann probabil- ity (P) ratio of these two isomers can be estimated as fol- lows, P(Si*–GeSi13H18)/P(Ge*–SiSi13H18)ffi exp(DE/RT).
The probability ratio is 0.10 (100C), 0.38 (600 C), 0.49 (900C). The estimated probability ratios clearly indicate that Si*–GeSi13H18 is less important, but should not be ignored completely in the growth temperature range. As for the pristine surface isomers of Ge*–SiSi13H16and Si*– GeSi13H16, the zero-point energy difference is also small, 2.01 kcal/mol. In general, the less stable isomer has a shorter dimer length and a smaller buckle angle,Table 3.
Owing to a 4.2% lattice mismatch between Si and Ge, Si1xGex/Si(1 0 0) heteroepitaxy is a strained layer epitaxy.
The strain not only increases the degree of dimer buckling but also alters the electronic nature of dimer bond. One important feature of the bonding in a pristine Si(1 0 0) dimer is that it involves a strong r-bond and a weaker p-bond. The 4.2% mismatch causes the Ge atom to displace from the Si surface. The displacement is associated with an electron density shift from the dangling bond of the down atom to that of the up atom. The electron density shift renders certain ionic character to the dimer and de- creases the p-bond character because of reduced overlap in the dangling bond. The consequence is that the dimer bond length increases with the number of Ge atoms, and the charge difference between the up atom and the down atom also increases. The charge differences between dimer atoms are evaluated using natural bond orbital (NBO)
Table 2
Calculated structure parameters (dimer bond length R and tilt angle h) for Si*–SiSi13H18, Ge*–SiSi13H18and Ge*–GeSi13H18clusters and a compar- ison with other theoretical and experimental results
Basis set Si*–SiSi13H18 Ge*–SiSi13H18 Ge*–GeSi13H18
R(A˚ ) h () R(A˚ ) h() R(A˚ ) h()
6-31G* 2.240 10.1 2.296 13.9 2.349 14.2
6-31G** 2.240 10.8 2.296 14.1 2.349 14.5
6-31 + G* 2.237 10.3 2.307 10.9 2.384 15.3
6-311G* 2.240 9.8 2.347 14.0 2.430 15.6
6-311 + G* 2.234 9.9 2.347 14.5 2.429 16.3
6-311 ++ G** 2.233 9.9 2.347 14.5 2.429 16.2 Jenkins and
Srivastava[27]
(ab initio)
2.25 16.1
Takahasi et al.[31]
(exp)
2.37 20.0
Bullock et al.[32]
(exp)
2.25 19.0
Jenkins and Srivastava[27]
(ab initio)
2.34 19.3
Miwa[28]
(ab initio)
2.41 21.1
Chen et al.[30]
(exp)
2.43 ± 0.1
31 ± 2
Cho and Kang[33]
(ab initio)
2.39 16.3
Oyanagi et al.[34]
(ab initio)
2.40 ± 0.08
N.A
Frontes et al.[35]
(exp)
2.55 ± 0.04
12.4
Table 3
Dimer bond length R and tilt angle h of Si15xGexH18 (x = 0–2) and Si15xGexH16 (x = 0–2) clusters optimized at the B3LYP level using 6 311 + G*basic set
Cluster R(A˚ ) h() Charge (NBO) Dcharge
Si*–SiSi13H18 2.234 9.9 0.157(Si*) 0.077(Si) 0.234 Ge*–SiSi13H18 2.347 14.5 0.139(Ge*) 0.192(Si) 0.331 Ge*–GeSi13H18 2.429 16.3 0.107(Ge*) 0.237(Ge) 0.344 (Si*–GeSi13H18) 2.313 9.8 0.164(Si*) 0.154(Ge) 0.318 Si*–SiSi13H16 2.261 12.4 0.185(Si*) 0.176(Si) 0.361 Ge*–SiSi13H16 2.373 15.2 0.131(Ge*) 0.245(Si) 0.376 Ge*–GeSi13H16 2.454 16.5 0.105(Ge*) 0.285(Ge) 0.390 (Si*–GeSi13H16) 2.342 12.5 0.172(Si*) 0.234(Ge) 0.406 The structure parameters of Si*–GeSi13H18and Si*–GeSi13H16clusters are parenthesized since the isomers are less stable than Ge*–SiSi13H18 and Ge*–SiSi13H16. Also listed are the charge differences between dimer atoms.
C.-L. Cheng et al. / Surface Science 600 (2006) 3194–3201 3197
charge difference is 0.234 (Si*–Si) < 0.331 (Ge*–Si) < 0.344 (Ge*–Ge). For Si15xGexH16, the charge difference is high- er, 0.361 (Si*–Si) < 0.376 (Ge*–Si) < 0.390 (Ge*–Ge). Both increase with the number of Ge atoms.
4.2. Dissociative adsorption of SiH4and GeH4
As an example,Fig. 2illustrates the TS geometry of dis- sociative adsorption GeH4on the cluster Ge*–SiSi13H18via scission of a Ge–H bond. The optimized TS geometry shows that the H atom of GeH4is abstracted by a positive down Si atom, simultaneously the Ge atom of GeH4 is interacting with a negative up Ge atom in dimer. The reac- tion mechanism was investigated by Brown and Doren[19]
on SiH4 adsorption on the Si(1 0 0)-2· 1 pristine surface.
They predicted an energy barrier of 12–14 kcal/mol, depending on details of the theoretical model. This four- center TS was also the vital geometry in studying chloro- silane adsorption on the Si(1 0 0)-2· 1 pristine surface via scission of one Si–Cl bond[36]. In this study, TS of SiH4
and GeH4 adsorbed on the Si1xGex clusters have been searched at different dimers. For all cases being calculated, the only negative frequency of TS falls in the range of 330–
450 cm1. Inspection of the normal mode corresponding to the negative eigenvalue shows that the reaction coordinate involves a concerted motion of the H atom away from the Ge atom in GeH4with motion of the Ge atom towards the another dimer atom.
Since the surface dimer is essentially charged, consisting of an electrophilic down atom and a nucleophilic up atom, the H-abstraction reaction is bound to occur between the down atom and the H atom. If we force the H atom of Si–H or Ge–H bond to approach the up atom during a sad- dle point search, the up atom of dimer sinks as the down atom rises like a seesaw.Table 4lists the activation energy barrier EA and the reaction energy DERXN of SiH4 and GeH4dissociative adsorption on Si15xGexH18. When the reaction energies of SiH4 adsorption on different dimers are compared, the DERXNvalue increases with the increas- ing Ge atom in the dimer. The sequence in DERXN value
can be understood in view of bond breaking and bond for- mation. The Si–H(g) is the bond being cleaved in SiH4
adsorption. Two new bonds Si–SiH3(a) and Si–H(a) are formed on the Si*–Si dimer. When the dimer is Ge*–Si, two new bonds are Ge–SiH3(a) and Si–H(a). When the dimer is Ge*–Ge, two newly formed bonds are Ge–SiH3(a)
and Ge–H(a). Since the bond strength of Ge–SiH3(a)bond is less than that of Si–SiH3(a)bond, and that of Ge–H(a)bond is less than that of Si–H(a) bond, the value of reaction energy decreases with more Ge in the dimer. On the other hand, if the reaction energy of SiH4and that of GeH4on the same dimer are compared, the DERXN value of GeH4
adsorption is always less because less energy is required to break the Ge–H(g) bond. The binding energy of Ge–
H(g) bond has been estimated 84 kcal/mole, less than 90 kcal/mol of Si–H(g)bond in SiH4[37]. Reaction energies of SiH4and GeH4adsorption on the pristine surface are listed in Table 5. Adsorption reaction energy on the pris- tine surface follows the same trend in Table 4, but its DERXN value is slightly higher.
The EAvalues, listed inTables 4 and 5, do not follow the trend of reaction energy because of the complexity in dimers discussed earlier. The energy barrier for SiH4 or GeH4 adsorption on the Ge*–Ge dimer is generally the highest among three dimers on the cluster surface with either two or four dangling bonds. The second lowest en- ergy barrier is on Si*–Si dimer, and the lowest barrier is on Ge*–Si dimer. This interesting result has insightful implication in the growth kinetics and the grown SiGe layer composition. Engstrom and his coworkers measured the reaction probability of GeH4using supersonic molecu- lar beam techniques. They reported the reaction probabil- ity of GeH4 on the zero H-coverage Si(1 0 0) was 2–5 times that of GeH4on the zero-coverage Ge(1 0 0) surface [11]. In another experiment, at substrate temperature 650C when the surface hydrogen coverage could be ne- glected, as the surface Ge content on Si(1 0 0) increased from Ge zero coverage, the GeH4reaction probability stea- dily decreased with the increasing Ge surface content. The highest barrier of GeH4on a Ge*–Ge dimer inTables 4 and 5 is generally in line with Engstrom’s conclusions.
Engstrom also measured the influence of strain on Si1xGex overlayer in the dissociative adsorption of
Table 4
Activation barriers EAand reaction energy DERXNfor SiH4 and GeH4
dissociative adsorption on Si1xGexSi13H18(x = 0 2) clusters Precursor/cluster EA(kcal/mol) DERXN(kcal/mol) SiH4/Si*–SiSi13H18a 13.8 48.9
SiH4/Ge*–SiSi13H18 12.6 44.8 SiH4/Ge*–GeSi13H18 18.1 38.0 (SiH4/Si*–GeSi13H18) (17.4) (43.4) GeH4/Si*–SiSi13H18 12.0 52.4 GeH4/Ge*–SiSi13H18 10.5 47.7 GeH4/Ge*–GeSi13H18 14.0 41.4 (GeH4/Si*–GeSi13H18) (15.7) (46.7) The parenthesized Si*GeSi13H18is less stable than Ge*–SiSi13H18.
aThe activation energy fitted to RRKM model was 13.4 kcal/mol by Xia et al. (J. Vac. Sci. Technol. A, 1995) on SiH4dissociative adsorption on Si(1 0 0).
Table 5
Activation barriers EA and reaction energy DERXNfor SiH4and GeH4
dissociative adsorption on Si1xGexSi13H16(x = 0–2)
Precursor/cluster EA(kcal/mol) DERXN(kcal/mol) SiH4/Si*–SiSi13H16 11.8 48.5
SiH4/Ge*–SiSi13H16 11.3 42.7 SiH4/Ge*–GeSi13H16 17.4 36.1 (SiH4/Si*–GeSi13H16) (15.8) (42.4) GeH4/Si*–SiSi13H16 10.7 51.1
GeH4/Ge*–SiSi13H16 8.0 47.3
GeH4/Ge*–GeSi13H16 13.3 39.1 (GeH4/Si*–GeSi13H16) (14.6) (45.3) The parenthesized Si*GeSi13H16is less stable than Ge*–SiSi13H16.
3198 C.-L. Cheng et al. / Surface Science 600 (2006) 3194–3201