1. 以 SEM 及 EDS 分析 Sn-0.7Cu-xZn 與 Cu 基材銲接後之界面 之顯微組織，分析結果顯示 Sn-0.7Cu-xZn 合金銲接後之界面 反應層為扇貝狀之 Cu6Sn5介金屬化合物。銲錫組織係由 Sn 基地+Cu6Sn5介金屬化合物所組成。
2. 經
150°C高溫儲存試驗後可發現，Sn-0.7Cu銲點之接合界面
反應層，
會隨反應時間增加而成長，且延長處理時間至300
小時後，於界面反應層中會形成第二層界面反應物Cu
3Sn。
3. 經
150°C高溫儲存試驗後可發現，
Zn元素的添加可抑制Cu3Sn成長
，
Sn-0.7Cu-0.05Zn及Sn-0.7Cu-0.5Zn合金銲點經 500小時長時間高溫儲存後，界面反應層中不會形成Cu
3Sn，
具穩定界面反應層組織之能力，有助於提升合金銲點的高溫 信賴性。
4. 由銲點拉伸試驗結果得知 Zn 合金元素(0.05 及 0.5 wt.%)加 入使 Sn-0.7Cu 合金銲點平均強度由原本 28.95N 上升至 29.3N 及 30.2N
。經過 150℃高溫儲存 25~500 小時後，
Sn-0.7Cu-xZn合金之銲點強度則隨儲存時間增加而下降，但
添加 Zn 元素之銲鍚合金，銲點拉伸強度亦優於 Sn-0.7Cu 合金，顯示 Zn 元素添加有助於提升銲點強度和高溫長時間儲存之信賴性。
5.
Sn-0.7Cu-xZn合金銲接後之銲點在拉伸破斷後，其破斷面形 態均為渦穴狀組織之延性破壞，破斷位置位於銲錫材料中。Sn-0.7Cu合金銲點經高溫儲存25~100小時後，破斷位置仍發 生在銲錫處，然而經300~500小時儲存後，接合界面反應層 中形成之Cu3Sn介金屬化合物，造成銲點衰弱使破斷位置發 生在銲錫與反應界面層處，且銲點強度明顯下降。
6.
Sn-0.7Cu合金中添加Zn元素後，其銲點在銲接後以及高溫儲 存後，拉伸破斷均發生在銲錫材料區域，且在長時間高溫儲 存處理條件下銲點強度高於Sn-0.7Cu合金，顯示在Sn-0.7Cu 合金中添加微量的Zn元素，可以提升Sn-0.7Cu合金銲點在長 時間儲放或操作後的信賴性。參考文獻
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