未來展望

3. 在量測方面，儘管在 Pre-Simulation 與 Post-Simulation 時，通常可以實現所需的 性能，但是在量測時時常達不到模擬的規格。這可能是由於實際上元件的非線性 與未精確考量的量測環境所造成。因此在未來可以在設計時更注意電路元件的非 線性問題，並想辦法使之影響降低。量測環境方面，像是PCB 版的製作與設計，

都有很大的討論空間。

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