FMEA TRIZ TFT-LCD COG TRAY FMEA When Incorporate With Triz,Can Be Use For The Improvement Of Eliminating Tray Disc Scraps During Processing E09303014

(1)

FMEA TRIZ TFT-LCD COG TRAY

FMEA When Incorporate With Triz,Can Be Use For The Improvement Of Eliminating Tray Disc Scraps During Processing

E09303014

(2)

(3)

(4)

(5)

FMEA TRIZ TFT-LCD COG TRAY

(Failure Mode and Effective Analysis, FMEA)

(Risk Priority Number, RPN)

(TRIZ) (Contradiction Matrix)

TFT-LCD COG TRAY

(6)

(7)

FMEA When Incorporate With Triz,Can Be Use For The Improvement Of Eliminating Tray Disc Scraps During Processing

Student : Yu-Hui Kao Advisor : Dr. Yu-Cheng Lee

Abstract

A not well design product will cause unpredictable damage to human life and property. Therefore at the developing design process, how to decrease the probable failure and increase the effect design of the product is an important process in the designing process. FMEA, fail mode and effective analysis, which is one of a common method to analysis and find out the fail mode of the product is to dig out the unobservable problem or hidden mistake at the design and manufacture process or before deliver the product, no matter what is a system, a design, a manufacture process, or a service.

Traditional fail mode and effective analysis method focus on the analysis of severity, occurrence, and detection of the fail item and calculate the risk priority number of those fail items. When the risk priority number over the acceptance range, the brainstorming method and cause-effect diagram can create an improve strategies to decrease the severity and probability of the failure. But how does the improve strategies affect the other subsystem did not be considered.

TRIZ, Teorija Rezhenija Izobretate Zadach, is a new method applying the contradiction matrix in the product developing and designing process. It can help the designer to recognize the aggravating of subsystem and afford a suitable method to the solver. TRIZ become more important solution in the enterprise.

A major research in this paper is to use a combination methodology to analyze the failure problem of the product. First, the fail mode and effective analysis method is used to analysis the failure problem of the product, then sue the TRIZ method to analyses the correlative problem between the failure problem and the other subsystem.An example of tray improves in Chip on Glass process of the

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Thin Film Transistor-Liquid Crystal Display has been shown in this paper.

keywords: Failure Mode and Effective Analysis, Risk Priority Number, Teresa Rezhenija Izobretate Zadach, Contradiction Matrix

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95 7

(10)

... I ABSTRACT... III ...V ... VI ...VIII ... IX

... 1

1.1 ... 1

1.2 ... 1

1.3 ... 2

1.4 ... 2

1.5 ... 3

... 4

2.1 (FAILUREMODE AND EFFECTSANALYSIS FMEA) ... 4

2.1.1 FMEA ... 4

2.1.2 FMEA ... 7

2.1.3 FMEA ... 8

2.1.4 FMEA ... 15

2.2 TEORIJA REZHENIJA IZOBRETATE ZADACH TRIZ ... 18

2.2.1 TRIZ ... 18

2.2.2 TRIZ ... 21

2.2.3 TRIZ ... 28

TRIZ FMEA... 29

3.1 T-FMEA ... 29

3.2 T-FMEA ... 31

(11)

... 34

4.1 TFT-LCD ... 34

4.1.1 TFT-LCD ... 34

4.1.2 TFT ... 35

4.2 ... 37

4.3 TFT-LCD ... 37

4.4 T-FMEA COG ... 38

4.4.1 COG ... 38

4.4.2 ... 40

... 53

5.1 ... 53

5.2 ... 53

... 55

A... 58

B ... 60

C ... 64

(12)

1.1 ... 2

2.1 FMEA ... 6

2.2 ... 15

2.3 TRIZ ... 20

2.4 TRIZ ... 21

2.5 ... 23

2.6 ... 26

3.1 T-FMEA ... 30

4.1 LCD ... 34

4.2 ... 38

4.3 TFT COG ... 39

4.4 ... 41

4.5 ... 41

4.7 Tray LCD ... 44

4.8 ( ) ... 51

4.9 ( ) ... 51

(13)

2.1 FMEA ... 6

2.2 ... 9

2.3 Cs ... 10

2.4 ... 10

2.5 ... 10

2.6 ... 11

2.7 ... 13

2.8 ... 13

2.9 ... 14

2.10 FMEA ... 17

2.11 (Levels of innovation) ... 19

2-12 39 ... 22

2.13 40 ... 23

2.14 TRIZ ... 28

3.1 T-FMEA ... 33

4.1 ... 45

4.2 ... 45

4.3 ... 46

4.4 COG T-FMEA ... 47

4.5 ... 50

(14)

1.1

TFT-LCD (thin-film transistor liquid-crystal display)

C-RT LCD

LCD

FMEA RPN

TRIZ

1.2

TFT-LCD COG

COG Tray

(15)

” ”

1.3

1.1 FMEA

TRIZ ”T-FMEA”

COG

T-FMEA”

1.1

1.4

”T-FMEA”

” ” ” ”

TFT-LCD

Tray

(16)

1.5

TFT-LCD TFT-LCD

(17)

2.1 (Failure Mode and Effects Analysis FMEA)

Failure Mode and Effects Analysis

FMEA CNS 12684 FMEA

…

1 10 26

2.1.1 FMEA

FMEA FMEA

1950

(Grumman) FMEA

29

1960

(NASA) 1963 NPC 250-1

(Design Review)

FMEA FMEA

(18)

FMEA 1974

MIL-STD-1629 FMECA(Failure Mode Effects and Criticality Analysis)

29 1977 7 24 FMEA

1980 FMEA

FMEA

FMEA (ASQC)

Ford Chrysler General Motor ;AIAG

MIL-STD-1629A 24 25 29

1985 (International ElectronicalCommission IEC)

IEC812 MIL-STD-1629A FMEA

FMEA

FMEA 11 27

Auto Industry Action Group AIAG QS-9000

1993 AIAG

FMEA

20 16 1995

SAE SAE J-1739

FMEA

FMEA 25

(19)

2.1 FMEA

25

2.1 FMEA 5 FMEA

2.1 FMEA 2.1

FMEA

7~8%

FMEA

2.1 FMEA

NO NO

1 25% 5 8%

2 22% 6 7%

3 18% 7 9%

4 15%

1

(20)

4

Failure Mode and Effective Criticality Analysis FMECA

18 FMEA

12

RELEX FMEA

6

2 2.1.2 FMEA

FMEA QS-9000

FMEA FMEA FMEA FMEA

(21)

FMEA 3 Design Failure Modes and Effects Analysis D-FMEA Process Failure Modes and Effects

Analysis P-FMEA (System Failure Mode and

Effect Analysis S-FMEA) 7 20

D-FMEA D-FMEA

D-FMEA

P-FMEA P-FMEA

/ P-FMEA

(S-FMEA) S-FMEA

2.1.3 FMEA

FMEA

(22)

1 13 19

(1988) FMEA FTA

1

i

Ci Cs

2.2 Cs

) 1 . 2 ..(

...

/ ) ....

2 1

(C C Ci I

Cs

10 1 Ci

I

2.1 Cs 2.3 Cs

4

( 2.4 ) (

2.5 )

2.2

i (1 i 5) Ci

1.

2.

3.

4.

5.

1 ~ 10

(23)

2.3 Cs Cs

7 ~ 10 I

4 ~ 7 II

2 ~ 4 III

2 IV

2.4

I II III IV

2.5

I II III IV 2

5.0 0.5 Ce

) 2 . 2 ...(

...

5 4 3 2

1 F F F F

F Ce

F1 F2 F3

(24)

F4 F5

F1 F2 F3 F4 F5 2.6

2.2

Ce Ce 2.3 Cs 2.4

2.6

5.0 3.0 F1 1.0

0.5

2 2.0

1 1.0

F2 0.5

1.5 1.0

F3 0.5

1.3 1.0

F4 0.7

1.2 1.0

F5 0.8

3 (Criticality Analysis, CA)

2.5

I( II )

100

( 100 )

) 3 . 2 ...(

...

) 10

( ⁶

1

n t

K Ka

Cr _E _G

i

n

Cr

(25)

n

t ( )

Ka

KE

G ( ) 100

G

(Risk Priority Number, RPN)

FMEA RPN

RPN RPN S O

D

) 4 . 2 ..(

...

)...

( ) ( )

(Si Oi Di

RPN

Si Oi Di

Si I

Oi i

Di i

i FMEA (i=1~k)

(RPN)

RPN 1 1000

( ) Severity S

(26)

2.7 2.7

10 9 8 7 6

/ 5

4 3 2 1

( ) (Occurrence O)

2.8 2.8

1/2 1/3

10 9 1/8

1/20

8 7 1/80

1/400 1/2000

6 5 4 1/15000

1/150000

3 2

1/1500000 1

( ) (Detection D)

(27)

2.9 2.9

10 9 8 7 6 5 4 3 2 1

MIL-STD-1629A 23 (CA)

Cr Cr

Cr Failure Mode Criticality Number, Cm

) 5 . 2 ....(

...

) (

1 i n

i m

r C

C

n Cm = p t Cm

(Failure Effect Probability)

(28)

(Failure Mode Ratio)

p (Part Failure Rate)

t

2.2

2.2 2.1.4 FMEA

FMEA

FMEA FMEA FMEA

5 17 24 33

FMEA FMEA

FMEA

(29)

FMEA FMEA

17

FMEA

( ) ( ) ( ) ( ) ( )

FMEA

FMEA 2.10 FMEA

(30)

2.10 FMEA

(s) /

(o) (D) (RPN)

(S) (o) (D) (RPN)

Stamatis 24 ( ) ( )

( ) ( ) ( ) ( )

FMEA

(31)

FMEA FMEA

2.2 Teorija Rezhenija Izobretate Zadach TRIZ

2.2.1 TRIZ

”Teorija Rezhenija Izobretate Zadach”

15 31 TRIZ

Genrish.Altshuller 1946

14 50

2.11

(32)

2.11 (Levels of innovation) Levels of

innovation description and technology requirement %

1 Apparent or Conventional Solution: Solution by methods

well known within specialty 32%

2 Small Invention inside Paradigm : Improvement of an existing system, usually with some compromise 45%

3 Substantial Invention Inside Technology : Essential

improvement of existing system 18%

4 Invention Outside Technology : New generation of design

using science not technology 4%

5 Discovery : Major discovery and new science 1%

34 1

2

3

4

5

5 1~4

Altshuller 3 22 34

(33)

Altshuller

2.3 TRIZ

TRIZ

(Scientific Effects)

(Rules of Evolution)

(Scientific Effects)

(Substance Field Resources)

(Substance Field Analysis Modeling) (Contradiction Matrix )

(Contradiction)

40

(40 Inventive Principles)

2.3 TRIZ

16 TRIZ

20 TRIZ

TRIZ

” ” ” ”

(34)

2.2.2 TRIZ

TRIZ ( 2.4)

TRIZ (TRIZ general problem) TRIZ (

- ) TRIZ (TRIZ

general solution)

TRIZ GENERAL PROBLEM

TRIZ GENERAL SOLUTION

YOUR SPECIFIC PROBLEM

YOUR SPECIFIC SOLUTION

2.4 TRIZ

23

Altshuller TRIZ

TRIZ TRIZ : (Contradiction

Matrix) (Ideal Deisgn) - (Substance-Field) 76

(76 Standards) TRIZ (Algorithm of Inventive Problem

Solving, ARIZ) 8 22

(Contradiction Matrix)

Altschuller

39 ( 2.12) 39

(35)

A

2.12 39

1. 21.

2. 22.

3. 23.

4. 24.

5. 25.

6. 26.

7. 27.

8. 28.

9. 29.

10. 30.

11. / 31.

12. 32.

13. 33.

14. 34.

15. 35.

16. 36.

17. 37.

18. 38.

19. 39.

20.

39

×

39 1263

39

40 ( 2.13) B

C 2.5

(36)

2.13 40

1. 21.

2. 22.

3. 23.

4. 24.

5. 25.

6. 26.

7. 27.

8. 28.

9. 29.

10. 30.

11. ( ) 31.

12. 32.

13. 33.

14. 34.

15. 35.

16. 36.

17. 37.

18. 38.

19. 39.

20. 40.

1 ………. 13 ……..

……..

1

2.5

….. ---

14 13 17 35

….. ……..

13.

17.

35

(37)

(Ideal Deisgn)

2.6

(2.6)

TRIZ

( ) Exclude Auxiliary Functions

( ) Exclude Elements

( ) Identify Self-service

( ) Replace element parts or total

system

(38)

( ) Change the principle of operation

( ) Utilize resource

- (Substance-Field)

TRIZ -

-

- (Substance and Field Theory) Su-Field

(Field)

( S2) (

S1) (Energy)

(Mechanical) (Thermal) (Chemical) (Electrical)

(Magnetic) (Gravitational)

(Desired Effect) (Harmful Effect) 2.6

(39)

F

S2 S1

Relationships

Connection (normal) Directed action Inaction(silence) Deficiency action

Harmful action ~~~~~~~

Break of connection Transformation Interaction Various action

2.6

28

-

TRIZ (ARIZ)

-

Altshuller 76

13 23

6

(40)

17 17

TRIZ (Algorithm of Inventive Problem Solving, ARIZ) ARIZ The Algorithm for Inventive Problem Solving TRIZ

ARIZ

ARIZ ( ) ( ) ( )

ARIZ

(41)

2.2.3 TRIZ

TRIZ 8 2.14

2.14 TRIZ

*

* a.

b c.

*

* TRIZ

(42)

TRIZ FMEA

FMEA TRIZ

”T-FMEA”

3.1 T-FMEA

FMEA

” ”

FMEA

”T-FMEA” TRIZ

TRIZ”39 39 ” 40

FMEA

3.1 T-FMEA FMEA

TRIZ ”T-FMEA” 3.1 A

B

3.1 A FMEA

(RPN) (S) (O) (D)

(RPN) (S)

(O) (D)

TRIZ TRIZ

TRIZ

(43)

TRIZ TRIZ

RPN

(S) (O) (D) RPN

FMEA

TRIZ TRIZ 40

RPN TRIZ

3.1 T-FMEA FMEA

A

C

D

B

E

F

NO

YES

(44)

3.1 “RPN

FMEA (S) (O) (D)

RPN RPN

(S) (O) (D) RPN

3.2 T-FMEA

3.1 ”T-FMEA ”

”T-FMEA”

TRIZ FMEA

3.1

( ) 3.1 (RPN) 1.

2.

3.

4.

5.

6. RPN (S) (O) (D)

(RPN)

(45)

( ) 3.1 1.

2. RPN RPN (QCC)

(S)

(O) (D) (RPN)

TRIZ FMEA

3.1

( ) 3.1 TRIZ

1. : TRIZ

2. : TRIZ

3.

(S) (O) (D)

(RPN)

4. 39 39

( ) 3.1 TRIZ

1.

2.

(46)

3. RPN (S) (O) (D) RPN

3.1 T-FMEA

S O (RPN) D

RPN

S O D

RPN

S O D

RPN TRIZ

E

S O D F

RPN

(47)

4.1 TFT-LCD

TFT-LCD

Cathode Tube, CRT TFT-LCD

21

4.1.1 TFT-LCD

liquid crystal displayer, LCD TFT LCD

TN/STN LCD TFT-LCD

TN/STN LCD

PDA 4.1

4.1 LCD

(48)

TFT-LCD TV PC

TFT-LCD

TFT-LCD 1993 Toshiba

8"SVGA TFT-LCD Apple PowerBook 180

TFT-LCD 1995 1997

1998 TFT-LCD

2000

(1100x1250mm) LCD TV

(Cross Industries Alliance)

4.1.2 TFT

2003 2004 TFT LCD

43% ( 26% 25%

6%)

TFT LCD "

"

TFT LCD

( PDA) ( LCD TV)

(1) <12"

(49)

PDA LTPS

(2) (>12") Samsung LG-Philips

Notebook PC

Notebook OEM LCD Monitor

TFT LCD 85%

97

"Life Style"

Entertainment LCD TV

Sharp LCD TV

TFT

TFT LCD

Value Chain

" "

Sony Samsung LCD TV

(

(50)

)

4.2

9 (Liquid Crystal Display

Modules)

/ LCD

Turnkey service( )

COB (chip-on-board) chip-on-film COG (chip-on-glass) TAB(Tape Automated Bonding)

ISO9001 QS-9000

( ) …

4.3 TFT-LCD

TFT-LCD

Cleaning Polyimide PI Rubbing

Cell Assembly LC Injection

End Seal Polarizer Attachment Inspection

TFT-LCD TFT

TFT

(Seal) 5.10 m (Spacer)

Cell Cell

(51)

TFT-LCD

4.4 T-FMEA COG

4.4.1 COG

IC LCM

TFT 4.42

module LCD IC

TAB Tape Automated Bonding COG Chip

on Glass COG (ITO )

TAB

LCD

IC (Chip on Glass COG)

(PC Board Resoldering)

( …. )(Module Assembly)

(TFT-LCD)

4.2

Wire Bonding

TAB(Tape Automated Bonding) Flip Chip Flip Chip

LCD COG(Chip on Glass) IC

LCD ITO Flip Chip

MBB(Micro Bump Bonding)

(52)

SHORTING BAR

COG Bonding

ACF

4.3 TFT COG

Pre-light on

PCB RTV

Assembly

Aging

(53)

COG (flip chip)

COG(Chip on Glass) 4.3 COG

COG COG COG

IC Pad ITO

IC Pad ITO Bump

… 4.4.2

TFT-LCD

/

COG

4.4 4.5 LCD

(54)

4.4

4.5

(55)

COG IC Banding Line defect

4.6

COG IC Banding Line defect

Tray

1 Tray 3

(1)

(2) Tray

(3) Tray

2 1 LCD

3 2

(1) a.

b. HAPD

(2) a.

b.

4 1

(56)

4.6 COG IC Banding Line defect

Tray

Tray Tray

Tray Tray 4.7

PS PE PET PP PLA

TFT tray

PS(polystyrene)

1. ,

2.

3. (PVC)

4. -

(57)

5. -

Tray ISO

14001 TRAY

4.7 Tray LCD

LCD ” ”

LCD

LCD Tray

Tray

(S) (O) (D)

4.1 4.2 4.3

(58)

4.1

( )

( ) 10

( ) 9

100% 1

8 (<100%)

~1 7

(<100%)

6

100% 5

(<100%) 4 (<100%)

3 (<100%)

2 1

4.2

100 10

50 9

20 8

10 7

5 6

2 5

1 4

0.5 3

0.1 2

0.010 1

(59)

4.3

10 9 8

7 ( SPC)

6

100% GO/NO GO 5

( )

4

3 (

) 2

/ 1

A- B- C-

( ) TRIZ FMEA

Tray LCD Tray

Tray TRIZ FMEA

Tray COG

T-FMEA

(60)

4.4 COG T-FMEA

Bonding

IC LCD

Line Defect

(S) 8

LCD Tray

(O) 7

(D) 5

(RPN)

C (RPN) 280

Tray

S 8

O 3

D 5

D

RPN 120

a 14

b 25 33

S 8 8

O 7 5

D 5 5

RPN 280 200

TRIZ E

c 29,3,28,10 32,40,28,2

d 40

e Tray

S 8

O 2

D 5

B F

RPN f 80

T-FMEA FMEA 4.4 A

4.4 C Bonding IC LCD

IC LCD

Line

Defect 4.6

LCD Tray

(61)

4.1 4.2 4.3 (S)=8 (O)=7

(D)=5 (RPN)

RPN=8 7 5= 280

LCD Tray RPN

280 RPN Tray

4.4 D know how

LCD Tray

Tray Tray

( ) Tray (PS)

( ) (PS)

” ”

Tray

7 3 (RPN)

RPN=8 3 5= 120

RPN 280 120

RPN

Tray

4.4 E

(62)

( ) ( )

TRIZ

a Tray TRIZ

14 b

TRIZ 25 33

a b FMEA

RPN

( ) “14” “25” RPN

RPN=8 7 5= 280

( ) “14” “33” RPN

RPN=8 5 5= 200 RPN

Tray

TRIZ

39*39 4.4 C

29 3 28 10

32 40 28 2

TRIZ

4-4 F 4-4 d

4-5

(63)

6

4.5

1 2 1

2 3 1

3 10 1

4 28 2

5 29 1

6 40 1

Tray LCD (GLASS SUBSTRAT E )

LCD

4%-7% LCD

LCD

LCD TN/STN LCD

TFT-LCD SiO₂ Al₂O₃ B^B₂O₃

BaO Tray

4.5 40

Tray

4-4 e Tray

F ” Tray ”

RPN RPN=8 2 5= 80

RPN 4.4 D 120

4.4 E RPN 280 200

120 4.8 4.9

(64)

4.8 ( )

4.9 ( )

(65)

TRIZ

(66)

5.1

FMEA

TRIZ FMEA

”T-FMEA”

”TRY”

39

5.2

FMEA RPN

RPN T-FMEA

(67)

T-FMEA

” ” ”

(68)

1. (2004) FMEA

2. (1988)

3. (2002) TRIZ

4. (1998)

5. (2003) FMEA FTA

6. (2003) ~

/

7. (2001) (FMEA)

8. (2000)

http://www.ccda.org.tw

9. (2005) 2005 5 10

10. (1997)

33 4 55-59

11. (1996)

12. (2000)

13. (1999)

14. (2000), TRIZ -TRIZ ,

15. (2003) TRIZ

16. (1999) TechOptimizer Version 1.5

17. (2000) TRIZ 538

68-73

18. (2001)

(69)

19. 1990 195-211

20. (2003)

21. (2003) -

22. Arend, J. S.(1989), Evaluating Process Safety in the Chemical Industry -A Manger’s Guide to Quantitative Risk Assessment, CMA ,Washington, D.C.

23. Altshuller, G.(2000), The Innovation Algorithm Triz, Systematic Innovation and Technical Creativity, Technical Innovation Center, Inc.,Worcester, MA.

24. Domb, E. (2003), Enhance Six Sigma Creativity with TRIZ, Quality Digest,April.

25. Ford Motor Company(1998), Potential Failure Mode and Effects Analysis, Instruction Manual .

26. Grant, W. (1998), Handbook of Reliability Engineering and Management, McGraw-Hill Inc.

27. Hwang, C. C.(1989), A Study on the Fuzzy Ranking and Its Application on the Decision Support Systems, Ph.D. Dissertation, Tamkang Univ. Taiwan, R.O.C.

28. IEC 812(1985), Analysis Techniques for System Reliability-Procedure for Failure Mode and Effects Analysis:FMEA.

29. Kinoshita, M. (2002), “DoCoMo’s Vision on Mobile Commerce”, Proceedings of the 2002 Symposium on Applications and the Internet (SAINT’02).

30. MIL-STD-1629A (1980), Military Standard Procedure for Performing a Failure Mode, Effects and Criticality Analysis, Department of Defense, Washington, DC.

31. Mattsson, F.(1995),An Introduction to Risk Analysis for Medical Devices, Compliance Engineering, 11/12, P47-57.

32. Rantanen, K., Domb,E. (2002) Simplified TRIZ new problem solving application for engineers and manufacturing professionals. CRC Press, New York.

33. Stamatis, D.H. (1995), Failure Mode and Effect Analysis FMEA from Theory to Execution, ASQC Quality Press Milwaukee, Wisconsin.

(70)

34. Teng, S. H. (1996),Failure Mode and Effects Analysis - An integrated Approach for Product Design and Process Control,International Journal of Quality Reliability Management, Vol.13, No.5, pp.8-26.

35. Terninko, J., Zusman, A. and Zlotin, B(1998), Systematic Innovation – An Introduction to TRIZ (Theory of inventive problem Solving), CRC Press LLC.

(71)

A

39

(Weioght of M) (Weioght of non-M) (Weioght of M) (Length of non-M) (Areat of M)

(Areat of non-M) (Volume of M)

(Volume of non-M) (Speed)

(Force)

/ (Tension/pressure) (Shape)

(Stability of object) (Strength)

(Durability of M) (Durability of non-M) (Temperature)

(Brightness)

(Energy spent by M) (Energy spent by non-M)

(Power)

(Waste of energy) (Waste of substance) (Loss of information) (Waste of time) (Amount of substance)

(72)

(Reliability)

(Accuracy of measurement)

(Accuracy of manufacture) (Harmful factors acting on object)

(Harmful side effect)

(Manufacturability)

(Convenience of use) (Repairability)

(Adaptability)

(Complexity of device) (Complexity of control) (Level of automation) (Productivity)

(73)

B

40

1.

a.

b.

c.

1.

2.

a.

b.

3.

a.

b.

c.

1.

2.

4.

a.

b.

1.

2.

5.

a.

b

6 1.

2.

7 a.

b.

1.

2.

3.

8.

a.

b.

1.

2.

9.

a.

b.

1.

2.

10.

a.

b.

1.

2.

11. ( )

(74)

12.

13.

a.

b.

c.

14 a.

b.

c.

15.

a.

b.

c.

16.

17.

a b.

c.

18.

a.

b.

c.

d. piezo

e.

19.

a.

b.

c.

20.

a.

b.

21.

22.

a.

b.

c.

1.

2.

(75)

23.

a.

b.

24.

a.

b.

25.

a.

b.

1.

2.

26.

a.

b.

c.

27.

28.

a.

b.

c.

(1). (2). (3). d.

29.

, 30.

a.

b.

31.

a.

b.

32.

a.

b.

c.

d.

33.

34.

a.

1.

2.

(76)

b.

35.

36.

37.

a.

b.

38.

a.

b.

c.

d.

39.

a.

b.

40.

(77)

C

39 39

(78)

(79)

(80)

(81)

(82)

(83)

(84)