• 沒有找到結果。

In this dissertation, several types of poly-Si NWTFT with MG configurations, including independent double-gate (DG), tri-gate (TG) and gate-all-around (GAA) were fabricated and characterized. In addition, various applications involving NVM and biosensors by using MG NWTFT are also demonstrated.

This dissertation comprises six chapters. Chapter 1 introduces the background and motivation of this study. Chapter 2 is basically an extension of our previous work [1-82], and more comprehensive investigation and understanding of physical phenomena in independent DG poly-Si NWTFT devices are discussed. Chapter 3 proposes a simple but novel method to fabricate MG NW devices. Chapter 4 shows and compares the impacts of MG configuration on the characteristics of poly-Si NW TFT-SONOS memory. Chapter 5 proposes and discusses a new sensor scheme using poly-Si NWTFT with extended-gate structure for various sensing applications. And Chapter 6 is the conclusions and suggested future work. The detailed content of each chapter is described as follows.

In Chapter 1, an overview of NWs and related potential applications are briefly introduced, including MG transistors, variability issues, NVM devices, and solid-state sensors. The motivation part describes the incentive of utilizing several modified schemes of poly-Si NWTFTs to deal with the problems existing in previous structures, and also to explore their capability for possible applications.

In Chapter 2, the characteristics of a poly-Si NWTFT device with an independent DG configuration under different operation modes are investigated and compared. In the device, the tiny NW channels are surrounded by an inverse-T-shaped gate and a top gate. It is found that the device under DG mode exhibits significantly

better performance in comparison with the two single-gate (SG) modes in terms of a higher current drive over the combined sum of the two SG modes and a smaller subthreshold swing (SS) of less than 100 mV/dec. Origins of such improvement are identified to be due to the elimination of the back-gate effect as well as an enhancement in the effective mobility with DG operation.

Moreover, the VTH fluctuation of poly-Si NWTFT devices is also studied in this chapter. The defects existing in the NW channels are identified as one of the major sources for the VTH fluctuation. The passivation of these defects by plasma treatment is shown to be effective for reducing the VTH fluctuation. It is also found that the fluctuation is closely related to the operation modes. When only one of the gates is employed as the driving gate to control the device‟s switching behavior, an optimum bias for the other gate can be found for minimizing the VTH fluctuation.

In Chapter 3, several types of poly-Si NWTFTs with various MG configurations are demonstrated and characterized. These devices were fabricated with simple methods without resorting to costly lithographic tools and processes. The fabricated tri-gated devices show a low subthreshold swing (SS) of around 100 mV/dec and on/off current ratio higher than 108. These results indicate the effectiveness of MG scheme in enhancing the device performance. Furthermore, the impact of MG on the variation of NWTFT characteristics is investigated with a clever method that allows the fabrication of test structures with identical NW channel but different gate configurations. The results show that the variation could be reduced by increasing the portion of NW channel surface that is modulated by the gate.

In Chapter 4, we propose a simple and novel way to fabricate poly-Si NW-SONOS devices with various gate configurations. Three types of devices having various gate configurations, namely, side-gated (SG), -shaped gated (G) and

gate-all-around (GAA), are successfully fabricated and characterized. The experimental results show that, owing to the superior gate controllability over NW channels, much improved transfer characteristics are achieved with the GAA devices as compared with the other types of devices. Moreover, GAA devices also exhibit the best memory characteristics among all splits, including the fastest P/E efficiency, largest memory window and best endurance/retention characteristics, highlighting the potential of such scheme for future SONOS applications.

In Chapter 5, results of the preliminary study using a novel NWFET sensing scheme featuring an extended sensing gate for various sensing purposes including pH sensing, gas sensing and bio-molecules detection are presented and described. In one of the embodiments of the proposed scheme, the NW channel is gated with two gates, namely, the SENSE-gate and the READ-gate. An antenna-like extended-gate structure acting as a sensing area is connected to the SENSE-gate of the NW device. During measurement the SENSE-gate is used for detecting the targets entities in the test solution. A change in the amount of sensing charges would promptly affect the characteristics of the NW devices which can be effectively monitored with the READ-gate. This scheme takes advantages of EGFET‟s effective isolation of device from chemical and biological environment, and NWFET‟s good switching properties.

The high manufacturability, low fabrication cost and improved reliability make this scheme extremely useful and potential for practical biosensor applications.

Finally, we summarize the conclusions and our major achievements, and also the suggested future work in Chapter 6.

References

[1.1] F. L. Yang, D. H. Lee, H. Y. Chen, C. Y. Chang, S. D. Liu, C. C. Huang, T. X.

Chung, H. W. Chen, C. C. Huang, Y. H. Liu, C. C. Wu, C. C. Chen, S. C. Chen, Y. T. Chen, Y. H. Chen, C. J. Chen, B. W. Chan, P. F. Hsu, J. H. Shieh, H. J.

Tao, Y. C. Yeo, Y. Li, J. W. Lee, P. Chen, M. S. Liang, and C. Hu, “5nm-Gate Nanowire FinFET,” Tech. Dig. VLSI Technol., pp.196-197 (2004).

[1.2] X. Duan, C. Niu, V. Sahi, J. Chen, J. W. Parce, S. Empedocles, and J. L.

Goldman, “High-Performance Thin-Film Transistors Using Semiconductor Nanowires and Nanoribbons,” Nature, vol. 425, pp.274-278 (2003).

[1.3] M. Specht, R. Kommling, L. Dreeskornfeld, W. Weher, F. Hofmann, D.

Alvarez, J. Kretz, R. J. Luyken, W. Rosner, H. Reisinger, E. Landgraf, T.

Schulz, J. Hartwich, M. Stadele,V. Klandievski, E. Hartmann, and L. Risch,

“Sub-40nm Tri-Gate Charge Trapping Nonvolatile Memory Cells for High-Density Applications,” VLSI Tech. Dig., pp.244-245 (2004).

[1.4] F. Patolsky and C. M. Lieber, “Nanowire Nanosensors,” Mater. Today, vol. 8, no. 4, pp.20-28 (2005).

[1.5] H. J. Lee, S. W. Ryu, J. W. Han, L. E. Yu, M. Im, C. Kim, S. Kim, E. Lee, K. H.

Kim, J. H. Kim, D. Bae, S. C. Jeon, K. H. Kim, G. S. Lee, J. S. Oh, Y. C. Park, W. H. Bae, J. J. Yoo, J. M. Yang, H. M. Lee, and Y. K. Choi, “A Nanowire Transistor for High Performance Logic and Terabit Non-Volatile Memory Devices,” VLSI Tech. Dig., pp.144-145 (2007).

[1.6] Y. Cui, Q. Wei, H. Park, and C. M. Lieber, “Nanowire Nanosensors for Highly Sensitive and Selective Detection of Biological and Chemical Species,”

Science, vol. 293, pp.1289-1292 (2001).

[1.7] H. C. Lin, M. F. Wang, F. J. Hou, H. N. Lin, C. Y. Lu, J. T. Liu, and T. Y.

Huang, “High-performance P-channel Schottky-Barrier SOI FinFET Featuring Self-Aligned PtSi Source/Drain and Electrical Junctions,” IEEE Electron Device Lett., vol. 24, pp.102-104 (2003).

[1.8] Michael D. Austin, Haixiong Ge, Wei Wu, Mingtao Li, Zhaoning Yu, D.

Wasserman, S. A. Lyon, and Stephen Y. Chou, “Fabrication of 5 nm Line-Width and 14nm Pitch Features by Nanoimprint Lithography,” Appl. Phys.

Lett., vol. 84, pp.2599-2601 (2004).

[1.9] H. L. Chen, C. H. Chen, and F. H. Ko, “Thermal-Flow Techniques for Sub-35 nm Contact-hole Fabrication in Electron-Beam Lithography,” J. Vac. Sci.

Technol. B, vol. 20, pp.2973-2978 (2002).

[1.10] F. H. Ko, H. C. You, T. C. Chu, T. F. Lei, C. C. Hsu, and H. L. Chen,

“Fabrication of Sub-60-nm Contact Holes in Silicon Dioxide Layers,”

Microelectronic Engineering, vol. 73-74, pp.323-329 (2004).

[1.11] Y. K. Choi, Ji. Zhu, J. Grunes, J. Bokor, and G. A. Somorjai, “Fabrication of Sub-10-nm Silicon Nanowire Arrays by Size Reduction Lithography,” J. Phys Chem. B, vol. 107, pp.3340-3343 (2003).

[1.12] X. Duan and C. M. Lieber, “General Synthesis of Compound Semiconductor Nanowires,” Adv. Mat., vol. 12, pp.298-302 (2000).

[1.13] J. T. Hu, T. W. Odom, and C. M. Lieber, “Chemistry and Physics in One-Dimension: Synthesis and Properties of Nanowires and Nanotubes,” Acc.

Chem. Res., vol. 32, no. 5, pp.435-445 (1999).

[1.14] H. F. Yan, Y. J. Xing, b, Q. L. Hang, D. P. Yu, Y. P. Wang, J. Xu, Z. H. Xi, and S. Q. Feng, “Growth of Amorphous Silicon Nanowires via a

Solid-Liquid-Solid Mechanism,” Chemical Physics Letters, vol. 323, pp.224-228, 16 June (2000).

[1.15] A. Persson, M. W. Larsson, S. Stenstrom, B. J. Ohlsson, L. Samuelson, and L.

R. Wallenberg, “Solid-Phase Diffusion Mechanism for GaAs Nanowire Growth,” Nat. Mater., vol. 3, pp.677-681 (2004).

[1.16] N. A. Sanford, L. H. Robins, M. H. Gray, Y.-S. Kang, J. E. Van Nostrand, C.

Stutz, R. Cortez, A. V. Davydov, A. Shapiro, I. Levin, and A. Roshko,

"Fabrication and Analysis of GaN Nanorods Grown by MBE," Phys. Status Solid. C, vol. 2, pp.2357-2360 (2005).

[1.17] N. Wang, Y. F. Zhang, Y. H. Tang, C. S. Lee, and S. T. Lee, “SiO2-Enhanced Synthesis of Si Nanowires by Laser Ablation,” Appl. Phys. Lett., vol. 73, pp.3902-3904 (1998).

[1.18] R. H. Yan, A. Ourmazd, and K. F. Lee. “Scaling the Si MOSFET: From Bulk to SOI to Bulk,” IEEE Trans. Electron Devices, vol. 39, no. 7, pp.1704-1710 (1992).

[1.19] H. S. P. Wong, D. J. Frank, and P. M. Solomon, “Device Design Considerations for Double-Gate, Ground-Plane, and Single-Gated Ultra-Thin SOI MOSFET‟s at the 25nm Channel Length Generation,” IEDM Tech. Dig., pp.407-410 (1998).

[1.20] D. Hisamoto, W. Lee, J. Kedzierski, E. Anderson, H. Takeuchi, K. Asana, T.

King, J. Bokor, and C. Hu, “A Folded Channel MOSFET for Deep-Sub-Tenth Micron Era,” IEDM Tech. Dig., pp.1032-1034 (1998).

[1.21] N. Lindert, L. Chang, Y. K. Choi, E. H. Anderson, W. C. Lee, T.-J. King, J.

Bokor, and C. Hu, “Sub-60-nm Quasi-planar FinFETs Fabricated Using a

Simplified Process,” IEEE Electron Device Lett., vol. 22, pp.487-489 (2001).

[1.22] B. Doyle, B. Boyanov, S. Datta, M. Doczy, S. Hareland, B. Jin, J. Kavalieros, T.

Linton, R. Rios, and R. Chau, “Tri-Gate Fully-depleted CMOS Transistors:

Fabrication, Design and Layout,” Tech. Dig. VLSI Technol., pp.133-134 (2003).

[1.23] F. L. Yang, H. Y. Chen, F. C. Chen, C. C. Huang, C. Y. Chang, H. K. Chiu, C.

C. Lee, C. C. Chen, H. T. Huang, C. J. Chen, H. J. Tao, Y. C. Yeo, M. S. Liang, and C. Hu, “25nm CMOS Omega FETs,” IEDM Tech. Dig., pp.255-258 (2002).

[1.24] N. Singh, A. Agarwal, L. K. Bera, T. Y. Liow, R. Yang, S. C. Rustagi, C. H.

Tung, R. Kumar, G. Q. Lo, N. Balasubramanian, and D. L. Kwong, “High-Performance Fully Depleted Silicon Nanowire (Diameter ≤ 5nm) Gate-All-Around CMOS Devices,” IEEE Electron Device Lett., vol. 27, no. 5, pp.383–

386 (2006).

[1.25] H. Riel, “Nanowire Field Effect Transistors - Where Do They Belong To?” in SINANO-NANOSIL Workshop (2010).

[1.26] T. Hiramoto, T. Nagumo, T. Ohtou, and K. Yokoyama, “Device Design of Nanoscale MOSFETs Considering the Suppression of Short Channel Effects and Characteristics Variations,” IEICE Trans. Electronics, vol. E90-C, pp.836-841 (2007).

[1.27] R. Wang, H. Liu, R. Huang, J. Zhuge, L. Zhang, D. W. Kim, X. Zhang D. Park, and Y. Wang, “Experimental Investigations on Carrier Transport in Si Nanowire Transistors: Ballistic Efficiency and Apparent Mobility,” IEEE Trans.

Electron Devices, vol. 55, no. 11, pp.2960-2967 (2008).

[1.28] K. Bourzac, “How Three-Dimensional Transistor Went from Lab to Fab,”

Technology Review, MIT Publishing, May 6th (2011).

[Online]: http://www.technologyreview.com/computing/37536/?mod=related [1.29] W. Haensch, E. J. Nowak, R. H. Dennard, P. M. Solomon, A. Bryant, O. H.

Dokumaci, A. Kumar, X. Wang, J. B. Johnson, and M. V. Fischetti, “Silicon CMOS Devices Beyond Scaling,” IBM Journal of Research and Development, vol. 50, pp.339-361 (2006).

[1.30] K. J. Kuhn, M. D. Giles, D. Becher, P. Kolar, A. Kornfeld, R. Kotlyar, S. T. Ma, A. Maheshwari, and S. Mudanai, “Process Technology Variation,” IEEE Trans.

Electron Devices, vol. 58, no. 8, pp.2197-2208 (2011).

[1.31] S. G. Narendra, “Effect of MOSFET Threshold Voltage Variation on High-Performance Circuit,” Ph. D. Dissertation, Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, MA, US (2002).

[1.32] L. Capodieci, “From Optical Proximity Correction to Lithography-Driven Physical Design (1996–2006): 10 Years of Resolution Enhancement Technology and the Roadmap Enablers for the Next Decade,” Proc. SPIE, vol.

6154, p. 615401 (2006).

[1.33] A. Asenov, S. Kaya, and A. R. Brown. “Intrinsic Parameter Fluctuations in Decananometer MOSFETs Introduced by Gate Line Edge Roughness,” IEEE Trans. Electron Devices, vol. 50, no. 5, pp.1254-1260 (2003).

[1.34] A. Asenov, S. Kaya, and J. H. Davies, “Intrinsic Threshold Voltage Fluctuations in Decanano MOSFETs Due to Local Oxide Thickness Variations,”

IEEE Trans. Electron Devices, vol. 49, no. 1, pp.112-119 (2002).

[1.35] H. C. Wen, H. R. Harris, C. D. Young, H. Luan, H. N. Alshareef, K. Choi, D.-L.

Kwong, P. Majhi, G. Bersuker, and H. Lee, “On Oxygen Deficiency and Fast

Transient Charge-Trapping Effects in High-k Dielectrics,” IEEE Electron Device Lett., vol. 27, no. 12, pp.984-987 (2006).

[1.36] A. R. Brown, G. Roy, and A. Asenov, “Poly-Si-Gate-Related Variability in Decananometer MOSFETs with Conventional Architecture,” IEEE Trans.

Electron Devices, vol. 54, no. 11, pp.3056-3063 (2007).

[1.37] Y. Zhang, J. Li, M. Grubbs, M. Deal, B. Magyari-Kope, B. M. Clemens, and Y.

Nishi, “Physical Model of the Impact of Metal Grain Work Function Variability on Emerging Dual Metal Gate MOSFETs and Its Implication for SRAM Reliability,” IEDM Tech. Dig., pp.57-60 (2009).

[1.38] L.-T. Pang, K. Qian, C. J. Spanos, and B. Nikolic, “Measurement and Analysis of Variability in 45-nm Strained-Si CMOS Technology,” IEEE J. Solid-State Circuits, vol. 44, no. 8, pp.2233-2243 (2009).

[1.39] K. Takeuchi, T. Fukai, T. Tsunomura, A. T. Putra, A. Nishida, S. Kamohara, and T. Hiramoto, “Understanding Random Threshold Voltage Fluctuation by Comparing Multiple Fabs and Technologies,” IEDM Tech. Dig., pp.467-470 (2007).

[1.40] A. Asenov, “Random Dopant Induced Threshold Voltage Lowering and Fluctuations in Sub-0.1-μm MOSFETs: A 3-D „Atomistic Simulation Study‟,”

IEEE Trans. Electron Devices, vol. 45, no. 12, pp.2505-2513 (1998).

[1.41] K. Takeuchi, “Channel Size Dependence of Dopant-Induced Threshold Voltage Fluctuation,” Tech. Dig. VLSI Technol., pp.72-73 (1998).

[1.42] O. Weber, O. Faynot, F. Andrieu, C. Buj-Dufournet, F. Allain, P. Scheiblin, J.

Foucher, N. Daval, D. Lafond, L. Tosti, L. Brevard, O. Rozeau, C. Fenouillet-Beranger, M. Marin, F. Boeuf, D. Delprat, K. Bourdelle, B.-Y. Nguyen, and S.

Deleonibus, “High Immunity to Threshold Voltage Variability in Undoped Ultrathin FDSOI MOSFETs and Its Physical Understanding,” IEDM Tech.

Dig., pp.245-248 (2008).

[1.43] S. Lai, “Flash Memories: Successes and challenges,” IBM Journal of Research and Development, vol. 52, no. 4/5, pp.529-535 (2008).

[1.44] K. Kim, “Future Memory Technology: Challenges and Opportunities,” Tech.

Dig. VLSI Technology Systems, and Applications, pp.5-9 (2008).

[1.45] K. Naruke, S. Taguchi, and M. Wada, “Stress Induced Leakage Current Limiting to Scale Down EEPROM Tunnel Oxide Thickness”, IEDM Tech. Dig., pp.424-427 (1988).

[1.46] M. Noguchi, T. Yaegashi, H. Koyama, M. Morikado, Y. Ishibashi, S. Ishibashi, K. Ino, K. Sawamura, T. Aoi, T. Maruyama, A. Kajita, E. Ito, M. Kishida, K.

Kanda, K. Hosono, S. Miyamoto, F. Ito, Y. Hirata, G. Hemink, M. Higashitani, A. Mak, J. Chan, M. Koyanagi, S. Ohshima, H. Shibata, H. Tsunoda, and S.

Tanaka “A High-Performance Multi-level NAND Flash Memory with 43nm-node Floating-Gate Technology,” IEDM Tech. Dig., pp.445-448 (2007).

[1.47] S. Lai, “Non-Volatile Memory Technologies: The Quest for Ever Lower Cost,”

IEDM Tech. Dig., pp.11-16 (2008).

[1.48] K. Kim, “From the Future Si Technology Perspective: Challenges and Opportunities,” IEDM Tech. Dig., pp.1-9 (2010).

[1.49] K. Kim and J. Choi, “Future Outlook of NAND Flash Technology for 40nm Node and Beyond,” Non-Volatile Semiconductor Memory Workshop, pp.9-11 (2006).

[1.50] M. H. White, D. A. Adams, and J. Bu, “On the Go with SONOS,” IEEE

Circuits & Devices, pp.22-31 (2000).

[1.51] Z. Liu, C. Lee, V. Narayanan, G. Pei, and E. C. Kan, “Metal Nanocrystal Memories - Part I: Device Design and Fabrication,” IEEE Trans. Electron Devices, vol. 49, no. 9, pp.1606-1613 (2002).

[1.52] C. H. Lee, K. I. Choi, M. K. Cho, Y. H. Song, K. C. Park, and K. Kim, “A Novel SONOS Structure of SiO2/SiN/Al2O3 with TaN Metal Gate for Multi-Giga Bit Flash Memories,” IEDM Tech. Dig., pp.11-16 (2003).

[1.53] H. T. Lue, S. Y. Wang, E. K. Lai, Y. H. Shih, S. C. Lai, L. W. Yang, K. C. Chen, J. Ku, K. Y. Hsieh, R. Liu, and C. Y. Lu, “BE-SONOS: A Bandgap Engineered SONOS with Excellent Performance and Reliability,” IEDM Tech. Dig., pp.547-550 (2005).

[1.54] Sung Dae Suk, Kyoung Hwan Yeo, Keun Hwi Cho, Ming Li, Yun young Yeoh, Ki-Ha Hong, Sung-Han Kim,Young-Ho Koh, Sunggon Jung, WonJun Jang, Dong-Won Kim, Donggun Park, and Byung-Il Ryu, “Gate-All-Around Twin Silicon Nanowire SONOS Memory,” Tech. Dig. VLSI Technol., pp.142-143 (2007).

[1.55] K. H. Yeo, K. H. Cho, M. Li, S. D. Suk, Y. Yeoh, M. S. Kim, H. Bae, J. M. Lee, S. K. Sung, J. Seo, B. Park, D. W. Kim, D. Park, and W. S. Lee, “Gate-All-Around Single Silicon Nanowire MOSFET with 7 nm Width for SONOS NAND Flash Memory,” Tech. Dig. VLSI Technol., pp.138-139 (2008).

[1.56] B. Lei, C. Li, D. Zhang, Q. F. Zhou, K. K. Shung, and C. Zhoua “Nanowire Transistors with Ferroelectric Gate Dielectrics: Enhanced Performance and Memory Effects,” Appl. Phys. Lett. vol. 84, pp.4553-4555 (2004).

[1.57] J. D. Blauwe, “Nanocrystal Nonvolatile Memory Devices,” IEEE Trans. on

Nanotechnology, vol. 1, pp.72-77 (2002).

[1.58] X. Duan, Y. Huang, and C. M. Lieber, “Nonvolatile Memory and Programmable Logic from Molecule-Gated Nanowires,” Nano Letters, vol. 2, no.5, pp.487-490 (2002).

[1.59] S. M. Jung, J. Jang, W. Cho, H. Cho, J. Jeong, Y. Chang, J. Kim Y. Rah, Y. Son, J. Park, M. S. Song, K. H. Kim, J. S. Lim and K. Kim, “Three Dimensionally Stacked NAND Flash Memory Technology Using Stacking Single Crystal Si Layers on ILD and TANOS Structure for Beyond 30nm Node,” IEDM Tech.

Dig., pp. 37-40 (2006).

[1.60] E. K. Lai, H. T. Lue, Y. H. Hsiao, J. Y. Hsieh, C. P. Lu, S. Y. Wang, L. W. Yang, T. Yang, K. C. Chen, J. Gong, K. Y. Hsieh, R. Liu, and C. Y. Lu, “A Multi-Layer Stackable Thin-Film Transistor (TFT) NAND-Type Flash Memory,”

IEDM Tech. Dig., pp. 41-44 (2006).

[1.61] A. J. Walker, S. Nallamothu, E. -H. Chen, M. Mahajani, S. B. Herner, M. Clark, J. M. Cleeves, S. V. Dunton, V. L. Eckert, J. Gu, S. Hu, J. Knall, M. Konevecki, C. Petti, S. Radigan, U. Raghuram, J. Vienna, M. A. Vyvoda, “3D TFT-SONOS Memory Cell for Ultra-high Density File Storage Applications,” Tech. Dig.

VLSI Technol., pp.29-30 (2003).

[1.62] Y. Fukuzumi, R. Katsumata, M. Kito, M. Kido, M. Sato, H. Tanaka, Y. Nagata, Y. Matsuoka, Y. Iwata, H. Aochi and A. Nitayama, “Optimal Integration and Characteristics of Vertical Array Devices for Ultra-High Density, Bit-Cost Scalable Flash Memory,” IEDM Tech. Dig., pp.449-452 (2007).

[1.63] R. Katsumata, M. Kito, Y. Fukuzumi, M. Kido, H. Tanaka, Y. Komori, M.

Ishiduki, J. Matsunami, T. Fujiwara, Y. Nagata, L. Zhang, Y. Iwata, R.

Kirisawa, H. Aochi, and A. Nitayama, “Pipe-Shaped BiCS Flash Memory with 16 Stacked Layers and Multi-Level-Cell Operation for Ultra High Density Storage Devices,” Tech. Dig. VLSI Technol., pp.136-137 (2009).

[1.64] M. Kimura and K. Toshima, “Thermistor-Like PN Junction Temperature-Sensor with Variable Sensitivity and Its Combination with a Micro-Air-Bridge Heater,” Sensors and Actuators A-Physical, vol. 108, pp.239-243 (2003).

[1.65] Y. G. Vlasov, Y. A. Tarantov, and P. V. Bobrov, “Analytical Characteristics and Sensitivity Mechanisms of Electrolyte-Insulator-Semiconductor System-Based Chemical Sensors - A Critical Review,” Anal Bioanal Chem, vol. 376, pp.788-796 (2003).

[1.66] D. Grieshaber, R. MacKenzie, J. Voros, and E. Reimhult, “Electrochemical Biosensors - Sensor Principles and Architectures,” Sensors, vol. 8, pp.1400-1458 (2008).

[1.67] P. Bergveld, “Development of an Ion-Sensitive Solid-State Device for Neurophysiological Measurements”, IEEE Trans. Biomed. Eng., BME-17, pp.70-71(1970).

[1.68] P. Bergveld, “Thirty years of ISFETOLOGY - What Happened in the Past 30 Years and What May Happen in the Next 30 Years”, Sens. Actuators B, vol. 88, pp.1-20 (2003).

[1.69] S. Caras and J. Janata, “Field-Effect Transistor Sensitive to Penicillin,”

Analytical Chemistry, vol. 52, pp.1935–1937 (1980).

[1.70] Chia-Ming Yang, “ISFET/REFET with Inorganic and Organic Ion-sensitive Membranes”, Ph. D. Dissertation, Department of Electronic Engineering, Chang Gung University,Taoyuan, Taiwan, ROC, p.11 (2005).

[1.71] J. Van der Spiegel, I. Lauks, P. Chan, and D. Babic, “The Extended Gate Chemical Sensitive Field Effect Transistor as Multi-Species Microprobe,”

Sensors and Actuators B, vol. 4, pp.291–298 (1983).

[1.72] M. M.-C. Cheng, G. Cuda, Y. L. Bunimovich, M. Gaspari, J. R. Heath, H. D.

Hill, C. A. Mirkin, A. J. Nijdam, R. Terracciano, T. Thundat, and M. Ferrari,

“Nanotechnologies for Biomolecular Detection and Medical Diagnostics,”

Curr. Opin. Chem. Biol., vol. 10, no. 1, pp.11-19 (2006).

[1.73] F. Patolsky, G. Zheng, and C. M. Lieber, “Nanowire-Based Biosensors,” Anal.

Chem., vol. 78, no. 13, pp.4260-4269 (2006).

[1.74] M. Curreli, R. Zhang, F. N. Ishikawa, H. K. Chang, R. J. Cote, C. Zhou, and M.

E. Thompson, “Real-Time, Label-Free Detection of Biological Entities Using Nanowire-Based FETs,” IEEE Trans. on Nanotechnology, vol. 7, no. 6 pp.651-667 (2008).

[1.75] W. U. Wang, C. Chen, K.-H. Lin, Y. Fang, and C. M. Lieber, “Label-Free Detection of Small Molecule Protein Interactions by Using Nanowire Nanosensors,” Proc. Nat. Acad. Sci. U.S.A., vol. 102, no. 9, pp.3208-3212 (2005).

[1.76] J.-I. Hahm and C. M. Lieber, “Direct Ultrasensitive Electrical Detection of DNA and DNA Sequence Variations Using Nanowire Nanosensors,” Nano Lett., vol. 4, no. 1, pp.51-54 (2004).

[1.77] F. Patolsky, G. Zheng, O. Hayden, M. Lakadamyali, X. Zhuang, and C. M.

Lieber, “Electrical Detection of Single Viruses,” Proc. Nat. Acad. Sci. U.S.A., vol. 101, no. 39, pp.14017-14022 (2004).

[1.78] J. F. Klemic, E. Stern, and M. A. Reed, “Hotwiring Biosensors,” Nat.

Biotechnol., vol. 19, no. 10, pp.924-925 (2001).

[1.79] H. C. Lin, M. H. Lee, C. J. Su, T. Y. Huang, C. C. Lee, and Y. S. Yang, “A Simple and Low-Cost Method to Fabricate TFTs with Poly-Si Nanowire Channel,” IEEE Electron Device Lett., vol. 26, no. 9, pp.643-645 (2005).

[1.80] H. C. Lin, M. H. Lee, C. J. Su, and S. W. Shen, “Fabrication and Characterization of Nanowire Transistors with Solid-Phase Crystallized Poly-Si Channels,” IEEE Trans. Electron Devices, vol. 53, no. 10, pp.2471-2477 (2006).

[1.81] C. J. Su, H. C. Lin and T. Y. Huang, “High-Performance TFTs with Si Nanowire Channels Enhanced by Metal-Induced Lateral Crystallization,”

IEEE Electron Device Lett., vol. 27, pp.582-584 (2006).

[1.82] H. H. Hsu, “Fabrication and Characterizations of Poly-Si Nanowire Thin-Film Transistor and SONOS Memory Featuring Inverse-T Gate,” Thesis, Department of Electronics Engineering and Institute of Electronics, National Chiao Tung University, Hsinchu, Taiwan, ROC (2008).

Fig. 1-1 Schematic structures and energy band diagrams of planar single-gated MOSFET (left) and gate-all-around (GAA) NW MOSFET (right).

Apparently the GAA NW structure can provide much better electrostatic control to prevent the lateral electric field penetrating from the drain into the channel region [1.25].

Fig. 1-2 Evolution of the new transistor structure to improve the electrostatics of a MOSFET [1.26].

Fig. 1-3 Schematics of conventional transistor with a top-mounted gate (left) and Intel’s tri-gate transistors with body-tied Si-fin structure (right) [1.28].

Fig. 1-4 Cross-sectional TEM images of gate-all-around twin silicon nanowire SONOS memory [1.54].

Fig. 1-5 Cross-sectional TEM images of (a) Tri-gate structure of the TFT device, (b) Channel-length direction of double-layer TFT NAND devices [1.60].

Fig. 1-6 Schematic cross-section of Toshiba’s BiCS flash memory (right) and its vertical SONOS cell (left) [1.62, 1.63].

Fig. 1-8 Table of ISFET, ChemFET and EnFET structures, detectable analytes, and sensitive membranes with bio-receptors [1.70].

Fig. 1-7 Schematic representation of (a) MOSFET and (b) ISFET [1.68].

Fig. 1-9 An illustrative representation of a sensor scheme built on extended gate field-effect transistor (EGFET).

Fig. 1-10 Size of several nano-materials as compared to the size of some biological entities, such as nucleic acids, proteins, virus, and cells [1.74].

S D

Gate

Sensing FET Sensing Membrane

相關文件