國立台灣師範大學機電科技學系

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台灣師範大學機電科技學系 C. R. Yang, NTNU IMT

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楊啟榮博士

教授

國立台灣師範大學機電科技學系

Department of Mechatronic Technology National Taiwan Normal University

Tel: 02-7734-3506 E-mail:ycr@ntnu.edu.tw

非非矽基微加工製程與應用技術矽基微加工製程與應用技術

Non-Si-Based Micromachining Technology and its Applications in Microsystem Field

-2-

綱綱要要

z LIGA與LIGA-Like製程與應用技術

z SIGA製程與應用技術

z 軟式微影製程與應用技術

z 非矽基微光學元件製作技術

-3-

LIGA與 LIGA 與LIGA LIGA- -Like Like製程與應用技術製程與應用技術

-4-

LIGA技術 X-ray深光刻術

LIGA-like 技術

紫外光厚膜光阻微影準分子雷射微加工感應耦合電漿離子蝕刻

*

電子束光刻術

切削加工微切削加工、微鑽孔加工、微銑削加工、微輪磨加工非切削加工微電鍍成形、微壓模成形、微射出成形、微沖壓成形特殊加工微放電加工、雷射微加工、離子束微加工、電子束微加工、

超音波微加工、原子力顯微加工術高分子微加工

技術

微雷射光合高分子成形(Microstereolithography, μ-SL) 軟式微影技術(Soft Lithography)

微接觸印刷術(Microcontact Printing, μ-CP) Micromolding in Capillaries (MIMIC) Microtransfer Molding (μ-TM) Replica Molding (REM) 其他低溫製程技

術與材料

聚對二甲苯(Parylene)、明膠(Gelatin)蛋白質、鐵氟龍(Teflon)、矽膠(Silicone) 微機械加工

精密電鑄技術 y純金屬電鑄 y合金電鑄

微成形技術 y 塑膠微結構成形熱壓成形、射出成形輪壓成形、紫外線硬化法 y陶瓷微結構成形粉末射出成形、帶板鑄造

非矽基微加工

MEMS領域中微製造技術分類表 MEMS 領域中微製造技術分類表

註：感應耦合電漿離子蝕刻技術通常歸類為非等向性高深寬比矽基蝕刻技術。

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2. 顯影

4. 金屬模仁

6. 脫模

Mould cavity Resist structure

Plastic structure

5.模造 3. 電鑄 1. 光刻

Plastic (moulding compound)

Metal Resist structure

Electrical conductive base plate Base plate Absorber structure Maskmembrane

Resist

Source: Institut für Mikrotechnik Mainz (IMM), Germany

Li thographie:

光刻

G alvanoformung:

電鑄

A bformung:

模造

LIGA製程： LIGA 製程：

高深寬比高深寬比( (high aspect high aspect ratio)

ratio)的微結構的微結構

MCNC

-6-

LIGA LIGA技術的起源與發展技術的起源與發展

LIG技術：

z1975年, Romankiw等人(IBM)結合X-ray 曝光及電鍍技術, 製作厚度20μm之高

深寬比金屬結構

LIGA技術：

z1982年, 由德國W. Ehrfeld等人在Karlsruche Nuclear Research Center (KernForschungszentrum Karlsruhe, KfK)所發展

目前技術發展地點：

Forschungszentrum Karlsruhe (FZK), Institut für Mikrostrukturtechnik (IMT) z

最初目的：為了製作高深寬比的核能原料分離元件

美國Wisconsin大學之Guckel教授, 將LIGA技術與半導體製程結合, 使LIGA接近 標準的製造技術

-7- medium

fraction light fraction

heavy fraction

U

²³⁵

heavy substance

light substance

medium substance Separation stage

UF

₆

+H

₂

supply

compressor dual separation nozzle

Principle of separation nozzle fabricated by FZK, Germany U

²³⁵

Source: M. Madou, Fundamentals of Microfabrication, CRC, New York, 1997

Source: 中島尚正, 梅田章, LIGA PROCESS, 日刊工業新聞社, 1998 (In Japanese)

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LIGA製程技術

微電鑄技術

複合製程技術微成型技術

Deep lithography

電鍍液配方

合金微電鍍技術陶瓷複合

電鍍技術純金屬電鍍技術

光罩製造技術光阻塗佈技術

Alignment技術

光阻材料技術

反應性微射出成型

塑膠微射出成型陶瓷微射出成型微陶瓷結構燒結技術熱壓微成型

陶瓷精密脫蠟技術

Bonding技術

製程設計技術 Alignment技術

LIGA LIGA製程技術的技術關聯圖製程技術的技術關聯圖

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犧牲層犧牲層LIGA (S LIGA (S- -LIGA) LIGA)技術的應用範圍技術的應用範圍

z

微感測器的懸浮結構

z

可控制流量進出的微閥門

z

各型微致動器的移動或轉動結構等…...

Micromotor Micropump

Acceleration microsensor

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Key Features of X

Key Features of X- -ray LIGA Microstructures ray LIGA Microstructures

z

Realization of arbitrary shape

z

Extreme structure height (>mm)

z

Extreme aspect ratio (>100)

z

Minimum lateral dimensions 0.5±0.1μm

z

Surface roughness 0.03-0.05 μm

z

Vertical & smooth sidewalls

z

Wide variety of materials

z

Successful in mass fabrication

IMT and IMM, Germany

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( a ) 微齒輪組 ( b ) 微鏡片 ( c ) 整合光學分光器 ( d ) 近場光學探針 ( e ) 微熱交換器

( f ) 微組合 ( h ) 微幫浦 ( g ) 微反應器 ( i ) 光纖固定器 ( j ) 微馬達

( k ) 光纖開關 (l) 微小直升機 IMM微系統研究中心

IMM IMM微系統研究中心所開發的產品微系統研究中心所開發的產品

Source: http://www.imm-mainz.de

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IMT微系統研究中心所開發的產品 IMT 微系統研究中心所開發的產品

Source: http://www.fzk.de/imt/eimt

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LIGA

LIGA 製程製程 vs. 類 vs. 類 LIGA 製程 LIGA 製程

光刻源的差異 LIGA 製程：同步輻射X光

類LIGA 製程：低成本替代性光源

z加工深度數mm、次微米級精度、深寬比＞100

z同步輻射光源為一龐大且昂貴的設備

z

X-ray 光罩製作複雜且成本高

z加工深度≦ 1mm、微米級精度、深寬比≦50

z紫外光–厚膜光阻微影製程

z準分子雷射

z反應性離子蝕刻

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Synchrotron Radiation Research Center (for LIGA process) Synchrotron Radiation Research Center (for LIGA process)

JAPAN SPring-8

USA APS FRANCE ESRF

ICP-RIE System Excimer Laser System UV mask aligner

Low- Low -cost Exposure System (for LIGA cost Exposure System (for LIGA- -like process) like process)

Instrument Technology Research Center, ITRC

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Source: http://daytona.ca.sandia.gov/LIGA/mask.html ( Sandia National Laboratory, USA )

Photomask

Photomask of UV Lithography of UV Lithography

(a) CAD Layout (b) Chrome Mask

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Comparison of a low energy x-ray mask (left) and a high energy x-ray mask (right) both designed and created at Wisconsin.

4μm Gold on a 1μm SiN membrane

50μm Gold on a 400μm Si substrate

Photomask

Photomask of X of X- -ray Lithography ray Lithography

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具厚膜光阻及電鑄起始層的試片製備方法具厚膜光阻及電鑄起始層的試片製備方法

Substrate with seed layer Special Special Photoresist Photoresist

Spin coater

Vacuum Spin coating process

Dry film

Substrate with seed layer

Laminating process

Glass plate Substrate with seed layer

Pressing machine

Solvent bonding process Solvent layer Solvent layer Polymer film Polymer film

Spacer

Polymerized resist Polymerized resist

Casting machine

Casting process Glass plate Substrate with seed layer

Pretreatment glass plate Separation foil

Polymer film Polymer film Separation foil

-18- (1) 塗佈光阻

聚合物基材

(2) 光蝕刻

雷射光

電鑄起始層

(3) 金屬濺鍍

金屬

(4) 電鑄

金屬模

聚合物 (5) 研磨修整

(6) 剝離

(7) 熱壓印成形

(8) 脫模

substrate seed layer photoresist nickel

光學元件之LIGA製程示意圖

母模幾何形狀與電鑄起始層位置對電鑄沈積層的影響示意圖

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Schematic of a X-ray mask/substrate scanner Source: http://daytona.ca.sandia.gov/LIGA/mask3.html

X-Ray Scanner DEX 02

JENOPTIK Mikrotechnik GmbH

X X- -ray Deep Lithography Scanner ray Deep Lithography Scanner

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(c) LIGA microstructure with inclined sidewalls

Fabrication of microstructure with inclined sidewalls

Source: P. Bley, Interdisciplinary Science Reviews, 18(3) (1993) 267-272

(b) development (a) SR exposure

SR

mask resist

substrate

resist structure

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Fabrication of

Fabrication of nonplanar nonplanar microstructure microstructure

X-ray lathe

Microstructure on the cylindrical substrate

helical structure mask

SR

blank substrate

mask

SR

mask

SR

Source: A. D. Feinerman et al., J. Microelectromechanical Systems, 5(4) (1996) 250-225

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Fabrication Techniques of Novel Microstructures Fabrication Techniques of Novel Microstructures

using

using Excimer Excimer Laser Ablation Laser Ablation

以不同雷射，加工 Polyimide 的結果比較：

(a) Nd-YAG laser, (b) CO

₂

laser, (c) Excimer laser

F

₂

(157 nm)、ArF (193 nm)、KrF (248 nm)、

XeCl (308 nm)、XeF (351nm)

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準分子雷射的光分解挖除

準分子雷射的光分解挖除( (photoablation photoablation) ) 加工機制示意圖

加工機制示意圖

Excimer laser beam incident on surface

Ablated material ejected at high speed

Pulsed lasers = low thermal damage

1.

倍頻Nd: YAG雷射(基礎1.06 μm (NIR)、二倍頻0.53μm (Vis)、四倍頻0.26μm(UV))

2. UV準分子雷射：F

₂

(157 nm), ArF (193 nm), KrF (248 nm), XeCl (308 nm), XeF (351nm) z The short-duration UV excimer laser pulse (≈10-30 ns) rapidly breaks chemical bonds

in a polymer within a restricted volume to cause a mini-explosion that ejects material and carries excess energy away from machining site.

z Excimer laser micromachining is often classified as a non-thermal process.

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準分子雷射加工高分子材料

準分子雷射加工高分子材料蘇聯氫彈試爆蘇聯氫彈試爆( (一九五三年八月一九五三年八月) )

Source: E. Harvey, Microsystems technology, Short Course Text at Imperial College (UK), (1997)

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Optimum laser Materials

XeCl

308 nm KrF

248 nm ArF

193 nm F₂

157 nm Polymer PEEK, PEI, PET, PI PA, PES, PC, PUR,

PPS, Polyparaxylylene

Polyacetylene, PE, PMMA, PS, PVC, PVDC,

PVOH, PVDF, Silicone rubber, Nitrocellulose

PTFE (Teflon)

Composites of fibers in epoxy

Glass fiber, Carbon fiber, Aramid Ceramics Alumina, LiTaO₃,

SiC, Si₃N₄, ZrO₂

Si₃N₄(gas pressure sintered or reaction bonded), PZT

SiC (toughened)

Crystals and glasses

Fused silica, SiO₂, Silicon, Borosilicate glass, Yttrium aluminium garnet (YGA)

GaAs, quartz, fused silica, sapphire, silicon

Metal film Aluminium, Copper

Biological tissue

Artery wall, Bile duct, Carcinoma tumour, Prostate

tissue

Cornea

Teeth Enamel, Dentine

Optimum

Optimum Excimer Excimer Laser for Various Materials Laser for Various Materials

R. C. Crafer and P. J. Oakley, Laser processing in manufacturing, Chapman & Hall, New York, 1993

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http://www.exitech.co.uk/

-27-

Excimer

Excimer Laser Micromachining Laser Micromachining

Laser LIGA technology Laser LIGA technology

Fresnel structure ablated into dry film with 50 μm thick

Nickel electroplated metallic microstructure

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以控制工件平台運動狀態之方式進行雷射加工

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Excimer

Excimer Laser Laser Micromachining: Mask Dragging Micromachining: Mask Dragging

以光罩拖拉（移動工件平台）技巧進行雷射加工的方式

shaped mask

可快速製作不同幾何斷面之微流道

-30- A B C D E F

A: Fresnel 波帶片 B: 平面化二元式Fresnel微透鏡

C: 兩階二元式Fresnel微透鏡 D: 四階二元式Fresnel微透鏡

E: 鋸齒狀Fresnel微透鏡 F: 傳統透鏡

不同之Fresnel 不同之 Fresnel透鏡與傳統透鏡之比較圖透鏡與傳統透鏡之比較圖

-31- Mask

Crystal Substrate

RIE Crystal

Substrate HMDS

Coating Lithography

Crystal Substrate PR

Coating PR

Crystal Substrate

Crystal Substrate Two-Step Microlens HMDS & PR

Coating

RIE

Lithography

four-Step Microlens

微透鏡之半導體製作流程示意圖微透鏡之半導體製作流程示意圖

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SU-8光阻微透鏡陣列

光強度分布圖

氦氖雷射 CCD

物鏡

物鏡折射式微透鏡

陣列針孔

透鏡光圈

三維移動平台

光束品質分析器

光學檢測設備架構圖

準分子雷射應用於微透鏡陣列之製作技術準分子雷射應用於微透鏡陣列之製作技術

光罩圖案示意圖

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-33-

Mask

Workpiece Stage

Fresnel Lens

以

以Mask Dragging Mask Dragging 的方式製作微鏡片的方式製作微鏡片

(b) Groove pattern of the kinoform cylindrical lens (a) Mask used to make cylinderical lens

Dark: 透光 Clear:不透光

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背光模組光反射元件的製作背光模組光反射元件的製作

-35-

http://www.exitech.co.uk/

-36-

準分子雷射單光罩多層階加工技術準分子雷射單光罩多層階加工技術

光罩圖案

雷射聚焦成像

加工圖案重疊

（光罩移動）

（工件固定）

光罩圖案

1 2

3 2 1

2 3

3 3

3

八階光罩組合

準分子雷射微透鏡加工技術

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準分子雷射微加工準分子雷射微加工

微光學繞射元件製作與檢測

微光學元件檢測系統

像素5 μm四階全像片 “HELLO” 影像輸出 焦平面光強度十六階微透鏡陣列

孔徑250 μm、焦距15 mm

表面檢測光學檢測 準分子雷射LIGA製程

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Applications of Ultrathick Photoresist for Microstructure Fabrication

光罩對準UV曝光系統特殊光阻塗佈機

●

Low-Cost LIGA製程的發展因素：

(Poor-Man LIGA Technology)

z厚膜光阻材料的開發

z特殊光阻塗佈機的發展

z

UV曝光設備的改良

●

厚膜光阻材料

AZ4000 series,

Hoechst (Germany)

ma-P 100, ma-N 400,

Micro resist technology (Germany)

PMER P-LA 900,

tok (Japan)

Probimide,

Olin microelectronic materials (Japan)

THB-611P, THB-430N,

JSR (Japan)

SU-8,

Microlithography chemical corporation (USA)

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SU- SU -8 8厚膜光阻厚膜光阻UV UV- -LIGA LIGA製程製程

光阻微結構 vs. 螞蟻

國科會精密儀器發展中心 (PIDC)

電鑄鎳金屬結構

-40-

SU- SU -8 Microstructures to be filled by electroforming 8 Microstructures to be filled by electroforming

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-41-

SU

SU- -8 Structure filled by electroforming with Ni 8 Structure filled by electroforming with Ni- -Fe alloy Fe alloy

-42-

Preparing

Preparing Photoresist Photoresist Reflow Lens Pattern Reflow Lens Pattern

H. Toshiyoshi

-43-

Lens Shape (Sag) After

Lens Shape (Sag) After Photoresist Photoresist Reflow Reflow as a function of initial resist thickness as a function of initial resist thickness

H. Toshiyoshi

( )

^1/3

-44-

Transferring

Transferring Photoresist Photoresist Pattern into Silicon Pattern into Silicon

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-45- (b) 曝光顯影

(c) 鍍Cr/Au

(d) Lift-off

(e) 正光阻 (犧牲層)

(f) 曝光顯影

(g) 鍍Ti/Cu

(i) 曝光顯影

(j) 電鑄Ni (h) 負光阻

(k) 去除光阻結構釋放 (a) 上正光阻

犧牲層厚膜光阻製程技術犧牲層厚膜光阻製程技術

-46-

厚膜光阻與犧牲層技術於微元件的開發應用厚膜光阻與犧牲層技術於微元件的開發應用

( a ) 微繼電器 ( b ) ( a )圖之局部放大圖

( c ) 微致動器 ( d ) ( c )圖之局部放大圖

-47-

Movable Microstructure fabricated by Single Mask Movable Microstructure fabricated by Single Mask

Lithography & Dry Releasing Techniques Lithography & Dry Releasing Techniques

Micro-relay fabrication process

(a) SU-8 resist lithography

(b) Dry etching

(c) Metal Sputtered

Micro-relay, PIDC

-48-

0 30 60 90 120

1 2 3

V olta ge

數列1

側位移量側位移量25 25μ μm m不同彈簧結構下所需驅動電壓不同彈簧結構下所需驅動電壓

Micro-relay, PIDC

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-49-

Application of ICP RIE

Application of ICP RIE- -LIGA Process LIGA Process

Fabrication of Silicon Fuel Fabrication of Silicon Fuel Atomiser Atomiser

Si mold

Ni atomizer

1. Grow oxide and pattern

2. Spin on thick resist and pattern

3. First 275 μm deep DRIE etch

4. Remove oxide and second DRIE etch for an additional 125 μm

6. Polish excess and release 5. Deposit 400 μm of Ni

N. Rajan et al., J. Microelectromechanical Systems, 8(3), 251(1999)

Fabrication of Silicon Fuel Fabrication of Silicon Fuel Atomiser Atomiser

-50-

Principle of an Electroforming Technology Principle of an Electroforming Technology

PMMA微齒輪 鎳金屬微齒輪

微系統LIGA製程之精密電鑄技術, 科儀新知, 21(6), 15-27, 2000

-51-

E-beam mask

Intermediate mask

Working mask

Resist structure

Mold insert

Lots of Plastic/ceramic

products

Electro- forming

Plastic molding

Au

Metal

products

Lots of Metal products

Cu, Au Ni, Ni-Fe

Ni, Ni-Fe Ni-Co, Ni-W Alloys, Composites

Cu, Au, Ni, Ni-Fe, Ni-Co, Ni-W, Alloys, Composites

Electro-

forming

Lithography, Development

Electro-

forming Electro-

forming

Illustration of electroforming role within LIGA process

●

X-ray mask

●

Metallic microstructures

●

Mold insert

-52-

Ni Metal microstructures, mold inserts Au Absorber material for X-ray mask

Material for intermediate layers

Cu Microstructures, Material for intermediate layers Ni-Fe High magnetic and corrosion resistance property

Invar (64% Fe: 36% Ni) — low thermal expansion property Thermal coefficient of expansion (TCE):

Ni:13.4×10

^-6

/K Cu: 16.5×10

^-6

/K Silicon: 2.6×10

^-6

/K Invar: 2.0×10

^-6

/K Permalloy (21% Fe: 79% Ni) — high magnetic property

Saturation magnetization:

Nickel:6K Gauss Permalloy: 10K Gauss

Ni-Co High strength property for punch mold Ni-Mn High hardness property for punch mold

Ni-W High temperature resistance property

Characteristics and Application of Electroformed Metals

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-53-

Schematic of an electrochemical cell

Power supply

Cathode Anode

e

^-

e

^-

Ni → Ni

²⁺

→ Ni 2e

^-

2e

^-

2H

₂

O + 2e

^-

→ H

₂

+ 2OH

^-

↑

H₂ ↑

H₂

↑ H₂

Ni deposition H

₂

evolution Ni dissolution

-54-

Electrolyte Laminar flow

Microstructured polymer layer

Conducting substrate as cathode

mass transport mainly by convection mass transport mainly by diffusion

Mechanisms of mass transport to recessed microelectrodes of different lateral dimensions during electroforming

-55-

高分子微結構製作試片前處理參數控制

高分子層與電鑄基板結合 RIE 去除 純水清洗電流密度陰極擺動速率電鑄種子層長成殘餘光阻酸洗活化表面張力鍍液組成

結構分布均勻脫脂銀鏡反應遮板使用陰陽極效率結構尺寸一致無電鍍離型劑使用輔助電極電流波形

時間、溫度 pH 值

電鑄技術影響參數

流場設計攪拌方式金屬濃度複合電鑄濃度成份比例溫度控制循環過濾合金電鑄濃度雜質分析與過濾機械性質

陰極擺動電極設計安定劑活性碳處理物理性質

液位控制藥液自動光澤劑、硼酸弱電解處理表面特性電流供應分析添加平坦劑、溼潤劑應力降低劑複製精確度

電鑄槽設計鍍液成份管理電鑄品檢測分析

LIGA製程之電鑄品質影響參數與條件 LIGA 製程之電鑄品質影響參數與條件

DC, pulsed, periodic reverse current

-56- (1) 塗佈光阻

聚合物基材

(2) 光蝕刻

雷射光

電鑄起始層

(3) 金屬濺鍍

金屬

(4) 電鑄

金屬模

聚合物 (5) 研磨修整

(6) 剝離

(7) 熱壓印成形

(8) 脫模

substrate seed layer photoresist nickel

光學元件之LIGA製程示意圖

母模幾何形狀與電鑄起始層位置對電鑄沈積層的影響示意圖

(15)

-57-

氣泡所造成的缺陷後處理所造成的缺陷

一般常見之電鑄缺陷與解決之道一般常見之電鑄缺陷與解決之道

內應力導致電鑄層嚴重變形內應力已獲得控制之鑄層

-58- 電源

供應器

陽極遮蔽

陰極

電源供應器

電流密度分布

( a ) ( b )

(a) (a) 陰陽極間電流密度分布；

陰陽極間電流密度分布；(b)

(b) 遮蔽使陰極表面電流密度均勻化示意圖

遮蔽使陰極表面電流密度均勻化示意圖

電鑄層厚度控制方法

電鑄層厚度控制方法- -增加遮蔽層增加遮蔽層

-59-

電鑄層厚度控制方法

電鑄層厚度控制方法- -外圍虛電鑄區外圍虛電鑄區

無增加虛電鑄區

增加虛電鑄區

-60-

電流密度分布

電流密度分布對薄光阻結構電鑄厚度影響示意圖電流密度分布對薄光阻結構電鑄厚度影響示意圖

電鑄金屬電鑄起始層

光阻

(16)

-61-

a

電流密度分布

a/b=1/4

a/b=6/1 b

電鑄金屬電鑄起始層

光阻

overplating

Plating stopped at ~2/3 of the total depth

不同深寬比對電鑄輪廓曲線影響示意圖

-62-

電鑄金屬電鑄起始層光阻

避免鑄層沈積厚度差異過大之製程示意

避免鑄層沈積厚度差異過大之製程示意 (a) (a) 改良前；改良前；(b) (b) 改良後改良後

( a ) ( b )

-63-

精密電鑄技術精密電鑄技術

金屬模仁製作 精密電鑄設備, NTNU MOEMS Lab.

微齒輪

鎳電鑄結構高分子光刻圖案

Fresnel圖案 (深寬比25)

四階全像片 像素5 μm

z光學元件：線寬≦1 μm 、深寬比3 z高深寬比微結構：線寬10 μm、深寬比25 技術

能量

-64-

光電業導線架

微過濾器微閥

微感測器微致動器

CD DVD 民生工業

票券印製珠寶飾品信用卡識別證特殊網罩

機械工業微機械零件

精密模具精密儀器

耐磨零件伸縮囊管

通訊工業

導波管光纖耦合器

非球面反射鏡抬頭顯示器全像片光學鏡片

半導體工業

精密電鑄技術

精密電鑄技術的應用領域精密電鑄技術的應用領域

(資料來源：中科院)

(17)

-65-

塑膠微模造成型技術塑膠微模造成型技術

z 熱印壓模法 (Hot embossing) z 微射出成型 (Injection molding)

反應式射出成型技術 (Reactive Injection Molding, RIM)

熱鑄式射出成型技術 (Thermal Injection Molding, TIM) 大量批次(batch)生產、降低成本、滿足工業市場需求

-66-

反應式射出成型示意圖

z

鑄材成份在射出前才混合

z

常用於熱固型樹脂

z

成份必須以精準重量比例混合

z

低黏度液體以低壓(約10bar)射入模仁內

缺點：

z必須使用真空模去除氣泡

z高分子聚合反應性強，具爆炸性

z模內壁之平滑要求高，否則脫模困難

-67-

熱鑄式射出成型示意圖

z

鑄材加熱後才射入模仁內

z

適用材料範圍廣：

熱塑性塑料

熱固性樹脂

橡膠

熱鑄射出成型之步驟：

1. 加熱塑化 2. 高壓射出注模 3. 冷卻脫模

-68-

Principle of Hot Embossing Process

Heating and cooling for temperature control

(18)

-69-

Design

CNC-μMachining

μEDM

Si-processes Wet etch Dry etch DEEMO

High resolution techniques LIGA LIGA-like

Vacuum heating of substrate and tool

above Tg

Contact force typ.

several kN

Cooling of tool and substrate

below Tg

Demolding

Bonding of cover lid Mold insert fabrication

Embossing process

Hot Embossing Process Schematics Hot Embossing Process Schematics

Quality control Trimming

DEEMO: Dry Etching, Electroplating, Moulding

-70-

IR- IR -Spectrometer Spectrometer produced by injection molding produced by injection molding

Self-focusing blazed reflective grating

•

spectral range: 3.0 μm - 4.3 μm

•

dispersion: 0.23 μm/mm

•

spectral resolution: 0.07 μm

Cover plate coated with gold

Linear focal line ready to attach to detector array

mirror Gold coating

Molded polymer substrate

Entrance (free-space optics or fiber optics)

-71-

Hollow waveguide

Gas Miniature tungsten lamp PbSe detector

Self focusing reflection grating

Gas microsensor with an integrated IR-spectrometer

Source: http://www.microparts.de/01OPTICIR.htm Characteristics

z

Economical in high volumes because of injection molding techniques

z

Compact and robust

z

No moving parts

z

High measuring stability through dual beam principle

-72-

Principle of the VIS

Principle of the VIS- -Spectrometer Spectrometer

Source: http://www.microparts.de/01OPTICVIS.htm Light input λ1….λx

through optical fiber

Light output via 45

^o

reflecting edge Diode

array

Self focusing reflection grating (d=0.2 μm, g=2 μ m)

λ2λ1

Characteristics

z

Molded construction allows for cost effective volume pricing

z

Small dimensions, lightweight

z

Excellent thermal stability

z

Long-term stability

z

Flexible operation

z

Robust monolithic construction

z

No moving parts

(19)

-73-

LIGA技術的未來發展方向 LIGA 技術的未來發展方向

z

更高深寬比微結構的開發：曝光設備、高敏感光阻

z

3D微結構的開發：曲面、複雜微結構

z

複合製程的開發：整合IC製程與微機械加工、製程設計規劃

z

新合金材料電鑄技術的開發： ^{金屬基陶瓷複合材}

z

陶瓷材料成型及燒結技術的開發：壓電、磁致伸縮陶瓷

z

新型微系統產品的開發與應用

-74-

SIGA製程與應用技術 SIGA 製程與應用技術

-75- SiO₂

Si

Si (a) 熱氧化沉積SiO₂

(b) 微影及用BOE蝕刻SiO₂

(c) 以最佳蝕刻參數蝕刻

Si SiO₂ PR

SiO₂

Si

(d) 使用BOE去除SiO₂

Si Cr/Cu

(e) 蒸鍍電鑄起始層Cr/Cu

Si Cr/Cu

Ni

(f) 微鎳電鑄

(g) 脫模

In German: In English:

Silizum-mikrostrukyur Silicon-microstructuring Galvanoformum Electroforming

Abformung Molding

SIGA SI GA製程製程：：

-76-

矽模仁

二次電鑄鎳模仁

PMMA壓模成形

微結構充填不足

微結構收縮變形一次電鑄鎳模仁

(20)

-77-

Lenses

Gratings Waveguides Holograms

成形方法：

1. Lithography +RIE etching 2. Photoresist reflow

3. Direct writing of e-beam or laser 4. Shaped light beam method 5. Grey tone mask technique

Grey tone mask technique Shaped light beam method

Direct writing of e-beam

SIGA SIGA製程應用技術製程應用技術

-78-

Lens profile in resist on glass or silicon

Ion etching

Lens profile etched into glass or silicon

Ni stamper

glass UV-curable polymer

UV exposure

Ni stamper

Substrate

Polymer film

-79-

軟式微影製程與應用技術軟式微影製程與應用技術

-80-

Soft Lithography Soft Lithography

軟式微影製程主要是利用一種透明的彈性高分子聚合材料二甲基矽氧烷(polydimethylsiloxane, PDMS)，作為翻模用的彈性印章(stamp)，利用印章圖形轉移的方式，並搭配不同的後處理(如蝕刻、灌模等)，來完成各種不同的微結構。

製程尺寸的範圍從30 nm 到100 nm，應用的範圍包括光學導線、感測器、致動器、微型幫浦、生醫晶片、微流結構與奈米表面處理等。

SU-8 master structure PDMS replica of SU-8 master structure

Hong et al., Columbia University

(21)

-81- n=~60

n=~10

-82-

Advantage and Disadvantage of PDMS Advantage and Disadvantage of PDMS

z

z Advantage : Advantage :

(1) Favorable mechanical properties (1) Favorable mechanical properties

(such as extreme

(such as extreme flexibility and stability flexibility and stability) ) (2)

(2) Good optical properties Good optical properties (transparent) (transparent) (3) High biocompatibility

(3) High biocompatibility (4) Peel off the PDMS easily (4) Peel off the PDMS easily (5) Low costs

(5) Low costs

z

z Disadvantage : Disadvantage :

(1) Use soft lithography techniques to fabricate (1) Use soft lithography techniques to fabricate (2) The PDMS is poisoned easily.

(2) The PDMS is poisoned easily.

-83-

毛細管微成形

毛細管微成形( (micromolding micromolding in capillaries, MIMIC) in capillaries, MIMIC)

-84-

Schueller et al., Sensors and Actuators A72 (1999) 125–139

Preparation of a glassy carbon microstructure with a

triangular diffraction grating embossed on its surface

(22)

-85-

Schueller et al., Sensors and Actuators A72 (1999) 125–139

Preparation of a glassy carbon microstructure with a square diffraction grating surface relief

-86-

Variable

Variable- -focusing focusing microlens microlens with microfluidic with microfluidic chip chip

J. Chen et al., J. Micromech. Microeng. 14 (2004) 675–680

-87-

Microfluidic

Microfluidic Chip Fabrication Chip Fabrication

J. Chen et al., J. Micromech. Microeng. 14 (2004) 675–680

-88-

Polymer

Polymer- -based variable focal based variable focal length

length microlens microlens system system

M. Agarwal et al., J. Micromech. Microeng. 14 (2004) 1665–1673

(23)

-89-

Series of images taken at different volumes of fluid by actuating the variable focal length lens as: (a) DCX lens, (b) DCV lens

M. Agarwal et al., J.

Micromech. Microeng. 14 (2004) 1665–1673

-90-

Camou et al., University of Tokyo

On the left : classic experimental set-up to perform fluorescent spectroscopy with a microscope integrating the light source, filters and lenses and on the right : example of a lab-on-a-chip device with an integrated detection system.

-91-

Towards the on

Towards the on- -chip fluorescence spectroscopy using optical chip fluorescence spectroscopy using optical fibers and PDMS material

fibers and PDMS material

Camou et al., University of Tokyo

-92-

Main steps to fabricate a PDMS layer from SU-8 mold, with a design that integrates a 2-D optical lens

Camou et al., University of Tokyo

(24)

-93-

Effect of the PDMS lens on the fluorescent light emission from the dye

-94-

非矽基微光學元件製作技術非矽基微光學元件製作技術

-95-

Thermal impressing for the fabrication of microprism arrays

PMMA Oblique illumination

Beam splitters

Retroreflectors

Microprism

Microprism fabrication by the LIGA technique fabrication by the LIGA technique

Source: H. Peter Herzig, Micro-optics, Taylor & Francis (1997)

-96-

Planar integrated free

Planar integrated free- -space optics space optics

Optical pickup unit for data storage applications (Shiono and Ogawa)

(25)

-97-

Spherical lens

fiber fiber

Source: A. Müller et al., J. Micromech. Microeng., 3 (1993) 158-160

Single-mode fibres adjusted to a ball lens Schematic of a microoptical switch with

single-mode fibres

Movable mirror and fibre grooves mirror

LIGA Process for Optical Switch LIGA Process for Optical Switch

-98-

應用X 應用 X- -ray LIGA ray LIGA製程開發之光學陣列開關製程開發之光學陣列開關

J. Mohr, A. Last, and U. Wallrabe, 8th Microoptics Conference, Osaka, Japan, (2001).

-99-

微型流式細胞

微型流式細胞/ /顆粒計數與分類感測器顆粒計數與分類感測器之研發及其應用

之研發及其應用

李國賓等人, 科儀新知第24卷第4期, 92年, 15-24

-100-

微流體細胞計數器微流體細胞計數器

z樣品由中間管道注入 z兩側則注入邊鞘流

z適當的操縱邊鞘流速，使中間流達到預期的寬度 (邊鞘流流速愈快，集中效果愈佳)

流式細胞/顆粒計數及分類感測器的操作原理則是利用水力所引發的流體聚焦效應(hydrodynamic focusing effect) 而進行細胞計數及分類，其基本結構由三條平行管道、噴嘴與集中流管道組成。

(26)

-101-

Pictures of a pre-focused 1 × 7 flow switch, fabricated on a quartz template (a) and then imprinted on PMMA substrates (b) using micromachining techniques and hot embossing

methods. The average depth of the microchannels is 40 μ m.

( a )

( b )

Lithography

Developing

Cr etching

PR stripping

Quartz etching (BOE 6:1) Quartz

UV

PR Cr film Photomask

-102-

微流體聚焦現象微流體聚焦現象

⎟⎟

⎠

⎞

⎜⎜

⎝

⎛ + + +

=

2 3 2 3 3 2 2 1 2 1 5 1 . 1

2

D D v v D

D v v

aD d

ρ ρ ρ

ρ

理論公式

d、D

₁

、D

₂

、D

₃

為細胞流集中寬度和1-3入口微管道寬度 v

₁

、 v

₂

、 v

₃

為流體入口微流管道之流速

ρ

_a

、ρ

₁

、ρ

₂

、ρ

₃

為出口流體和入口微管道1-3之流體密度

-103-

Port B: _and

Port A: _and

流量比

流量比 (flow- (flow -rate rate- -ratio) ratio)控制流向法控制流向法

-104-

流向導引部分：利用兩側邊鞘流不同的速度控制流向。

(27)

-105-

z

(a)圖下方為無微粒子時的訊號。

z

(a)圖上方為通過微粒子時的訊號

，其中每一峰值代表有一微粒子通過。

計數器不僅可計數，還可分辨不同粒子的大小。

國立台灣師範大學 機電科技學系

楊 啟 榮 博士

教 授

國立台灣師範大學 機電科技學系

Department of Mechatronic Technology National Taiwan Normal University

Tel: 02-7734-3506 E-mail:ycr@ntnu.edu.tw

非 非矽基微加工製程與應用技術 矽基微加工製程與應用技術

Non-Si-Based Micromachining Technology and its Applications in Microsystem Field

綱 綱 要 要

z LIGA與LIGA-Like製程與應用技術

z SIGA製程與應用技術

z 軟式微影製程與應用技術

z 非矽基微光學元件製作技術

LIGA與 LIGA 與LIGA LIGA- -Like Like製程與應用技術 製程與應用技術

*

MEMS領域中微製造技術分類表 MEMS 領域中微製造技術分類表

2. 顯影

4. 金屬模仁

6. 脫模

5.模造 3. 電鑄 1. 光刻

Li thographie:

G alvanoformung:

A bformung:

LIGA製程： LIGA 製程：

高深寬比 高深寬比( (high aspect high aspect ratio)

ratio)的微結構 的微結構

LIGA LIGA技術的起源與發展 技術的起源與發展

 LIG技術：

z1975年, Romankiw等人(IBM)結合X-ray 曝光及電鍍技術, 製作厚度20μm之高

 LIGA技術：

z1982年, 由德國W. Ehrfeld等人在Karlsruche Nuclear Research Center (KernForschungszentrum Karlsruhe, KfK)所發展

Forschungszentrum Karlsruhe (FZK), Institut für Mikrostrukturtechnik (IMT) z



U

heavy substance

light substance

medium substance Separation stage

UF

+H

supply

compressor dual separation nozzle

Principle of separation nozzle fabricated by FZK, Germany U

LIGA製程技術

Deep lithography

Alignment技術

LIGA LIGA製程技術的技術關聯圖 製程技術的技術關聯圖

犧牲層 犧牲層LIGA (S LIGA (S- -LIGA) LIGA)技術的應用範圍 技術的應用範圍

微感測器的懸浮結構

可控制流量進出的微閥門

各型微致動器的移動或轉動結構等…...

Micromotor Micropump

Acceleration microsensor

Key Features of X

Key Features of X- -ray LIGA Microstructures ray LIGA Microstructures

Realization of arbitrary shape

Extreme structure height (>mm)

Extreme aspect ratio (>100)

Minimum lateral dimensions 0.5±0.1μm

Surface roughness 0.03-0.05 μm

Vertical & smooth sidewalls

Wide variety of materials

Successful in mass fabrication

IMM IMM微系統研究中心所開發的產品 微系統研究中心所開發的產品

Source: http://www.imm-mainz.de

IMT微系統研究中心所開發的產品 IMT 微系統研究中心所開發的產品

Source: http://www.fzk.de/imt/eimt

LIGA

LIGA 製程 製程 vs. 類 vs. 類 LIGA 製程 LIGA 製程

光刻源的差異 LIGA 製程： 同步輻射X光

類LIGA 製程： 低成本替代性光源

X-ray 光罩製作複雜且成本高

Synchrotron Radiation Research Center (for LIGA process) Synchrotron Radiation Research Center (for LIGA process)

JAPAN SPring-8

USA APS FRANCE ESRF

ICP-RIE System Excimer Laser System UV mask aligner

Low- Low -cost Exposure System (for LIGA cost Exposure System (for LIGA- -like process) like process)

Instrument Technology Research Center, ITRC

Source: http://daytona.ca.sandia.gov/LIGA/mask.html ( Sandia National Laboratory, USA )

Photomask

Photomask of UV Lithography of UV Lithography

國立台灣師範大學機電科技學系

楊啟榮博士

教授

國立台灣師範大學機電科技學系

非非矽基微加工製程與應用技術矽基微加工製程與應用技術

綱綱要要

LIGA與 LIGA 與LIGA LIGA- -Like Like製程與應用技術製程與應用技術

高深寬比高深寬比( (high aspect high aspect ratio)

ratio)的微結構的微結構

LIGA LIGA技術的起源與發展技術的起源與發展

LIG技術：

LIGA技術：

LIGA LIGA製程技術的技術關聯圖製程技術的技術關聯圖

犧牲層犧牲層LIGA (S LIGA (S- -LIGA) LIGA)技術的應用範圍技術的應用範圍

IMM IMM微系統研究中心所開發的產品微系統研究中心所開發的產品

LIGA 製程製程 vs. 類 vs. 類 LIGA 製程 LIGA 製程

光刻源的差異 LIGA 製程：同步輻射X光

類LIGA 製程：低成本替代性光源

具厚膜光阻及電鑄起始層的試片製備方法具厚膜光阻及電鑄起始層的試片製備方法

準分子雷射加工高分子材料蘇聯氫彈試爆蘇聯氫彈試爆( (一九五三年八月一九五三年八月) )